Surface temperature management method of mobile device and memory thermal management method of multichip package

• US 9,606,591 B2
• Filed: 09/14/2012
• Issued: 03/28/2017
• Est. Priority Date: 10/10/2011
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kwon, Heungkyu, Kim, Jae Choon, Cho, Eunseok, Kim, Jichul
• Primary Examiner(s): Kaplan Verbitsky, Gail
• Application Number:
  US13/617,619
• Publication Number:
  US 20130091348A1
• Time in Patent Office: 1,656 Days
• Field of Search: 374/208, 374/178, 374/1, 374/29, 374/30, 374/44, 374/45, 374/4, 374/140, 374/5, 702/130, 702/99, 327/512, 327/513, 700/300, 713/600, 713/501, 713/503, 455/550.1
• US Class Current: 1/1
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: G05B 15/02 electric
• CPC Class Codes: G06F 1/206 comprising thermal management

Abstract

A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

Claims

1. A surface temperature management method of a mobile device, the method comprising:

sensing, by a temperature measurement unit, a first temperature of an application processor performing a first function of the mobile device;

decreasing, by a dynamic thermal management module, at least one among an operation frequency and a frame rate of the application processor performing the first function in response to the sensed first temperature being greater than or equal to a first target high temperature of the application processor performing the first function, the first function and the first target high temperature of the application processor performing the first function being preset in a surface temperature management table to manage a surface temperature of a target part of the mobile device;

sensing, by the temperature measurement unit, a second temperature of the application processor performing a second function of the mobile device, the second function being different than the first function; and

decreasing, by the dynamic thermal management module, at least one among the operation frequency and the frame rate of the application processor performing the second function, in response to the sensed second temperature being greater than or equal to a second target high temperature of the application processor performing the second function, the second function and the second target high temperature of the application processor performing the second function being preset in the surface temperature management table to manage the surface temperature of the target part of the mobile device,

wherein the surface temperature management table comprises surface temperature information, application processor temperature information, application processor operation frequency control information and frame rate control information in accordance with an operation mode.

2. The surface temperature management method of claim 1, wherein the sensing the first temperature of the application processor performing the first function comprises sensing, by the temperature measurement unit, a junction temperature of the application processor performing the first function.

3. The surface temperature management method of claim 1, further comprising decreasing, by the dynamic thermal management module, at least one among the operation frequency and the frame rate of the application processor performing the first function, in response to the sensed first temperature being less than the first target high temperature of the application processor performing the first function and the sensed first temperature being greater than or equal to a second target high temperature of the application processor performing the first function, the second target high temperature of the application processor performing the first function being preset in the surface temperature management table.

4. The surface temperature management method of claim 1, further comprising increasing, by the dynamic thermal management module, at least one among the operation frequency and the frame rate of the application processor performing the first function, in response to the sensed first temperature being less than the first target high temperature of the application processor performing the first function and the sensed first temperature being less than or equal to a target low temperature of the application processor performing the first function, the target low temperature of the application processor performing the first function being preset in the surface temperature management table.

5. The surface temperature management method of claim 1, further comprising setting, by the dynamic thermal management module, an operation frequency of the application processor performing the first function to be a first minimum operation frequency, in response to the sensed first temperature being greater than or equal to the first target high temperature of the application processor performing the first function, the first minimum operation frequency being preset in the surface temperature management table.

6. The surface temperature management method of claim 5, further comprising setting, by the dynamic thermal management module, the operation frequency of the application processor performing the first function to be a second minimum operation frequency greater than the first minimum operation frequency, in response to the sensed first temperature being less than the first target high temperature of the application processor performing the first function and the sensed first temperature being greater than or equal to a second target high temperature of the application processor performing the first function, the second minimum operation frequency and the second target high temperature of the application processor performing the first function being preset in the surface temperature management table.

7. The surface temperature management method of claim 1, further comprising setting, by the dynamic thermal management module, an operation frequency of the application processor performing the first function to be a maximum operation frequency, in response to the sensed first temperature being less than the first target high temperature of the application processor performing the first function and the sensed first temperature being less than or equal to a target low temperature of the application processor performing the first function, the maximum operation frequency and the target low temperature of the application processor performing the first function being preset in the surface temperature management table.