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Pretreatment method for photoresist wafer processing

  • US 9,607,822 B2
  • Filed: 09/13/2016
  • Issued: 03/28/2017
  • Est. Priority Date: 04/21/2014
  • Status: Active Grant
First Claim
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1. A method of removing photoresist scum and electroplating metal into photoresist features, the method comprising:

  • (a) receiving a substrate in a multi-tool electroplating apparatus, the multi-tool electroplating apparatus comprising;

    (i) at least one plasma treatment module comprising a plasma treatment chamber and a plasma generation chamber connected to the plasma treatment chamber; and

    (ii) at least one electroplating module comprising an electroplating chamber;

    wherein the substrate comprises;

    (i) a metal seed layer, and(ii) a layer of photoresist over and directly in contact with the metal seed layer, wherein the layer of photoresist comprises photoresist features patterned therein, and wherein a bottom of the photoresist features comprise photoresist scum;

    (b) generating a reducing plasma from a reducing plasma generation gas in the plasma generation chamber;

    (c) flowing the reducing plasma from the plasma generation chamber into the plasma treatment chamber to thereby expose the substrate to the reducing plasma, react the photoresist scum with the reducing plasma, and remove at least a portion of the photoresist scum; and

    (d) transferring the substrate to the electroplating module and electroplating metal on the metal seed layer in the photoresist features.

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