Packages with thermal management features for reduced thermal crosstalk and methods of forming same
First Claim
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1. A package comprising:
- a first die bonded to a substrate;
a second die adjacent the first die and bonded to the substrate;
a contour lid over the first die; and
a heat spreader comprising;
a first portion over the first die, wherein the contour lid is disposed between the first portion and the first die; and
a second portion extending beneath a top surface of the contour lid and directly attach to the second die.
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Abstract
An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.
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Citations
20 Claims
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1. A package comprising:
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a first die bonded to a substrate; a second die adjacent the first die and bonded to the substrate; a contour lid over the first die; and a heat spreader comprising; a first portion over the first die, wherein the contour lid is disposed between the first portion and the first die; and a second portion extending beneath a top surface of the contour lid and directly attach to the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package comprising:
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a first die bonded to a surface of a package component; a second die adjacent the first die; and a lid over the first die and second die, wherein the lid comprises; a first thermal conductive portion; a second thermal conductive portion; and a first thermal barrier contacting a first sidewall of the first thermal conductive portion and a second sidewall of the second thermal conductive portion, wherein the first thermal barrier comprises a different material than that first thermal conductive portion and the second thermal conductive portion, and wherein the first thermal barrier is disposed directly over a spacing between the first die and the second die. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method comprising:
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bonding a first die to a substrate; bonding a second die to the substrate and adjacent the first die; attaching a contour lid over the first die and the second die, wherein the contour lid comprises; a first thermal conductive portion over the first die; a second thermal conductive portion over the second die; and a first thermal barrier contacting the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal barrier comprises a different material than the first thermal conductive portion and the second thermal conductive portion. - View Dependent Claims (17, 18, 19, 20)
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Specification