Heat dissipation structure for an electronic device
First Claim
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1. An apparatus comprising:
- an electronic component that generates heat during operation;
a housing that includes a heat dissipation structure to dissipate heat generated by the electronic component, the heat dissipation structure having a hollow channel, the hollow channel having an interior surface from which heat is to be dissipated into air external to the apparatus, the interior surface of the hollow channel defining at least a portion of an exterior surface of the housing so as to define an air channel through the housing; and
a flexible thermal conduit having a first end coupled to the heat dissipation structure and a second end coupled to the electronic component.
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Abstract
A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.
64 Citations
17 Claims
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1. An apparatus comprising:
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an electronic component that generates heat during operation; a housing that includes a heat dissipation structure to dissipate heat generated by the electronic component, the heat dissipation structure having a hollow channel, the hollow channel having an interior surface from which heat is to be dissipated into air external to the apparatus, the interior surface of the hollow channel defining at least a portion of an exterior surface of the housing so as to define an air channel through the housing; and a flexible thermal conduit having a first end coupled to the heat dissipation structure and a second end coupled to the electronic component. - View Dependent Claims (2, 3, 4, 5)
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6. A head-mounted display device comprising:
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a visor assembly containing a component that generates heat during operation, the visor assembly including a display device; and a head fitting assembly, coupled to the visor assembly, by which the display device can be worn on the head of a user, the head fitting assembly having an exterior surface, the head fitting assembly including a hollow heat dissipation structure that has an exterior surface and an interior surface, wherein the exterior surface of the heat dissipation element is internal to the head fitting assembly and an interior surface of the heat dissipation element defining at least a portion of the exterior surface of the head fitting assembly. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A head-mounted display device comprising:
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a visor assembly containing a plurality of electronic components that generate heat during operation, the visor assembly including a display component a display component to cause an image to be displayed to a user; and a head fitting assembly, coupled to the visor assembly, by which the display device can be worn on the head of the user, the head fitting assembly including a plurality of curved, elongate side arms, each coupled to a different end of the visor assembly, each side arm including a heat dissipation tunnel, the heat dissipation tunnel having an exterior surface and an interior surface, the exterior surface of the heat dissipation tunnel being internal to the side arm, the interior surface of the heat dissipation tunnel defining a first exterior surface of the side arm such that the first exterior surface of the side arm defines an air channel completely through a body of the side arm. - View Dependent Claims (14, 15, 16, 17)
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Specification