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Device for single-sided electrolytic treatment of a flat substrate

  • US 9,593,428 B2
  • Filed: 10/06/2011
  • Issued: 03/14/2017
  • Est. Priority Date: 10/07/2010
  • Status: Active Grant
First Claim
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1. A device for single-sided electrolytic treatment of a flat substrate, comprisinga bath for electrolytic fluid, wherein the bath for electrolytic fluid has a free surface,a conveying means for conveying the flat substrate in a conveying direction at the free surface of the electrolytic fluid in the bath,wherein the conveying means is configured to convey the flat substrate in a horizontal orientation such that the underside of the flat substrate is able to make contact with the free surface of the electrolytic fluid in the bath,said conveying means comprising two conveying elements disposed opposite each other,wherein the two conveying elements extend along two respective conveying paths,wherein the two conveying paths each comprise an electrolytic part which each extend on two opposite longitudinal sides of the bath,wherein each of the two conveying elements comprisesat least one carrier body of a dielectric material, wherein each carrier body has, at least at the location of the associated electrolytic part, a support edge directed toward the bath for supporting, with an upper side thereof, the flat substrate on one side thereof, which support edge forms a moving part of a longitudinal wall of the bath, andat least one guide member of an electrically conductive material, wherein the at least one guide member is connected to said at least one carrier body for cathodically connecting the underside of the substrate on the side of the support edge remote from the bath,wherein the at least one guide member comprises at least one spring means having an upper side which, in unloaded condition, is located above the level of the upper side of the support edge, at least at the location of the bath, the upper side of which spring means is elastically compressible in a downward direction under the influence of a downward force exerted on the spring means by the substrate, to the level at which the upper side of the spring means is located at the same level as the upper side of the support edge.

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