Low cost, high performance RF connector

• US 9,583,853 B2
• Filed: 06/28/2013
• Issued: 02/28/2017
• Est. Priority Date: 06/29/2012
• Status: Active Grant

• Current Assignee: Amphenol Corporation
• Original Assignee: Amphenol Corporation
• Inventors: Cartier, Marc B. Jr., Manter, David, Atkinson, Prescott B., Stokoe, Philip T., Cohen, Thomas S., Gailus, Mark W.
• Primary Examiner(s): Takaoka, Dean
• Assistant Examiner(s): Wong, Alan
• Application Number:
  US13/930,447
• Publication Number:
  US 20140004726A1
• Time in Patent Office: 1,341 Days
• Field of Search: 333/260, 439/607.01, 439/607.05
• US Class Current: 1/1
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H01R 12/712 co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit H01R12/72 takes precedence
• CPC Class Codes: H01R 13/6587 for mounting on PCBs
• CPC Class Codes: H01R 43/20 for assembling or disassembling contact members with insulating base, case or sleeve
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

Claims

1. An electrical connector module adapted for RF signals, comprising:

a lead frame providing a coplanar waveguide structure, the lead frame comprising;

at least one signal conductor; and

a plurality of ground conductors disposed adjacent the at least one signal conductor, wherein the conductors are arranged in an order comprising a first ground conductor of the plurality of ground conductors, the at least one signal conductor, and a second ground conductor of the plurality of ground conductors; and

at least one shield member parallel to the lead frame; and

at least one lossy region, each lossy region adjacent to a ground conductor of the plurality of ground conductors and adjacent and in contact with a planar shield member of the at least one planar shield members,

wherein greater than 85% of the energy of an RF signal propagates along the coplanar waveguide structure.

2. The electrical connector module of claim 1, wherein:

a shield member of the at least one shield member comprises an opening therethrough; and

the at least one lossy region extends through the opening.

3. The electrical connector module of claim 1, wherein:

the lead frame is shaped to provide an impedance between 45Ω and

85Ω

over a frequency range of 3 GHz to 6 GHz.

4. The electrical connector module of claim 1, wherein:

the at least one shield member parallel to the lead frame comprises a first shield member disposed on a first side of the lead frame and a second shield member disposed on a second side of the lead frame.

5. The electrical connector module of claim 4, wherein:

the first shield member and the second shield member are spaced from the lead frame by a distance such that the primary mode of propagation of an RF signal on the signal conductor is between the signal conductor and the plurality of ground conductors.

6. The electrical connector module of claim 4, wherein:

the electrical connector module further comprises an insulative housing with an intermediate portion of the lead frame being disposed within the insulative housing and a mating contact portion of the lead frame extending from the insulative housing, the housing comprising a first surface and a second surface;

the first shield member comprises a first portion mounted adjacent the first surface and second portion extending beyond the insulative housing adjacent the mating contact portion of the lead frame; and

the second shield member comprises a third portion mounted adjacent the second surface and a fourth portion extending beyond the insulative housing adjacent the mating contact portion of the lead frame.

7. The electrical connector module of claim 6, wherein:

the second portion of the first shield member comprises a first tab extending from the first shield member towards a ground conductor of the plurality of ground conductors; and

the fourth portion of the second shield member comprises a second tab extending from the first shield member towards the ground conductor.

8. The electrical connector module of claim 6, further comprising:

a plurality of lossy regions extending through the electrical connector module, the plurality of lossy regions being coupled to the first shield member, the second shield member and the plurality of ground conductors.

9. The electrical connector module of claim 1, wherein:

the at least one signal conductor comprises a first signal conductor and a second signal conductor; and

each of the first signal conductor and second signal conductor comprises a press-fit contact tail.

10. The electrical connector module of claim 1 in combination with a printed circuit board, wherein:

each of the at least one signal conductor comprises a contact tail extending from the electrical connector module;

each of the plurality of ground conductors comprises at least one contact tail extending from the electrical connector module;

the printed circuit board comprises;

a matrix material having a first dielectric constant;

a first plated via;

a plurality of second plated vias, the second plated vias disposed around the first plated via and aligned with the at least one contact tails extending from the plurality of ground conductors when the contact tail of the signal conductor is aligned with the first plated via; and

a plurality of third vias, disposed in a region between the first plated and the second plated vias, the third vias being filled with a material having a second dielectric constant, different than the first dielectric constant.

11. The electrical connector module in the combination of claim 10, wherein:

the third vias are un-plated.

12. The electrical connector module in the combination of claim 11, wherein:

the third vias are filled with air.

13. The electrical connector module of claim 1, wherein a separation distance between the at least one signal conductor and the at least one shield member is 0.5 mm or greater.

14. The electrical connector module of claim 1, wherein:

the at least one shield member comprises two shield members; and

the lead frame is centered between the two shield members.

