Micromechanical sensor device
First Claim
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1. A micromechanical sensor device, comprising:
- a first unhoused sensor unit; and
at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit;
wherein;
the sensor units are functionally connected to one another,the sensor units are essentially vertically configured one over the other so that the first sensor unit completely covers the second sensor unit,the sensor units are functionally connected to one another by first solder bumps,the sensor device externally contactable by second solder bumps, anda vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit.
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Abstract
A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.
15 Citations
11 Claims
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1. A micromechanical sensor device, comprising:
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a first unhoused sensor unit; and at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit; wherein; the sensor units are functionally connected to one another, the sensor units are essentially vertically configured one over the other so that the first sensor unit completely covers the second sensor unit, the sensor units are functionally connected to one another by first solder bumps, the sensor device externally contactable by second solder bumps, and a vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for producing a micromechanical sensor device, the method comprising:
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forming a first unhoused sensor unit; forming at least one second unhoused sensor unit, the second unhoused sensor unit having a smaller footprint than the first unhoused sensor unit; functionally connecting the sensor units; and vertically configuring, relative to one another, the first and second sensor units, so that the first and second sensor units are essentially configured vertically one over the other so that first sensor unit completely covers the second sensor unit having a smaller footprint, wherein; the sensor units are functionally connected to one another by first solder bumps, the sensor device externally contactable by second solder bumps, and a vertical extension of the second solder bumps is larger than an overall vertical extension of the first solder bumps and the second sensor unit. - View Dependent Claims (11)
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Specification