Heat sink base and shield
First Claim
Patent Images
1. A heat sink comprising:
- a metal base to be mounted to a circuit board of a computing system and to receive a component, wherein the metal base is to thermally contact a first face of the component; and
a metal shield pivotally attached to the metal base, the metal shield to thermally contact a second face of the component, the second face opposite of the first face on the component, wherein the metal shield is pivotable between an open position with respect to the metal base and a closed position with respect to the metal base,wherein when the metal shield is pivoted to the open position, the component is insertable into a space between the metal base and the metal shield, andwherein the metal shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the metal shield and the metal base.
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Accused Products
Abstract
A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.
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Citations
17 Claims
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1. A heat sink comprising:
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a metal base to be mounted to a circuit board of a computing system and to receive a component, wherein the metal base is to thermally contact a first face of the component; and a metal shield pivotally attached to the metal base, the metal shield to thermally contact a second face of the component, the second face opposite of the first face on the component, wherein the metal shield is pivotable between an open position with respect to the metal base and a closed position with respect to the metal base, wherein when the metal shield is pivoted to the open position, the component is insertable into a space between the metal base and the metal shield, and wherein the metal shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the metal shield and the metal base. - View Dependent Claims (2, 3, 4, 5)
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6. A heat sink comprising:
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a base to be mounted to a computing system and to receive a component, wherein the base is to thermally couple a first face of the component; and a shield to thermally couple a second face of the component, wherein the shield is pivotably attached to the base, the shield pivotable between an open position with respect to the base and a closed position with respect to the base, wherein when the shield is pivoted to the open position, the component is insertable into a space between the base and the shield, and wherein the shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the shield and the base. - View Dependent Claims (7, 8, 9, 10)
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11. A computing system comprising:
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a printed circuit board (PCB); a component; a base securing the component to the PCB, wherein the base is to transfer heat from a first face of the component; and a shield pivotably attached to the base, wherein the shield is to transfer heat from a second face of the component, wherein the shield is pivotable between an open position with respect to the base and a closed position with respect to the base, wherein the component is insertable into a space between the base and the shield when the shield is pivoted to the open position, and wherein the shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the shield and the base. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification