Printed circuit board assembly methods

• US 9,609,756 B2
• Filed: 10/01/2014
• Issued: 03/28/2017
• Est. Priority Date: 01/05/2010
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Call, Norman L., Chavez, Jose M., Chavez, Rodolfo
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US14/504,208
• Publication Number:
  US 20150090390A1
• Time in Patent Office: 909 Days
• US Class Current: 1/1
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A method includes aligning a first portion of a magnetic core with respect to a first side of a PCB using a first alignment device. The method includes applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core. The method further includes coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device. When the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position. The specified assembly position includes a specified gap between the first portion and the second portion of the magnetic core. The method also includes curing the first bonding material.

Claims

1. A method comprising:

aligning a first portion of a magnetic core with respect to a first side of a printed circuit board (PCB) using a first alignment device;

applying a first bonding material to a surface of at least one of the first portion of the magnetic core and a second portion of the magnetic core;

coupling a second alignment device that retains the second portion of the magnetic core to the first alignment device, wherein, when the first alignment device and the second alignment device are coupled, the first portion and the second portion of the magnetic core are retained in a specified assembly position, the specified assembly position including a gap between the first portion and the second portion of the magnetic core;

adjusting the gap between the first portion and the second portion of the magnetic core by adjustment of the first alignment device or the second alignment device; and

curing the first bonding material.

2. The method of claim 1, further comprising applying a release layer to at least one of the first alignment device and the second alignment device before curing the first bonding material.

3. The method of claim 1, further comprising inserting a filler between the first portion of the magnetic core and the second portion of the magnetic core before curing the first bonding material.

4. The method of claim 1, wherein aligning the first portion of the magnetic core with respect to the first side of the PCB comprises simultaneously aligning a plurality of magnetic core bottoms with respect to the PCB.

5. The method of claim 4, wherein, when the first alignment device and the second alignment device are coupled, the plurality of magnetic core bottoms are simultaneously retained with respect to a corresponding plurality of magnetic core tops.

6. The method of claim 5, wherein curing the first bonding materials bonds each of the plurality of magnetic core bottoms to one of the corresponding plurality of magnetic core tops.

7. The method of claim 1, wherein the first alignment device comprises a biasing member configured to move the first portion of the magnetic core toward the PCB.

8. The method of claim 7, wherein the second alignment device comprises a biasing member configured to move the second portion of the magnetic core toward the PCB.

9. The method of claim 1, wherein the first alignment device includes a spacer that retains the first portion of the magnetic core at the specified assembly position relative to the PCB.

10. The method of claim 1, wherein the second alignment device is coupled to the first alignment device by coupling a retaining member to the first alignment device and the second alignment device, wherein the retaining member secures the first alignment device and second alignment device in the specified assembly position.

11. The method of claim 1, wherein the first alignment device includes a first moveable member to retain the first portion of the magnetic core.

12. The method of claim 1, wherein the second alignment device includes a spacer that retains the second portion of the magnetic core at a specified assembly position relative to the PCB.

13. The method of claim 1, wherein the second alignment device includes a second moveable member to retain the second portion of the magnetic core.