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Vacuum-grooved membrane wafer polishing workholder

  • US 9,604,339 B2
  • Filed: 12/28/2015
  • Issued: 03/28/2017
  • Est. Priority Date: 10/29/2012
  • Status: Active Grant
First Claim
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1. An abrasive polishing wafer carrier apparatus comprising:

  • a) a movable carrier housing attached to a rotatable shaft having a rotatable shaft axis of rotation;

    b) a flexible membrane attached to the movable carrier housing, the flexible membrane having a top surface, a nominally-circular and nominally-flat bottom surface, a flexible membrane thickness, and a rotation center nominally-concentric with the movable carrier housing rotatable axis of rotation, wherein the flexible membrane nominally-flat bottom surface has recessed vacuum grooves therein;

    c) a vacuum source fluid-coupled to the flexible membrane recessed vacuum grooves; and

    d) a pressure source fluid-coupled to a sealed pressure chamber formed by the flexible membrane and the movable carrier housing; and

    e) a flexible membrane flexible annular support ring attached to the flexible membrane wherein the flexible annular support ring has an annular width and a flexible support ring thickness that is positioned within the sealed pressure chamber.

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