Biocompatible bonding method and electronics package suitable for implantation
First Claim
1. A method of making an implantable device comprising:
- providing a hermetic package configured to be implanted within a human body, including a substrate forming a part of said hermetic package and containing hermetic electrically conductive feedthroughs straight from an inside surface to an outside surface forming electrically conductive pads in a two dimensional grid on said outside surface of said substrate where said outside surface is outside the hermetic package;
providing a flexible electrical circuit having contacts in a two dimensional grid matching said two dimensional grid on said substrate;
applying electrically conductive adhesive to said electrically conductive pads;
applying electrically conductive adhesive to said contacts;
aligning and contacting said electrically conductive pads with said contacts;
curing said electrically conductive adhesive;
underfilling a space between said substrate and said flexible electrical circuit, thereby hermetically sealing said space.
3 Assignments
0 Petitions
Accused Products
Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
16 Citations
10 Claims
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1. A method of making an implantable device comprising:
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providing a hermetic package configured to be implanted within a human body, including a substrate forming a part of said hermetic package and containing hermetic electrically conductive feedthroughs straight from an inside surface to an outside surface forming electrically conductive pads in a two dimensional grid on said outside surface of said substrate where said outside surface is outside the hermetic package; providing a flexible electrical circuit having contacts in a two dimensional grid matching said two dimensional grid on said substrate; applying electrically conductive adhesive to said electrically conductive pads; applying electrically conductive adhesive to said contacts; aligning and contacting said electrically conductive pads with said contacts; curing said electrically conductive adhesive; underfilling a space between said substrate and said flexible electrical circuit, thereby hermetically sealing said space. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of making an implantable device comprising:
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providing a substrate containing electrically conductive feedthroughs straight from an inside surface to an outside surface forming electrically conductive pads in a two dimensional grid on said outside surface of said substrate; forming an electrical circuit on said inside surface of said substrate; bonding a cover to said inside surface of said substrate forming a hermetic package around said electrical circuit configured to be implanted within a human body; providing a flexible electrical circuit having contacts in a two dimensional grid; applying electrically conductive adhesive to said electrically conductive pads; applying electrically conductive adhesive to said contacts; aligning and contacting said electrically conductive pads with said contacts; curing said electrically conductive adhesive; underfilling a space between said substrate and said flexible electrical circuit, thereby hermetically sealing said space. - View Dependent Claims (9, 10)
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Specification