Power electronic device with improved efficiency and electromagnetic radiation characteristics
First Claim
1. A power electronic device comprising:
- a package having a supply terminal and a reference terminal;
first and second drivers;
a first electronic switch and a second electronic switch being integrated on said package, each of said first and second electronic switches having a first conduction terminal, a second conduction terminal, and a control terminal, the first conduction terminal of said first electronic switch being coupled with the supply terminal, and the second conduction terminal of said second electronic switch being coupled with the reference terminal, control terminals of said first and second electronic switches being coupled to respective ones of said first and second drivers;
at least one resistive member coupled between the second conduction terminal of said first electronic switch and the first conduction terminal of said second electronic switch to allow a bidirectional flow of current therebetween;
said package comprising a first terminal coupled to the second conduction terminal of the first electronic switch, a second terminal coupled to the first conduction terminal of said second electronic switch, and an output terminal;
a first inductance coupled between the first terminal and said output terminal;
a second inductance coupled between the second terminal and the output terminal; and
said package comprising at least one of a wafer-level package and a chip-scale package, with said package configured to be directly coupled to a printed circuit board so as to eliminate bonding wires and reduce parasitic inductance.
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Accused Products
Abstract
A power electronic device includes first and second electronic switches, each integrated on a package having a low parasitic inductance, a supply terminal and a ground terminal. The first conduction terminal of the first switch may be coupled with the supply terminal, and the second conduction terminal of the second electronic switch may be coupled with the ground terminal. The corresponding control terminals of the switches may be coupled to corresponding pilot drivers. The package may include first and second electric terminals, wherein the second conduction terminal of the first switch is coupled to the first electric terminal, and the first conduction terminal of the second switch is coupled to the second electric terminal. A first inductance may be interposed between the first electric terminal and the output terminal and/or a second inductance interposed between the second electric terminal and the output terminal.
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Citations
35 Claims
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1. A power electronic device comprising:
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a package having a supply terminal and a reference terminal; first and second drivers; a first electronic switch and a second electronic switch being integrated on said package, each of said first and second electronic switches having a first conduction terminal, a second conduction terminal, and a control terminal, the first conduction terminal of said first electronic switch being coupled with the supply terminal, and the second conduction terminal of said second electronic switch being coupled with the reference terminal, control terminals of said first and second electronic switches being coupled to respective ones of said first and second drivers; at least one resistive member coupled between the second conduction terminal of said first electronic switch and the first conduction terminal of said second electronic switch to allow a bidirectional flow of current therebetween; said package comprising a first terminal coupled to the second conduction terminal of the first electronic switch, a second terminal coupled to the first conduction terminal of said second electronic switch, and an output terminal; a first inductance coupled between the first terminal and said output terminal; a second inductance coupled between the second terminal and the output terminal; and said package comprising at least one of a wafer-level package and a chip-scale package, with said package configured to be directly coupled to a printed circuit board so as to eliminate bonding wires and reduce parasitic inductance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A power electronic device comprising:
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a package having a supply terminal and a reference terminal; first and second pilot drivers; a first electronic switch and a second electronic switch being integrated on said package, each of said first and second electronic switches having a first conduction terminal, a second conduction terminal, and a control terminal, the first conduction terminal of said first electronic switch being coupled with the supply terminal, and the second conduction terminal of said second electronic switch being coupled with the reference terminal, control terminals of said first and second electronic switches being coupled to respective ones of said first and second pilot drivers; at least one resistive member coupled between the second conduction terminal of said first electronic switch and the first conduction terminal of said second electronic switch to allow a bidirectional flow of current therebetween; said package comprising a first terminal coupled to the second conduction terminal of the first electronic switch, a second terminal coupled to the first conduction terminal of said second electronic switch, and an output terminal; a first inductance coupled between the first terminal and said output terminal; and a second inductance coupled between the second terminal and the output terminal; said package comprising at least one of a wafer-level package and a chip-scale package, with said package configured to be directly coupled to a printed circuit board so as to eliminate bonding wires. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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21. A method for making a power electronic device comprising:
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integrating a first electronic switch and a second electronic switch on a package, each of the first and second electronic switches having a first conduction terminal, a second conduction terminal, and a control terminal, the first conduction terminal of the first electronic switch being coupled with the supply terminal, and the second conduction terminal of the second electronic switch being coupled with the reference terminal, control terminals of the first and second electronic switches being coupled to respective ones of first and second drivers; coupling at least one resistive member coupled between the second conduction terminal of the first electronic switch and the first conduction terminal of the second electronic switch to allow a bidirectional flow of current therebetween; wherein the package comprises a first terminal coupled to the second conduction terminal of the first electronic switch, a second terminal coupled to the first conduction terminal of the second electronic switch, and an output terminal, coupling a first inductance between the first terminal and the output terminal; coupling a second inductance between the second terminal and the output terminal; and the package comprising at least one of a wafer-level package and a chip-scale package, with the package configured to be directly coupled to a printed circuit board so as to eliminate bonding wires. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A power electronic device comprising:
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a package having a supply terminal and a reference terminal; first and second drivers; a first electronic switch and a second electronic switch being integrated on said package, each of said first and second electronic switches having a first conduction terminal, a second conduction terminal, and a control terminal, the first conduction terminal of said first electronic switch being coupled with the supply terminal, and the second conduction terminal of said second electronic switch being coupled with the reference terminal, control terminals of said first and second electronic switches being coupled to respective ones of said first and second drivers; at least one resistive member coupled between the second conduction terminal of said first electronic switch and the first conduction terminal of said second electronic switch to allow a bidirectional flow of current therebetween; said package comprising a first terminal coupled to the second conduction terminal of the first electronic switch, a second terminal coupled to the first conduction terminal of said second electronic switch, and an output terminal; a first inductance coupled between the first terminal and said output terminal; said package comprising at least one of a wafer-level package and a chip-scale package, with said package configured to be directly coupled to a printed circuit board so as to eliminate bonding wires and reduce parasitic inductance; and a compensation circuit comprising at least one capacitor having a value based upon a parasitic capacitance existing between said control terminal and said first conduction terminal of said first electronic switch, a third electronic switch having a control terminal and first and second conduction terminals, and said at least one capacitor coupled with the control terminal of said third switch. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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Specification