15. An electrical connector module comprising:

a lead frame providing a coplanar waveguide structure, the lead frame comprising;

a signal conductor; and

a plurality of ground conductors disposed adjacent the signal conductor;

at least one shield member parallel to the lead frame; and

at least one lossy region, each lossy region adjacent to a ground conductor of the plurality of ground conductors and adjacent to a planar shield member of the at least one planar shield members;

wherein;

a shield member of the at least one shield member comprises an opening therethrough; and

the at least one lossy region extends through the opening;

the electrical connector module further comprises an insulative housing with at least an intermediate portion of the lead frame being disposed within the insulative housing, the housing comprising a surface;

the at least one lossy region extends through the surface; and

the shield member is adjacent the surface.

16. The electrical connector module of claim 15, wherein:

the shield member is held against the surface by an interference fit with the at least one lossy region.

17. The electrical connector module of claim 16, wherein:

each of the plurality of ground conductors is in contact with a lossy region of the at least one lossy region.

18. The electrical connector module of claim 16, wherein:

the surface is a first surface;

the insulative housing comprises a second surface;

the shield member is a first shield member;

the at least one shield member comprises a second shield member;

the at least one lossy region extends through the second surface; and

the second shield member is held against the second surface via an interference fit with the at least one lossy region.

19. The electrical connector module of claim 18, wherein:

the at least one lossy region is positioned to suppress parallel plate modes between the first shield member and the second shield member.

20. The electrical connector module of claim 18, wherein:

the at least one lossy region is positioned such that it suppresses non-TEM modes between the signal and ground conductors.

21. The electrical connector module of claim 18, wherein:

the at least one lossy region is positioned such that it extends the coplanar waveguide bandwidth.

22. The electrical connector module of claim 15, wherein:

the signal conductor is adapted for carrying RF signals.

23. An electrical connector module adapted for RF signals, comprising:

a lead frame providing a plurality of coplanar waveguide structures, the lead frame comprising;

a plurality of first type conductors, each first type conductor having a width less than a first width; and

a plurality of second type conductors, each of the second type conductors having a width greater than a second width, the second width being greater than the first width, wherein each first type conductor is disposed between and adjacent to two second type conductors, such that the conductors are disposed in an order comprising a first second type conductor of the plurality of second type conductors, a first type conductor, and a second second type conductor of the plurality of second type conductors; and

a plurality of lossy regions, each lossy region coupled to a second type conductor,

wherein greater than 85% of the energy of an RF signal propagates along the plurality of coplanar waveguide structures.

24. The electrical connector module of claim 23, further comprising:

a first planar conductive member parallel to the lead frame, the first planar conductive member being position on a first side of the lead frame; and

a second planar conductive member parallel to the lead frame, the second planar conductive member being position on a second side of the lead frame,

wherein the first planar conductive member and the second planar conductive member are each coupled to lossy regions of the plurality of lossy regions.

25. The electrical connector module of claim 24, further comprising:

an insulative housing having a first surface and a second surface,

wherein;

the insulative housing surrounds an intermediate portion of the lead frame;

each of the plurality of lossy regions extends through the first surface and the second surface of the insulative housing;

the first planar conductive members engages the plurality of lossy regions extending through the first surface such that the first planar conductive member is held against the first surface; and

the second planar conductive members engages the plurality of lossy regions extending through the second surface such that the second planar conductive member is held against the second surface.

26. The electrical connector module of claim 23, wherein:

each of the first type conductors is spaced from the plurality of second type conductors by a distance that provides an impedance on the first type signal conductors between 45Ω and

85Ω

over a frequency range of 3 GHz to 6 GHz.

27. The electrical connector module of claim 26, wherein the impedance of each first type conductor is 45Ω

to 55Ω

over the frequency range of 3 GHz to 6 GHz.

28. The electrical connector module of claim 26, wherein the impedance of each first type signal conductor is 65Ω

to 85Ω

over the frequency range of 3 GHz to 6 GHz.

29. The electrical connector module of claim 23, wherein:

each first type conductor has a width between 0.2 mm and 0.45 mm; and

each first type conductor is spaced from each adjacent second type conductor by a spacing between 0.35 mm and 0.75 mm, whereby a coplanar wave guide tuned for RF signals is provided.

30. An electrical connector module adapted for RF signals, comprising:

a lead frame providing a plurality of coplanar waveguide structures, the lead frame comprising;

a plurality of first type conductors, each first type conductor having a width less than a first width; and

a plurality of second type conductors, each of the second type conductors having a width greater than a second width, the second width being greater than the first width, wherein each first type conductor is disposed between and adjacent to two second type conductors, and

a plurality of lossy regions, each lossy region coupled to a second type conductor;

a first planar conductive member parallel to the lead frame, the first planar conductive member being position on a first side of the lead frame; and

a second planar conductive member parallel to the lead frame, the second planar conductive member being position on a second side of the lead frame,

wherein;

the first planar conductive member and the second planar conductive member are each coupled to lossy regions of the plurality of lossy regions; and

each first type conductor is spaced from each of the first planar conductive member and the second planar conductive member by a distance of at least 0.5 mm,

whereby less than 1% of the energy of an RF signal of a frequency of 1-3 GHz propagates in a parallel plate mode.