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Semiconductor device and manufacturing method thereof

  • US 9,601,516 B2
  • Filed: 04/29/2014
  • Issued: 03/21/2017
  • Est. Priority Date: 09/04/2009
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a first transistor comprising;

    a first gate electrode layer over an insulating surface;

    a gate insulating layer over the first gate electrode layer;

    a first oxide semiconductor layer over the first gate electrode layer; and

    a first source electrode layer and a first drain electrode layer over the first oxide semiconductor layer;

    a second transistor comprising;

    a second gate electrode layer over the insulating surface;

    the gate insulating layer over the second gate electrode layer;

    a second source electrode layer and a second drain electrode layer over the gate insulating layer; and

    a second oxide semiconductor layer over the second gate electrode layer, the second source electrode layer and the second drain electrode layer; and

    a capacitor comprising;

    a first electrode over the insulating surface;

    the gate insulating layer over the first electrode;

    a second electrode over the gate insulating layer; and

    a third oxide semiconductor layer over the second electrode, the third oxide semiconductor layer overlapping with the first electrode,wherein each of the second gate electrode layer, the gate insulating layer, the second source electrode layer, the second drain electrode layer, and the second oxide semiconductor layer has a light-transmitting property, andwherein the third oxide semiconductor layer is formed from the same material as the second oxide semiconductor layer.

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