Molded composite enclosure for integrated circuit assembly

• US 9,607,914 B2
• Filed: 05/15/2014
• Issued: 03/28/2017
• Est. Priority Date: 05/15/2014
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Gwin, Paul J.
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US14/434,239
• Publication Number:
  US 20160268178A1
• Time in Patent Office: 1,048 Days
• Field of Search: 257/704, 257/713, 257/778
• US Class Current: 1/1
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16113 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/06 : Polymers polymers per se C08; polymer adhesives C09J
• CPC Class Codes: H01L 2924/0615 : Styrenic polymer
• CPC Class Codes: H01L 2924/0635 : Acrylic polymer
• CPC Class Codes: H01L 2924/065 : ABS
• CPC Class Codes: H01L 2924/068 : Polycarbonate
• CPC Class Codes: H01L 2924/069 : Polyurethane
• CPC Class Codes: H01L 2924/0695 : Polyamide
• CPC Class Codes: H01L 2924/0705 : Sulfur containing polymer
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1438 : Flash memory
• CPC Class Codes: H01L 2924/1443 : Non-volatile random-access memory [NVRAM]
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1617 : Cavity coating
• CPC Class Codes: H01L 2924/16176 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/1619 : Cavity coating shape
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.

Claims

1. An enclosure for an integrated circuit (IC) assembly, the enclosure comprising:

a composite lid structure having

a body portion, and

a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly is thermally coupled with the contiguous exterior material through the opening.

2. The enclosure of claim 1, wherein the IC assembly includes heat-generating elements of a solid-state drive (SSD).

3. The enclosure of claim 1, wherein the opening is one of multiple openings formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the multiple openings.

4. The enclosure of claim 1, wherein the polymer is selected from a group consisting of ABS (Acrylonitrile Butadiene Styrene), ABS +PC (ABS +Polycarbonate), Acetal (POM), Acrylic (PMMA), LCP (Liquid Crystal Polymer), PA-Nylon 6 (Polyamide), PA-Nylon 6/6 (Polyamide), PA-Nylon 11 (Polyamide), PBT (Polybutylene Terepthalate), PC (Polycarbonate), PEI (Polyetherimide), PE (Polyethylene), LDPE (Low Density Polyethylene), HDPE (High Density Polyethylene), PET (Polyethylene Terepthalate), PP (Polypropylene), PPA (Polyphthalamide), PPS (Polyphenylene Sulfide), PS (Polystyrene), HIPS (High Impact Polystyrene), PSU (Polysulfone), PU (Polyurethane), PVC (Polyvinylchloride), PVDF (Polyvinylidene Fluoride), SAN (Styrene Acrylonitrile), TPE (Thermoplastic Elastomer) and TPU (Thermoplastic Polyurethane).

5. The enclosure of claim 1, wherein the metal is selected from a group consisting of aluminum (Al), iron (Fe), titanium (Ti), copper (Cu), nickel (Ni), magnesium (Mg), stainless steel and Inconel.

6. The enclosure of claim 1, further comprising:

a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.

7. The enclosure of claim 6, wherein the primer material comprises a polymer or nano-structured metal oxide.

8. The enclosure of claim 1, further comprising:

a base structure configured to couple with the molded lid structure such that the cavity is disposed between the base structure and the molded lid structure when the base structure is coupled with the molded lid structure.

9. The enclosure of claim 1, wherein the molded lid structure has a rectangular profile.

10. A solid-state drive (SSD) comprising:

a composite lid structure having

a body portion, and

a side portion that extends from the body portion and forms a cavity configured to house an integrated circuit (IC) assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion;

a base structure coupled with the molded lid structure such that the cavity is disposed between the base structure and the molded lid structure; and

the IC assembly being disposed between the base structure and the molded lid structure, wherein the IC assembly is thermally coupled with the contiguous exterior material of the molded lid structure through the opening.

11. The SSD of claim 10, wherein:

the opening is one of multiple openings formed in the body portion; and

the IC assembly is thermally coupled with the contiguous exterior material through the multiple openings.

12. The SSD of claim 10, further comprising:

a primer material disposed between the contiguous interior material and the contiguous exterior material to promote adhesion between the contiguous interior material and the contiguous exterior material.