Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same
First Claim
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1. A micro-electromechanical apparatus, being adapted to measuring a pressure and an inertial physical quantity, the micro-electromechanical apparatus comprising:
- a substrate, having a first surface;
a first cover, disposed on the substrate and having a top wall and a side wall, wherein the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate so the first cover and the substrate define a first hermetically sealed chamber;
a sensing unit, comprising a movable mass suspended over the substrate; and
a second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the first cover covers a lateral portion and an upper surface of the movable mass, the side wall of the first cover surrounds the movable mass, and the sensing unit is enclosed by the first hermetically sealed chamber and is disposed outside the second hermetically sealed chamber.
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Abstract
A micro-electromechanical apparatus with multiple chambers and a method for manufacturing the same are provided, wherein various micro-electromechanical sensors are integrated into a single apparatus. For example, the micro-electromechanical apparatus in this disclosure may have two independent hermetically sealed chambers with different pressures, such that a micro-electromechanical barometer and a micro-electromechanical accelerometer can be operated in an optimal pressure circumstance.
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Citations
34 Claims
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1. A micro-electromechanical apparatus, being adapted to measuring a pressure and an inertial physical quantity, the micro-electromechanical apparatus comprising:
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a substrate, having a first surface; a first cover, disposed on the substrate and having a top wall and a side wall, wherein the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate so the first cover and the substrate define a first hermetically sealed chamber; a sensing unit, comprising a movable mass suspended over the substrate; and a second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the first cover covers a lateral portion and an upper surface of the movable mass, the side wall of the first cover surrounds the movable mass, and the sensing unit is enclosed by the first hermetically sealed chamber and is disposed outside the second hermetically sealed chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A micro-electromechanical apparatus, comprising:
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a substrate, having a first surface; a first cover, disposed on the substrate and having a top wall and a side wall, wherein the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate so the first cover and the substrate define a first hermetically sealed chamber; and a sensing unit, comprising a movable mass suspended over the substrate; a second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, the sensing unit is disposed outside the second hermetically sealed chamber, and a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber. - View Dependent Claims (11, 12, 13, 14)
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15. A micro-electromechanical apparatus, comprising:
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a substrate, having a first surface; a first cover, disposed on the substrate and having a top wall and a side wall, wherein the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate so the first cover and the substrate define a first hermetically sealed chamber; a sensing unit, comprising a movable mass suspended over the substrate; and a second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, the sensing unit is disposed outside the second hermetically sealed chamber, a distance from a lower surface of the movable mass to the first surface is substantially equal to a distance from a lower surface of a top wall of the second cover to the first surface, and a thickness of the movable mass is substantially equal to a thickness of the second cover. - View Dependent Claims (16, 17, 18)
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19. A micro-electromechanical apparatus, comprising:
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a substrate, having a first surface, comprising; a film; and a through hole; a first cover, disposed on the substrate and having a top wall and a side wall, wherein the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate so the first cover and the substrate define a first hermetically sealed chamber; a sensing unit, comprising a movable mass suspended over the substrate; and a second cover, disposed on the substrate, wherein the second cover and the substrate define a second hermetically sealed chamber, wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, the sensing unit is disposed outside the second hermetically sealed chamber, an upper surface of the film is exposed in the second hermetically sealed chamber, and a lower surface of the film covers the through hole. - View Dependent Claims (20, 21, 22)
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23. A method for manufacturing a micro-electromechanical apparatus, the method comprising:
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forming a stationary electrode on a first substrate; etching a second substrate to form a plurality of protrusions and a plurality of recesses; bonding he second substrate to the first substrate to form a second hermetically sealed chamber; etching the second substrate to form a sensing unit and a second cover covering the second hermetically sealed chamber, wherein the sensing unit comprises at least one movable mass suspended over the stationary electrode; and bonding a first cover to a first surface of the first substrate to form a first hermetically sealed chamber, wherein the first cover has a top wall and a side wall, the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate, and wherein the first cover covers a lateral portion and an upper surface of the movable mass, and the side wall of the first cover surrounds the movable mass, wherein a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, and the sensing unit is disposed outside the second hermetically sealed chamber. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31)
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32. A method for manufacturing a micro-electromechanical apparatus adapted to measure a pressure and an inertial physical quantity, the method comprising:
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forming a stationary electrode on a first substrate; etching a second substrate to form a plurality of protrusions and a plurality of recesses; bonding the second substrate to the first substrate to form a second hermetically sealed chamber; etching the second substrate to form a sensing unit and a second cover covering the second hermetically sealed chamber, wherein the sensing unit comprises at least one movable mass suspended over the stationary electrode; and bonding a first cover to a first surface of the first substrate to form a first hermetically sealed chamber, wherein the first cover has a top wall and a side wall, the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate, and wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, wherein a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber, the sensing unit is enclosed by the first hermetically sealed chamber, and the sensing unit is disposed outside the second hermetically sealed chamber.
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33. A method for manufacturing a micro-electromechanical apparatus, the method comprising:
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forming a stationary electrode on a first substrate; etching a second substrate to form a plurality of protrusions and a plurality of recesses; bonding the second substrate to the first substrate to form a second hermetically sealed chamber; etching the second substrate to form a sensing unit and a second cover covering the second hermetically sealed chamber, wherein the sensing unit comprises at least one movable mass suspended over the stationary electrode; and bonding a first cover to a first surface of the first substrate to form a first hermetically sealed chamber, wherein the first cover has a top wall and a side wall, the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate, and wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, wherein a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, the sensing unit is disposed outside the second hermetically sealed chamber, a distance from a lower surface of the movable mass to the first surface is substantially equal to a distance from a lower surface of a top wall of the second cover to the first surface, and a thickness of the movable mass is substantially equal to a thickness of the second cover.
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34. A method for manufacturing a micro-electromechanical apparatus, the method comprising:
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forming a stationary electrode on a first substrate, wherein the first substrate comprises a film and a through hole; etching a second substrate to form a plurality of protrusions and a plurality of recesses; bonding the second substrate to the first substrate to form a second hermetically sealed chamber; etching the second substrate to form a sensing unit and a second cover covering the second hermetically sealed chamber, wherein the sensing unit comprises at least one movable mass suspended over the stationary electrode; and bonding a first cover to a first surface of the first substrate to form a first hermetically sealed chamber, wherein the first cover has a top wall and a side wall, the top wall and the side wall of the first cover are integrally formed, and the side wall of the first cover is connected to the substrate, and wherein the first cover covers a lateral portion and an upper surface of the movable mass and the first cover covers a lateral portion and an upper surface of the second cover, the side wall of the first cover surrounds the movable mass and the second cover, wherein a gas pressure of the first hermetically sealed chamber is different from a gas pressure of the second hermetically sealed chamber, the sensing unit and the second cover are enclosed by the first hermetically sealed chamber, the sensing unit is disposed outside the second hermetically sealed chamber, an upper surface of the film is exposed in the second hermetically sealed chamber, and a lower surface of the film covers the through hole.
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Specification