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Heat dissipation structure for an electronic device

  • US 9,585,285 B2
  • Filed: 05/06/2015
  • Issued: 02/28/2017
  • Est. Priority Date: 01/20/2015
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • an electronic component that generates heat during operation;

    a housing that includes a heat dissipation structure to dissipate heat generated by the electronic component, the heat dissipation structure having a hollow channel, the hollow channel having an interior surface from which heat is to be dissipated into air external to the apparatus, the interior surface of the hollow channel defining at least a portion of an exterior surface of the housing so as to define an air channel through the housing; and

    a flexible thermal conduit having a first end coupled to the heat dissipation structure and a second end coupled to the electronic component.

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