Module board
First Claim
1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an insulating resin sealing the plurality of electronic components,wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more predetermined areas on the substrate, andwherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where none of the plurality of electronic components are mounted.
1 Assignment
0 Petitions
Accused Products
Abstract
To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components 4 and 4h are mounted on one face of a substrate 5 and the multiple electronic components 4 and 4h are sealed with insulating resin 3. Multiple columnar connection terminals 2 and 7 are arranged on a peripheral area of the substrate 5 and in one or more small areas 8 on the substrate 5, respectively. The one or more small areas 8 are set at positions on the substrate 5, which is not on the peripheral area of the substrate 5 and on which the multiple electronic components 4 and 4h are not mounted.
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Citations
12 Claims
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1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an insulating resin sealing the plurality of electronic components,
wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more predetermined areas on the substrate, and wherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where none of the plurality of electronic components are mounted.
Specification