Heat transfer device
First Claim
Patent Images
1. A device comprising:
- a housing that is moveable through a plurality of orientations involving at least two dimensions during usage;
a heat-generating device disposed within the housing; and
a heat transfer device disposed within the housing comprising;
a thermal storage enclosure disposed proximal to the heat-generating device and configured to transfer heat from the heat-generating device using thermal conductivity and phase transition by a phase change material included within the thermal storage enclosure, the phase change material configured to undergo the phase transition at a temperature above a first temperature achieved by the heat-generating device operating at a low power state and below a second temperature achieved by the heat-generating device operating at a high power state; and
a plurality of enclosed heat pipes configured to;
transfer heat using thermal conductivity and phase transition from the thermal storage enclosure;
the plurality of enclosed heat pipes arranged to;
transfer heat from the heat-generating device during movement of the housing through the plurality of orientations;
the plurality of enclosed heat pipes including;
first and second heat pipes arranged in opposing directions, each of the first and second heat pipes having an evaporator portion and a condenser portion, the condenser portions of the first and second heat pipes are positioned further from each other than the evaporator portions of the first and second heat pipes, each of the plurality of enclosed heat pipes including the same phase change material within the thermal storage enclosure or a different phase change material configured to undergo a different phase transition than the phase transition of the phase change material within the thermal storage enclosure.
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Accused Products
Abstract
A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.
342 Citations
20 Claims
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1. A device comprising:
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a housing that is moveable through a plurality of orientations involving at least two dimensions during usage; a heat-generating device disposed within the housing; and a heat transfer device disposed within the housing comprising; a thermal storage enclosure disposed proximal to the heat-generating device and configured to transfer heat from the heat-generating device using thermal conductivity and phase transition by a phase change material included within the thermal storage enclosure, the phase change material configured to undergo the phase transition at a temperature above a first temperature achieved by the heat-generating device operating at a low power state and below a second temperature achieved by the heat-generating device operating at a high power state; and a plurality of enclosed heat pipes configured to; transfer heat using thermal conductivity and phase transition from the thermal storage enclosure; the plurality of enclosed heat pipes arranged to; transfer heat from the heat-generating device during movement of the housing through the plurality of orientations; the plurality of enclosed heat pipes including; first and second heat pipes arranged in opposing directions, each of the first and second heat pipes having an evaporator portion and a condenser portion, the condenser portions of the first and second heat pipes are positioned further from each other than the evaporator portions of the first and second heat pipes, each of the plurality of enclosed heat pipes including the same phase change material within the thermal storage enclosure or a different phase change material configured to undergo a different phase transition than the phase transition of the phase change material within the thermal storage enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A heat transfer device comprising:
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a thermal storage enclosure disposed proximal to a heat-generating device and configured to transfer heat from the heat-generating device using thermal conductivity and an amount of phase change material included within the thermal storage enclosure, the heat-generating device operates in a low power state configured to lessen resources utilized by the heat-generating device or a high power state configured to increase resources utilized by the heat-generating device, the phase change material configured to melt at a temperature above a first temperature achieved by the heat-generating device during the low power state and below a second temperature achieved by the heat-generating device during the high power state; and first and second enclosed heat pipes configured to transfer heat using thermal conductivity and phase transition from the thermal storage enclosure, the first and second enclosed heat pipes arranged to transfer heat from the heat-generating device towards opposing sides of a computing device, each of the first and second heat pipes having an evaporator portion and a condenser portion, the condenser portions of the first and second heat pipes are positioned further from each other than the evaporator portions of the first and second heat pipes, each of the first and second heat pipes including the same phase change material within the thermal storage enclosure or a different phase change material configured to undergo a different phase transition than the phase transition of the phase change material within the thermal storage enclosure. - View Dependent Claims (11, 12, 13, 15)
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14. A computing device comprising:
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a housing configured in a handheld form factor that is sized to be held by one or more hands of a user; a processing system disposed within the housing; a heat transfer device disposed proximal to the processing system in the housing and configured to transfer heat in opposing directions away from the processing system and comprising; a thermal storage enclosure configured to transfer heat from the processing system using thermal conductivity and an amount of phase change material included within the thermal storage enclosure, the phase change material configured to undergo a phase transition at a temperature above a first temperature achieved by the processing system operating at a low power state and below a second temperature achieved by the processing system operating at a high power state; a plurality of enclosed heat pipes including first and second heat pipes arranged in opposing directions, each of the first and second heat pipes having an evaporator portion and a condenser portion, the condenser portions of the first and second heat pipes are positioned further from each other than the evaporator portions of the first and second heat pipes, each of the plurality of enclosed heat pipes including the same phase change material within the thermal storage enclosure or a different phase change material configured to undergo a different phase transition than the phase transition of the phase change material within the thermal storage enclosure; and a plurality of fans disposed within the housing, at least two of which positioned at the opposing directions of the heat transfer device, respectively, and configured to increase speed of the plurality of fans when the temperature that causes the phase change material to undergo the phase transition is exceeded. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification