Package for a differential pressure sensing die

• US 9,593,995 B2
• Filed: 02/28/2014
• Issued: 03/14/2017
• Est. Priority Date: 02/28/2014
• Status: Active Grant

• Current Assignee: Measurement Specialties Incorporated (TE Connectivity Limited)
• Original Assignee: Measurement Specialties Incorporated (TE Connectivity Limited)
• Inventors: Wagner, David E., Valentini, John J.
• Primary Examiner(s): Lyons, Michael A
• Assistant Examiner(s): Singer, David L
• Application Number:
  US14/194,030
• Publication Number:
  US 20150247776A1
• Time in Patent Office: 1,110 Days
• Field of Search: 734/31, 737/21, 737/06, 737/16, 324/691
• US Class Current: 1/1
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 19/0069 from the sensor to its support
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Claims

1. A package for receiving a differential pressure sensing die, the differential pressure sensing die comprising a semiconductor die having an integral diaphragm adapted to measure a differential pressure applied to opposing sides of the integral diaphragm, the package comprising:

a first housing member configured to receive the differential pressure sensing die, the first housing member defining a chamber and supporting a first flexible diaphragm that divides the chamber into a first internal volume and a first fluid-fillable volume, the first fluid-fillable volume in fluid communication with a first side of the integral diaphragm of the differential pressure sensing die when the differential pressure sensing die is installed in the package;

at least one second housing member, the at least one second housing member defining a second chamber and supporting a second flexible diaphragm that divides the second chamber into a second internal volume and a second fluid-fillable volume, the second fluid-fillable volume in fluid communication with a second side of the integral diaphragm of the differential pressure sensing die when the differential pressure sensing die is installed in the package, wherein the first housing member and the at least one second housing member are configured to mate with one another to define a housing, the housing defining a first central portion in which the first housing member and the second housing member directly contact one another and a second central portion defining a third internal volume for receiving the differential pressure sensing die, the first housing member having a first internal port defined in a wall of the first housing member at the second central portion and the second housing member having a second internal port defined in a wall of the second housing member at the second central portion, the internal ports being arranged to mate with the pressure sensing die, the respective walls attached directly to the differential pressure sensing die when the differential pressure sensing die is received by the third internal volume, and wherein the first housing member supports the first flexible diaphragm and the second housing member supports the second flexible diaphragm independent of the first housing member when the first housing member and the second housing member are not mated;

a first port defined through a first wall of the first housing member, the first port in fluid communication with the first internal volume; and

a second port defined through a second wall of one of the at least one second housing members, the second port in fluid communication with the second internal volume, wherein the first port is configured to receive a first fluid at a first pressure and the second port is configured to receive a second fluid at a second pressure.

2. The package of claim 1, where in the first housing member and the at least one second housing members comprise a plastic.

3. The package of claim 1, further comprising:

at least one electrical connection pin extending outward from the package, electrically connected to an electrical conductor through the housing, for connection to a bond wire in electrical communication with a piezo-resistive element formed in a surface of the integral diaphragm, wherein the package is configured to maintain the electrical connection pin physically isolated from contact with the first fluid introduced at the first port or the second fluid introduced at the second port.

4. The package of claim 3, wherein the at least one electrical connection pin is configured as a single inline package (SIP).

5. The package of claim 3, wherein the at least one electrical connection pin is configured as a dual inline package (DIP).

6. The package of claim 1, further comprising:

a first fitting, configured to be threadingly engaged to an external thread defined on the first port;

a first O-ring, disposed between the first fitting and the first port defined in the first housing member;

a second fitting, configured to be threadingly engaged to an external thread defined on the second port; and

a second O-ring, disposed between the second fitting and the second port defined in one of the at least one second housing members.

7. The package of claim 1, further comprising:

at least one flanged portion integrally formed with at least one of the first housing member and one of the at least one second housing members and having a hole defined therein for receiving a fastener for surface mounting the package.

8. The package of claim 7, wherein the at least one flanged portion is configured to permit surface mounting of the package on a frame of a vehicle.

9. The package of claim 1, wherein the first port is configured to be connected to an inlet of an oil filter of a vehicle.

