Optical sensor module

• US 9,590,129 B2
• Filed: 11/18/2015
• Issued: 03/07/2017
• Est. Priority Date: 11/19/2014
• Status: Active Grant

• Current Assignee: Analog Devices International Unlimited Company (Analog Devices, Inc.)
• Original Assignee: Analog Devices Global Unlimited Company (Analog Devices, Inc.)
• Inventors: Deliwala, Shrenik, Zhao, Ying, Chun, Seokphyo
• Primary Examiner(s): GHYKA, ALEXANDER G
• Application Number:
  US14/945,255
• Publication Number:
  US 20160141440A1
• Time in Patent Office: 475 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 31/12 structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto semiconductor devices with at least one potential barrier or surface barrier adapted for light emission H01L33/00; amplifiers using electroluminescent element and photocell H03F17/00; electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

Claims

1. An optical sensor module comprising:

a housing;

an optical emitter die disposed in the housing, a top surface of the optical emitter die facing a first side of the housing and disposed at a first height above a floor of the housing, the optical emitter die configured to emit light towards the first side of the housing; and

an optical sensor unit comprising an optical sensor die disposed in the housing adjacent the optical emitter die, a top surface of the optical sensor die facing the first side of the housing and disposed at a second height above the floor of the housing, the second height different from the first height,

wherein the optical sensor unit is positioned relative to the optical emitter die such that a portion of the optical sensor unit shadows at least a portion of an optically sensitive surface of the optical sensor die from at least some emitter light that does not exit the housing.

2. The sensor module of claim 1, wherein the optical sensor die is spaced from the optical emitter die by a lateral distance, wherein the lateral distance, the first height, and the second height are selected such that the optical sensor die shadows the portion of the optically sensitive surface of the optical sensor die from at least some emitter light that does not exit the housing.

3. The sensor module of claim 1, wherein the optical sensor die is positioned relative to the optical emitter die such that a side edge of the optical sensor die intercepts at least some direct light rays emitted from the optical emitter die.

4. The sensor module of claim 1, wherein the optical sensor die is positioned relative to the optical emitter die such that light rays emitted from the optical emitter die and which undergo a single reflection from the housing impinge on the portion of the optically sensitive surface of the optical sensor die.

5. The sensor module of claim 1, wherein there is no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

6. The sensor module of claim 1, further comprising a single transparent window through the housing.

7. The sensor module of claim 6, wherein the housing comprises one or more walls coupled with a substrate, the window coupled to the one or more walls over a cavity in which the dies sit without encapsulant over the dies.

8. The sensor module of claim 1, further comprising a processor die to process signals transduced by the optical sensor die.

9. The sensor module of claim 1, wherein the optical sensor unit comprises a spacer to space the optical sensor die above the floor.

10. The sensor module of claim 1, wherein the optical sensor die is at least partially embedded in a molding compound.

11. The sensor module of claim 1, wherein the housing comprises a substrate and a mold compound disposed about the optical emitter die and the optical sensor die.

12. The sensor module of claim 2, wherein at least one of the lateral distance, the first height, and the second height are selected such that an upper corner of the optical sensor unit nearest the optical emitter die forms an angle of less than 45 degrees to the vertical with a center of the emitting surface of the emitter die.

13. The sensor module of claim 12, wherein at least one of the lateral distance, the first height, and the second height are selected such that the upper corner of the optical sensor unit forms an angle of less than 15 degrees to the vertical with the center of the emitting surface of the emitter die.

14. The sensor module of claim 2, wherein the lateral distance is in a range of 50 microns to 300 microns.

15. The sensor module of claim 1, wherein a relative height between the top surface of the optical emitter die and the top surface of the optical sensor die is in a range of 50 microns to 1000 microns.

16. The sensor module of claim 1, wherein the second height is greater than the first height.

17. An optical sensor module comprising:

a housing comprising an air cavity;

an optical emitter die disposed in the air cavity of the housing, a top surface of the optical emitter die facing a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing; and

an optical sensor unit comprising an optical sensor die disposed in the air cavity of the housing adjacent the optical emitter die, a top surface of the optical sensor die facing the first side of the housing,

wherein there is no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die, the optical sensor unit positioned to shadow at least a portion of an optically sensitive surface of the optical sensor die from at least some emitter light that does not exit the housing.

18. The sensor module of claim 17, further comprising a processor die to process signals transduced by the optical sensor die.