Stretchable electronic patch having a foldable circuit layer

• US 9,585,245 B2
• Filed: 06/02/2016
• Issued: 02/28/2017
• Est. Priority Date: 12/05/2014
• Status: Active Grant

• Current Assignee: Vivalnk Inc.
• Original Assignee: Vivalnk Inc.
• Inventors: Li, Jiang, Mei, Junfeng
• Primary Examiner(s): VO, TUYEN KIM
• Application Number:
  US15/171,510
• Publication Number:
  US 20160278204A1
• Time in Patent Office: 271 Days
• Field of Search: 235/375, 235/451, 235/488, 235/492
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/046 in a matrix array
• CPC Class Codes: A61B 5/6823 Trunk, e.g., chest, back, abdomen, hip
• CPC Class Codes: A61B 5/6824 Arm or wrist
• CPC Class Codes: A61B 5/6825 Hand
• CPC Class Codes: A61B 5/6828 Leg
• CPC Class Codes: A61B 5/6829 Foot or ankle
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: H04B 1/385 Transceivers carried on the body, e.g. in helmets
• CPC Class Codes: H04B 2001/3866 carried on the head
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10022 Non-printed resistor
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 2201/10174 : Diode
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0014 : Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor

Abstract

An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Claims

1. An electronic patch, comprising:

a substrate comprising;

a first flat portion;

a second flat portion; and

an undulated ribbon that connects the first flat portion and the second flat portion, wherein the undulated ribbon is undulated in a direction perpendicular to the first flat substrate or the second flat substrate, wherein the undulated ribbon is above and below the first flat substrate and the second flat substrate;

a first conductive circuit on the first flat portion of the substrate;

a second conductive circuit on the second flat portion of the substrate;

a third conductive circuit on the undulated ribbon, wherein the third conductive circuit is connected with the first conductive circuit and the second conductive circuit; and

an elastic layer that encloses the substrate, the first conductive circuit, the second conductive circuit, and the third conductive circuit.

2. The electronic patch of claim 1, wherein the undulated ribbon is configured to unfold and elongate in responses a user'"'"'s movement when the electronic patch is worn by the user.

3. The electronic patch of claim 1, wherein the undulated ribbon has serpentine or zigzag shape that includes turns, folds, or loops out of a plane of the first flat substrate or the second flat substrate.

4. The electronic patch of claim 1, wherein the first flat portion and the second flat portion of the substrate are parallel to each other.

5. The electronic patch of claim 1, further comprising:

multiple undulated ribbons that are connected the first flat portion and the second flat portion, wherein the multiple undulated ribbons define at least one opening therein.

6. The electronic patch of claim 1, wherein the elastic layer comprises an elastomeric material or a viscoelastic polymeric material.

7. The electronic patch of claim 1, wherein the undulated ribbon is formed by a flexible material.

8. The electronic patch of claim 1, further comprising:

one or more semiconductor chips on the first flat portion, the second flat portion, or a combination thereof, wherein the one or more semiconductor chips are in connection with the first conductive circuit and the second conductive circuit.

9. The electronic patch of claim 8, wherein the one or more semiconductor chips in conjunction with the first conductive circuit or the second conductive circuit are configured to wirelessly communicate with an external device.

10. The electronic patch of claim 8, wherein at least one of the first conductive circuit or the second conductive circuit includes an antenna circuit configured to receive or transmit wireless signals.

11. The electronic patch of claim 8, wherein the one or more semiconductor chips in conjunction with the first conductive circuit or the second conductive circuit are configured to wirelessly communicate with an external device based on near field communication (NFC), Wi-Fi, Bluetooth, or RFID wireless communication standard.

12. The electronic patch of claim 1, further comprising:

an adhesive layer under the elastic layer and configured to adhere to a user'"'"'s skin.

13. The electronic patch of claim 1, further comprising:

one or more sensors, actuators, or chemical delivery devices in connection with the first conductive circuit and the second conductive circuit.

14. The electronic patch of claim 1, wherein at least one of the first conductive circuit or the second conductive circuit comprises one or more electronic components selected from the group consisting of capacitors, inductors, resistors, metal pads, diodes, transistors, and amplifiers.

15. A method for fabricating an electronic patch, comprising:

pressing a flat substrate by a pair of molds, wherein the flat substrate comprises a first flat portion, a second flat portion, and a flat middle portion, wherein the molds have undulated contours corresponding to the middle portion, wherein the flat substrate comprises a first conductive circuit on the first flat portion of the substrate, a second conductive circuit on the second flat portion of the substrate, a third conductive circuit on the flat middle portion of the substrate;

transforming the flat middle portion of the substrate into an undulated ribbon that is undulated in a direction perpendicular to the first flat substrate or the second flat substrate, wherein the undulated ribbon is above and below the first flat portion and the second flat portion; and

forming an electronic patch by enclosing the first flat portion, the second flat portion, the undulated ribbon, the first conductive circuit, the second conductive circuit, and the third conductive circuit in an elastic layer.

16. The method of claim 15, wherein the third conductive circuit is connected with the first conductive circuit and the second conductive circuit.

17. The method of claim 15, wherein the flat substrate includes one or more semiconductor chips on the first flat portion, the second flat portion, or both the first flat portion and the second flat portion, wherein the one or more semiconductor chips are in connection with the first conductive circuit and the second conductive circuit.

18. The method of claim 17, wherein the molds comprise recesses configured to provide spaces to clear the one or more semiconductor chips during the step of pressing, wherein the recesses in the molds are registered to the first flat portion and the second flat portion.

19. The method of claim 15, wherein the electronic patch includes multiple undulated ribbons that are connected the first flat portion and the second flat portion, wherein the multiple undulated ribbons define at least one opening therein.