10. The package of claim 9, wherein the second port is configured to be connected to an outlet of the oil filter.

11. A package for receiving a differential pressure sensing die, the differential pressure sensing die comprising a semiconductor die having an integral diaphragm adapted to measure a differential pressure applied to opposing sides of the integral diaphragm, the package comprising:

a housing, defined by a plurality of housing members, a first housing member of the plurality of housing members defining a first internal volume and a first fluid-fillable volume separated by a first flexible diaphragm supported by the first housing member and a second housing member of the plurality of housing members defining a second internal volume and a second fluid-fillable volume separated by a second flexible diaphragm supported by the second housing member, the housing defining a first central portion in which the first housing member and the second housing member directly contact one another and a second central portion defining a third internal volume between the first fluid-fillable volume and the second fluid-fillable volume configured to support and receive the differential pressure sensing die when the first housing member is mated with the second housing member, the first housing member having a first internal port defined in a wall of the first housing member at the second central portion and the second housing member having a second internal port defined in a wall of the second housing member at the second central portion, the internal ports being arranged to mate with the differential pressure sensing die, the respective walls attached directly to the differential pressure sensing die when the differential pressure sensing die is received by the third internal volume, and wherein the first housing member supports the first flexible diaphragm and the second housing member supports the second flexible diaphragm independent of the first housing member when the first housing member and the second housing member are not mated;

a first port defined through a first wall of the first housing member, the first port in fluid communication with the first internal volume;

a second port defined through a second wall of the second housing member, the second port in fluid communication with the second internal volume; and

at least one electrical connection pin extending outward from the housing, and in electrical communication through a wall of the third internal volume for connection to a bond wire in electrical communication with a piezo-resistive element formed in a surface of the integral diaphragm.

12. The package of claim 11, wherein the package is configured to maintain the electrical connection pin physically isolated from contact with a fluid introduced at either the first port or the second port.

13. The package of claim 11, wherein the at least one electrical connection pin is configured as a single inline package (SIP).

14. The package of claim 11, wherein the at least one electrical connection pin is configured as a dual inline package (DIP).

15. The package of claim 11, further comprising:

a first fitting, configured to be threadingly engaged to an external thread defined on the first port;

a first O-ring, disposed between the first fitting and the first port;

a second fitting, configured to be threadingly engaged to an external thread defined on the second port; and

a second O-ring, disposed between the second fitting and the second port.

16. The package of claim 11, further comprising:

at least one flanged portion rigidly attached to one of the housing members and having a hole defined therein for receiving a fastener for surface mounting the package.

17. The package of claim 16, wherein the at least one flanged portion is configured to permit surface mounting of the package on a frame of a vehicle.

18. The package of claim 11, wherein the first port is configured to be connected to an inlet of an oil filter of a vehicle, to permit fluid communication from the inlet to a side of the first flexible diaphragm.

19. The package of claim 18, wherein the second port is configured to be connected to an outlet of the oil filter, to permit fluid communication from the outlet to an opposite side of the second flexible diaphragm.

20. A package for receiving a differential pressure sensing die, the differential pressure sensing die comprising a semiconductor die having an integral diaphragm adapted to measure a differential pressure applied to opposing sides of the integral diaphragm, the package comprising:

a first housing member configured to receive the differential pressure sensing die;

at least one second housing member, the first housing member and the at least one second housing member configured to mate with one another to define a housing, the housing having defined therein an interior volume for containing said differential pressure sensing die;

a first port defined through a wall of said first housing member, said first port positioned to be aligned with an aperture defined in a first side of said differential pressure sensing die when said differential pressure sensing die is contained in said first housing member; and

a second port defined through a wall of said second housing member, said second port positioned to be aligned with a second aperture defined in a second side of said differential pressure sensing die, opposite said first side, when said first housing member is mated with said second housing member; and

wherein the first housing member and the second housing member are mated and form a longitudinal axis and the differential pressure sensing die is insertable into the package between the first housing member and the second housing member when the first housing member and the second housing member are mated, the differential pressure sensing die configured to be inserted into the package from a side of the package, perpendicular to the longitudinal axis.

21. The package of claim 20,

wherein the first housing member defines a first chamber and supports a first flexible diaphragm that divides the first chamber into a first internal volume and a first fluid-fillable volume, the first fluid-fillable volume in fluid communication with a first side of the integral diaphragm of the differential pressure sensing die when the differential pressure sensing die is installed in the package, and wherein the second housing member defines a second chamber and supports a second flexible diaphragm that divides the second chamber into a second internal volume and a second fluid-fillable volume, the second fluid-fillable volume in fluid communication with a second side of the integral diaphragm of the differential pressure sensing die when the differential pressure sensing die is installed in the package, and wherein the interior volume defined when the first housing member and the second housing member are mated is between the first fluid-fillable volume and the second fluid-fillable volume the interior volume for receiving the differential pressure sensing die, and wherein the first housing member and the second housing member are arranged to each be bonded directly to the differential pressure sensing die when the differential pressure sensing die is received by the interior volume, and wherein the first housing member supports the first flexible diaphragm and the second housing member supports the second flexible diaphragm independent of the first housing member when the first housing member and the second housing member are not mated.