Step-down coaxial microwave ablation applicators and methods for manufacturing same

• US 9,610,122 B2
• Filed: 03/28/2014
• Issued: 04/04/2017
• Est. Priority Date: 03/29/2013
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Covidien LP (Medtronic Plc)
• Inventors: Brannan, Joseph D.
• Primary Examiner(s): CAZAN, LIVIUS RADU
• Application Number:
  US14/228,775
• Publication Number:
  US 20140290830A1
• Time in Patent Office: 1,103 Days
• CPC Class Codes: A61B 18/1815 using microwaves
• CPC Class Codes: A61B 2017/00526 Methods of manufacturing
• CPC Class Codes: A61B 2018/00577 Ablation
• CPC Class Codes: A61B 2018/1861 with an instrument inserted into a body lumen or cavity, e.g. a catheter
• CPC Class Codes: A61B 2018/1892 Details of electrical isolations of the antenna
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Microwave ablation applicators and methods for manufacturing the microwave ablation applicators are disclosed. A microwave ablation applicator includes a feed-line segment, a step-down segment, and a radiator base segment. The feed-line segment includes a first inner conductor, a first dielectric disposed on the first inner conductor, and a first outer conductor disposed on the first dielectric. The step-down segment includes a second inner conductor, a second dielectric disposed on the second inner conductor, and a second outer conductor disposed on the second dielectric. The radiator base segment includes a third inner conductor disposed on the third inner conductor, a third outer conductor disposed on the proximal end of the third dielectric so as to form a feed gap at a distal end of the radiator base segment, a balun dielectric disposed on the third outer conductor, and a balun outer conductor disposed on the balun dielectric.

Claims

1. A method for manufacturing a microwave ablation applicator, the method comprising:

forming a feed-line segment by (a) disposing a first dielectric on the outer surface of a first inner conductor, the first dielectric having a first face in a plane perpendicular to the longitudinal axis of the first inner conductor, and (b) disposing an outer conductor on the outer surface of the first dielectric;

forming a step-down segment by (a) disposing a second dielectric on the outer surface of a second inner conductor, the second dielectric having a diameter less than the diameter of the first dielectric, and (b) disposing a second outer conductor on the outer surface of the second dielectric; and

forming a radiator base segment by (a) disposing a third dielectric on the outer surface of a third inner conductor, the third dielectric having a diameter less than the diameter of the first dielectric, (b) disposing a third outer conductor on the outer surface of a proximal end of the third dielectric so as to form a feed gap at a distal end of the third dielectric, (c) disposing a balun dielectric on the outer surface of the third outer conductor, and (d) disposing a balun outer conductor on the outer surface of the balun dielectric.

2. A method of manufacturing a microwave ablation applicator, the method comprising:

disposing a first dielectric on the outer surface of a first portion of an inner conductor;

disposing a first outer conductor on the outer surface of the first dielectric;

disposing a second dielectric on the outer surface of a second portion of the inner conductor distally adjacent to the first portion of the inner conductor, the second dielectric having a diameter less than the diameter of the first dielectric;

disposing a second outer conductor on the outer surface of the second dielectric;

disposing a third dielectric on the outer surface of a third portion of the inner conductor, the third dielectric having a diameter less than the diameter of the first dielectric;

disposing a third outer conductor on the outer surface of a proximal end of the third dielectric so as to form a feed gap at a distal end of the third dielectric;

disposing a balun dielectric on the outer surface of the third outer conductor; and

disposing a balun outer conductor on the outer surface of a proximal end of the balun dielectric.

3. The method according to claim 2, wherein the first, second, and third dielectrics are made of the same dielectric material.

4. The method according to claim 2, wherein disposing a dielectric on a portion of a conductor includes at least one of sliding the dielectric onto the portion of the conductor, heat shrinking the dielectric onto the portion of the conductor, and wrapping the dielectric around the portion of the conductor.

5. The method according to claim 2, wherein disposing an outer conductor on a dielectric includes placing a braid on the dielectric.

6. The method according to claim 2, wherein disposing the third outer conductor includes placing a braid on the third dielectric and stripping the braid from a distal portion of the radiator base segment to form the feed gap.

7. A method of manufacturing a microwave ablation applicator, the method comprising:

removing dielectric material from a middle portion of a rod including a dielectric surrounding an inner conductor so that the middle portion of the rod has a diameter less than the diameter of a proximal portion of the rod adjacent to the middle portion;

removing dielectric material from a distal portion of the rod adjacent to the middle portion of the rod so that the distal portion of the rod has a diameter less than the diameter of a middle portion of the rod;

disposing a first outer conductor on the outer surface of the proximal portion of the rod;

disposing a second outer conductor on the outer surface of the middle portion of the rod;

disposing a third outer conductor on the outer surface of a proximal end of the distal portion of the rod so as to form a feed gap at a distal end of the distal portion of the rod;

disposing a balun dielectric on the outer surface of the third outer conductor; and

disposing a balun outer conductor on the outer surface of a proximal end of the balun dielectric.

8. The method according to claim 7, further comprising disposing the dielectric on the outer surface of the inner conductor to form a rod.

9. The method according to claim 8, wherein disposing the dielectric on the outer surface of an inner conductor to form a rod includes wrapping a dielectric tape around the outer surface of the inner conductor.

10. The method according to claim 9, wherein removing dielectric material includes unwrapping a portion of the dielectric tape.

11. The method according to claim 7, further comprising attaching a radiating section onto the inner conductor of the radiator base segment.

12. The method according to claim 11, wherein attaching the radiating section onto the inner conductor of the radiator base segment includes crimping, soldering, or welding.

13. The method according to claim 7, wherein dielectric material is removed from the middle portion of the rod so that the diameter of the middle portion tapers from a first diameter at a proximal end of the middle portion to a second diameter at a distal end of the middle portion, the first diameter being greater than the second diameter.

14. The method according to claim 7, wherein dielectric material is removed from the middle portion of the rod so as to form a plurality of steps having different diameters less than the diameter of the proximal portion of the rod.

15. The method according to claim 14, further comprising disposing ferrules between steps to smooth the transition between steps.

16. The method according to claim 15, wherein the ferrules are disposed on the faces of the steps to smooth the transition between steps.

17. The method according to claim 7, wherein dielectric material is removed from a distal portion of the rod so that the outer diameter of the balun outer conductor is less than the diameter of the outer diameter of the first outer conductor.