Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

• US 9,604,839 B2
• Filed: 02/20/2014
• Issued: 03/28/2017
• Est. Priority Date: 06/20/2011
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Jahnes, Christopher V., Stamper, Anthony K.
• Primary Examiner(s): Andrews, Michael
• Application Number:
  US14/184,969
• Publication Number:
  US 20140231936A1
• Time in Patent Office: 1,132 Days
• Field of Search: 310/309
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/016 having a bridge fixed on two ends and connected to one or more dimples
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: G06F 2115/04 Micro electro-mechanical systems [MEMS]
• CPC Class Codes: G06F 30/30 Circuit design
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0057 the contact materials containing refractory materials, e.g. tungsten
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Claims

1. A MEMS structure comprising:

a first set of wires on a substrate, comprising fixed actuator electrodes and a contact;

a MEMS beam comprising a second set of wires above the first set of wires; and

an array of mini-bumps between the first set of wires and the second set of wires, wherein the array of mini-bumps prevent portions of the second set of wires from contacting the fixed actuator electrodes, upon actuation, and wherein the array of mini-bumps are in direct contact with and extend from insulator material forming an underside of the MEMS beam.

2. The MEMS structure of claim 1, wherein the array of mini-bumps are formed in alignment with the fixed actuator electrodes under the MEMS beam.

3. The MEMS structure of claim 1, wherein the array of mini-bumps are in alignment with spaces or openings between the fixed actuator electrodes under the MEMS beam so as to land on substrate when the MEMS beam is actuated downward.

4. The MEMS structure of claim 1, wherein:

the array of mini-bumps are in alignment with dummy actuator electrodes in a fixed actuator level under the MEMS beam; and

the dummy actuator electrodes are one of;

individually electrically floating electrodes; and

connected individually electrically floating electrodes.

5. The MEMS structure of claim 1, wherein the array of mini-bumps are in alignment with insulator material between portions of the fixed actuator electrodes.

6. The MEMS structure of claim 1, wherein the array of mini-bumps are all formed with a uniform height and width.

7. The MEMS structure of claim 1, wherein the array of mini-bumps are formed in openings of the second set of wires and in contact with insulator material forming the MEMS beam.

8. The MEMS structure of claim 1, wherein the array of mini-bumps are on the fixed actuator electrodes, and extend towards the MEMS beam.

9. The MEMS structure of claim 1, wherein mini-bumps farthest away from the contact are formed deeper than mini-bumps closer to the contact.

10. A MEMS structure comprising:

first set of wires on a substrate, comprising fixed actuator electrodes and a contact;

a MEMS beam comprising a second set of wires above the first set of wires; and

an array of mini-bumps between the first set of wires and the second set of wires, wherein the array of mini-bumps prevent portions of the second set of wires from contacting the fixed actuator electrodes, upon actuation, and wherein the array of mini-bumps have differing heights and widths.

11. The MEMS structure of claim 10, wherein mini-bumps farthest away from the contact are formed deeper than mini-bumps closer to the contact.