Module board

• US 9,591,747 B2
• Filed: 03/07/2014
• Issued: 03/07/2017
• Est. Priority Date: 09/09/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Mizushiro, Masaaki
• Primary Examiner(s): Warren, David
• Application Number:
  US14/201,150
• Publication Number:
  US 20140185248A1
• Time in Patent Office: 1,096 Days
• Field of Search: 257/700, 257/701, 257/758, 257/786, 228/180.22, 438/108, 438/109
• US Class Current: 1/1
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/0558 being stacked
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/06548 Conductive via connections through the substrate, container, or encapsulation
• CPC Class Codes: H01L 23/00 Details of semiconductor or other solid state devices H01L25/00 takes precedence ; structural arrangements for testing or measuring during manufacture or treatment, or for reliability measurements H01L22/00; arrangements for connecting or disconnecting semiconductor or solid-state bodies, or methods related thereto H01L24/00; finger print sensors G06V40/12
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/52 : Arrangements for conducting electric current within the device in operation from one component to another , i.e. interconnections, e.g. wires, lead frames optical interconnections G02B6/00
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 25/04 : the devices not having separate containers
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H05K 1/0296 : Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00

Abstract

To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components 4 and 4h are mounted on one face of a substrate 5 and the multiple electronic components 4 and 4h are sealed with insulating resin 3. Multiple columnar connection terminals 2 and 7 are arranged on a peripheral area of the substrate 5 and in one or more small areas 8 on the substrate 5, respectively. The one or more small areas 8 are set at positions on the substrate 5, which is not on the peripheral area of the substrate 5 and on which the multiple electronic components 4 and 4h are not mounted.

Claims

1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an insulating resin sealing the plurality of electronic components,

wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more predetermined areas on the substrate, and

wherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where none of the plurality of electronic components are mounted.

2. The module board according to claim 1,

wherein the predetermined areas are set between the plurality of electronic components.

3. The module board according to claim 1,

wherein the plurality of electronic components include a lower electronic component and a higher electronic component in heights, and a distance between the lower electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the lower electronic component is less than a distance between the higher electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the higher electronic component.

4. The module board according to claim 1,

wherein the predetermined areas are set at a position farthest from the columnar connection terminals arranged on the peripheral area of the substrate.

5. The module board according to claim 4,

wherein the substrate has a rectangular shape, and

wherein the predetermined areas are set at a position including an intersection point of diagonal lines of the substrate.

6. The module board according to claim 4,

wherein the plurality of columnar connection terminals are arranged in a cross pattern in the predetermined areas.

7. The module board according to claim 1,

wherein the plurality of columnar connection terminals are connected to a ground electrode.

8. The module board according to claim 1,

wherein the plurality of electronic components include heat-variable electronic components, and the predetermined areas are set at a position adjacent to the heat-variable electronic components.

9. The module board according to claim 1,

wherein the insulating resin has a flat top face.

10. The module board according to claim 1,

wherein the plurality of electronic components are mounted on other face of the substrate.

11. The module board according to claim 2,

wherein the plurality of electronic components include a lower electronic component and a higher electronic component in heights, and a distance between the lower electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the lower electronic component is less than a distance between the higher electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the higher electronic component.

12. The module board according to claim 5,

wherein the plurality of columnar connection terminals are arranged in a cross pattern in the predetermined areas.