Outdoor LED luminaire with plastic housing

• US 9,605,821 B2
• Filed: 11/19/2014
• Issued: 03/28/2017
• Est. Priority Date: 11/19/2014
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: GE Lighting Solutions LLC (Savant Systems, LLC)
• Inventors: Al-Gaadi, Bidour, Denis, Xavier Jacques, Hercz, Zoltn, Nagy, Balzs
• Primary Examiner(s): Bowman, Mary Ellen
• Application Number:
  US14/547,652
• Publication Number:
  US 20160138791A1
• Time in Patent Office: 860 Days
• US Class Current: 1/1
• CPC Class Codes: F21S 8/086 with lighting device attached sideways of the standard, e.g. for roads and highways
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

An outdoor light emitting diode (LED) luminaire includes a plastic housing having two or more surfaces, a printed circuit board (PCB) coupled to at least one of the two or more surfaces, the PCB including a substrate and a conductive surface on the substrate, a plurality of LED light sources mounted on the PCB, a first portion of the conductive surface forming conductive paths in electrical communication with the plurality of LED light sources, and a second portion of the conductive surface forming thermal pads at a plurality of locations that are at least one of between and around the plurality of LED light sources, the thermal pads configured to dissipate heat generated by the plurality of LED light sources.

Claims

1. A light emitting diode (LED) luminaire comprising:

a housing having two or more surfaces, the housing formed at least in part from a plastic material that is heat conductive;

a printed circuit board (PCB) coupled to at least one of the two or more surfaces;

the PCB including a substrate and a surface opposing the substrate;

the substrate in thermal contact with the at least one of the two or more surfaces;

a plurality of LED light sources mounted on the PCB opposing surface;

a conductive material on at least a portion of the PCB opposing surface;

a first portion of the conductive material forming conductive paths in electrical communication with the plurality of LED light sources;

a second portion of the conductive material forming thermal pads at a plurality of locations that are at least one of between and around the plurality of LED light sources, the thermal pads configured to dissipate heat generated by the plurality of LED light sources; and

at least a portion of the dissipated heat flowing through the thermal contact to the heat conductive plastic material of the housing.

2. The LED luminaire of claim 1, wherein the conductive material is both electrically and thermally conductive.

3. The LED luminaire of claim 1, wherein the conductive paths are electrically insulated from the thermal pads.

4. The LED luminaire of claim 1, wherein the conductive paths are electrically connected to the thermal pads.

5. The LED luminaire of claim 1, including electrical drive circuitry electrically connected to the conductive paths, the electrical drive circuitry providing power to the plurality of LED light sources.

6. The LED luminaire of claim 1, including an optical unit positioned proximal of the plurality of LED light sources.

7. The LED luminaire of claim 1, the thermal pads having a surface area sufficient to self-cool the PCB.

8. The LED luminaire of claim 7, wherein the thermal pad surface area is determined from one or more properties of the conductive material including thickness of the conductive material and heat conductivity properties of the conductive material.

9. The LED luminaire of claim 7, wherein a thermal pad surface area in square meters for one of the plurality of LED light sources is determined by the expression A/QLED=2*10-3 m2/W, for k*t>

0.025 W/K,

where QLED is the thermal power generated by a single LED light source;

k is the thermal conductivity of the conductive material; and

t is the thickness of the conductive material.

10. The LED luminaire of claim 1, the housing comprising a non-thermally enhanced plastic material.

11. The LED luminaire of claim 10, wherein the non-thermally enhanced plastic material has a thermal conductivity of less than about 0.5 W/m-K.

12. The LED luminaire of claim 1, wherein the housing comprises a plastic material with enhanced thermal conductivity.

13. The LED luminaire of claim 12, wherein the plastic material with enhanced thermal conductivity has a thermal conductivity equal or greater than about 0.5 W/m-K.

14. The LED luminaire of claim 1, including the PCB is self-cooling and structured to have a surface area and a conductive layer thickness sufficient to dissipate the heat generated by the plurality of LED light sources.

15. The LED luminaire of claim 1, including the quantity of thermal pads determined by the thermal load of heat generated, where a thermal pad for one of the plurality of LED light sources has a surface area in square meters calculated by the expression A/QLED=2*10-3 m2/W, for k*t>

0.025 W/K,

where QLED is the thermal power generated by a single LED light source;

k is the thermal conductivity of the conductive material; and

t is the thickness of the conductive material.