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Module board

  • US 9,591,747 B2
  • Filed: 03/07/2014
  • Issued: 03/07/2017
  • Est. Priority Date: 09/09/2011
  • Status: Active Grant
First Claim
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1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an insulating resin sealing the plurality of electronic components,wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more predetermined areas on the substrate, andwherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where none of the plurality of electronic components are mounted.

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