Hybrid heat exchanger

• US 9,588,554 B2
• Filed: 05/03/2013
• Issued: 03/07/2017
• Est. Priority Date: 10/13/2006
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Hood, Charles D. III, Sauciuc, Ioan, Tantoush, Mohammed
• Primary Examiner(s): Bauer, Cassey D
• Application Number:
  US13/886,754
• Publication Number:
  US 20130232995A1
• Time in Patent Office: 1,404 Days
• US Class Current: 1/1
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: F28D 1/0408 Multi-circuit heat exchangers, e.g. integrating different heat exchange sections in the same unit or heat exchangers for more than two fluids F28F9/0234 takes precedence
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 15/00 Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect integrated devices or assemblies of multiple devices H10N19/00

Abstract

A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Claims

1. A heat exchanger assembly comprising:

a radiator disposed in a shroud;

a subassembly in direct physical communication with the shroud;

a thermoelectric cooler assembly located within the subassembly, the thermoelectric cooler assembly including;

a cold plate having a first side and a second side;

a first thermoelectric cooler in thermal communication with the first side of the cold plate; and

a second thermoelectric cooler in thermal communication with the second side of the cold plate; and

a fan located within the subassembly, the fan adapted to draw air through the radiator and to blow air through the thermoelectric cooler assembly, wherein an ambient temperature of the air is raised as it enters the subassembly.

2. The heat exchanger assembly of claim 1, the thermoelectric cooler assembly further comprising a first heat sink in thermal communication with the first thermoelectric cooler.

3. The heat exchanger assembly of claim 2, the thermoelectric cooler assembly further comprising a second heat sink in thermal communication with the second thermoelectric cooler.

4. The heat exchanger assembly of claim 1, wherein coolant circulates through the cold plate.

5. The heat exchanger assembly of claim 1, the thermoelectric cooler assembly further comprising a pump for circulating coolant through the cold plate.

6. A method comprising:

drawing, by a fan located within a subassembly, air through a passive heat exchanger of a heat exchanger assembly, wherein the passive heat exchanger is disposed in a shroud that is in direct physical communication with the subassembly, wherein an ambient temperature of the air is raised as it enters the subassembly; and

blowing, by the fan, air through an active heat exchanger located within the subassembly of the heat exchanger assembly.

7. The method of claim 6, wherein the active heat exchanger comprises a cold plate having a first side and a second side.

8. The method of claim 7, further comprising:

circulating coolant through the cold plate.

9. The method of claim 8, wherein circulating of the coolant through the cold plate is performed by a pump.

10. The method of claim 7, further comprising:

placing a first thermoelectric cooler in thermal communication with the first side of the cold plate; and

placing a second thermoelectric cooler in thermal communication with the second side of the cold plate.

11. The method of claim 10, further comprising:

placing a first heat sink in thermal communication with the first thermoelectric cooler.

12. The method of claim 11, further comprising:

placing a second heat sink in thermal communication with the second thermoelectric cooler.

13. The method of claim 6, wherein the passive heat exchanger comprises a radiator.

14. A method comprising:

drawing, by a fan located within a subassembly, air through a passive heat exchanger of a heat exchanger assembly, wherein the passive heat exchanger is disposed in a shroud that is in direct physical communication with the subassembly, wherein an ambient temperature of the air is raised as it enters the subassembly;

blowing, by the fan, air through an active heat exchanger located within the subassembly of the heat exchanger assembly; and

circulating, by a pump located within the subassembly, coolant through the active heat exchanger.

15. The assembly of claim 14, wherein the active heat exchanger comprises a cold plate having a first side and a second side.

16. The method of claim 15, further comprising:

placing a first thermoelectric cooler in thermal communication with the first side of the cold plate; and

placing a second thermoelectric cooler in thermal communication with the second side of the cold plate.

17. The method of claim 16, further comprising:

placing a first heat sink in thermal communication with the first thermoelectric cooler.

18. The method of claim 17, further comprising:

placing a second heat sink in thermal communication with the second thermoelectric cooler.

19. The method of claim 14, wherein the passive heat exchanger comprises a radiator.