Package structure of optical apparatus

• US 9,599,745 B2
• Filed: 04/18/2013
• Issued: 03/21/2017
• Est. Priority Date: 06/06/2012
• Status: Active Grant

• Current Assignee: PixArt Imaging Incorporated
• Original Assignee: PixArt Imaging Incorporated
• Inventors: Hsu, En-Feng, Chen, Nien-Tse
• Primary Examiner(s): LEE, JOHN R
• Application Number:
  US13/865,640
• Publication Number:
  US 20130327931A1
• Time in Patent Office: 1,433 Days
• US Class Current: 1/1
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: G01V 8/12 using one transmitter and one receiver
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/143 the light source being a semiconductor device with at least one potential-jump barrier or surface barrier, e.g. light emitting diode
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

The present invention provides a package structure of an optical apparatus which includes a substrate, a light emitting device, a light sensing device, and a light barrier member. The light emitting device is disposed on the substrate and electrically connected to the substrate. The light emitting device is for emitting light. The light sensing device is disposed on the substrate and is a chip scale package (CSP) device. The light sensing device is for receiving light reflected by an object. The light barrier member is disposed around a periphery of the light sensing device.

Claims

1. A package structure of an optical apparatus, comprising:

a substrate;

a light emitting device for emitting light, the light emitting device being disposed on the substrate;

a light sensing device disposed on the substrate, for receiving light reflected by an object, wherein the light sensing device is a chip scale package (CSP) device which is electrically connected to the substrate via one or more conductive materials but not via wire bonding, wherein the one or more conductive materials are located between the light sensing device and the substrate and located inside an area of the light sensing device as viewed from a direction normal to the substrate; and

a light barrier member, which is disposed around a periphery of the light sensing device, wherein the light barrier member is physically connected to the light sensing device and is connected to the substrate through the light sensing device and the one or more conductive materials, but is not connected to the substrate by a connection bypassing the light sensing device,

wherein the light barrier member includes a light transmissive layer and a shielding layer, a side of the transmissive layer being physically connected to the light sensing device, another side of the transmissive layer being physically connected to the shielding layer,

wherein the shielding layer is away from the substrate by a distance.

2. The package structure of the optical apparatus according to claim 1, further comprising:

a multilayer film disposed on or above the light sensing device, wherein at least a portion of the light reflected by the object passes through the multilayer film to be received by the light sensing device.

3. The package structure of the optical apparatus according to claim 2, wherein the light barrier member further includes a light blocking cover disposed on or above the light sensing device and having an opening, and the portion of the light reflected by the object passes through the opening to be received by the light sensing device.

4. The package structure of the optical apparatus according to claim 3, wherein the opening exposes a portion of the multilayer film.

5. The package structure of the optical apparatus according to claim 3, further comprising:

a partition wall, which is disposed on the substrate and located between the light emitting device and the light sensing device.

6. The package structure of the optical apparatus according to claim 2, wherein the portion of the light reflected by the object that passes through the multilayer film to be received by the light sensing device enters the multilayer film with an incident angle smaller than a predetermined angle.

7. The package structure of the optical apparatus according to claim 1, wherein the light transmissive layer covers an upper surface of the light sensing device, and the shielding layer has an opening which exposes a portion of the light transmissive layer, the portion of the light reflected by the object passes through the opening to be received by the light sensing device.

8. The package structure of the optical apparatus according to claim 1, wherein the light emitting device is a light emitting device emitting invisible light and the light sensing device is a light sensing device sensing invisible light.

9. The package structure of the optical apparatus according to claim 1, wherein a distance between the light emitting device and the light sensing device is in a range between 0.1 mm and 3 mm.