Thermal interface material with mixed aspect ratio particle dispersions

• US 9,611,414 B2
• Filed: 07/11/2014
• Issued: 04/04/2017
• Est. Priority Date: 07/11/2014
• Status: Active Grant

• Current Assignee: Henkel AG & Co KGaA
• Original Assignee: Henkel IP & Holding GmbH (Henkel AG & Co KGaA)
• Inventors: Timmerman, John, Misra, Sanjay
• Primary Examiner(s): Diggs, Tanisha
• Application Number:
  US14/328,834
• Publication Number:
  US 20160009975A1
• Time in Patent Office: 998 Days
• Field of Search: None
• CPC Class Codes: C08K 2003/2227 of aluminium
• CPC Class Codes: C08K 2003/382 and nitrogen
• CPC Class Codes: C08K 2003/385 Binary compounds of nitrogen with boron
• CPC Class Codes: C08K 2201/001 Conductive additives
• CPC Class Codes: C08K 2201/016 Additives defined by their aspect ratio
• CPC Class Codes: C08K 3/042 Graphene or derivatives, e.g. graphene oxides
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/38 Boron-containing compounds
• CPC Class Codes: C08K 7/04 inorganic
• CPC Class Codes: C08K 7/18 inorganic
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Claims

1. A thermal interface material positionable in proximity to a heat source for thermal dissipation from the heat source and for shielding of electromagnetic interference, said thermal interface material comprising:

a polymer matrix; and

thermally conductive particulate filler dispersed in said polymer matrix at 40-50% by volume, said particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a spherical particle diameter, and platelet particles having a length, a width, and a thickness and a platelet particle diameter, wherein said length and said width are each greater than said thickness, said platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said platelet particles to said spherical alumina particles being between 0.1;

1 and 0.2;

1, and a particle diameter ratio of said platelet particle diameter to said spherical particle diameter being between 1;

1 and 20;

1, said platelet particles consist of boron nitride,

wherein said thermal interface material exhibits a thermal conductivity of at least 0.5 W/m*K, and a compressive modulus of less than 5 MPa at 20°

C.

2. A thermal interface material as in claim 1 which exhibits an electromagnetic radiation absorption of at least 10 dB/in at 2.4 GHz.

3. A thermal interface material as in claim 1 wherein said platelet particles have an aspect ratio of at least 100.

4. A thermal interface material as in claim 3 wherein said length and said width of said platelet particles are about equal.

5. A thermal interface material as in claim 1 wherein said polymer matrix is a thermoplastic elastomer.

6. An electronic package, comprising:

an electronic component;

a heat dissipation member; and

the thermal interface material of claim 1 disposed between and in contact with said electronic component and said heat dissipation member.

7. A thermal interface material positionable in proximity to a heat source for thermal dissipation from the heat source and for shielding of electromagnetic interference, said thermal interface material comprising:

a polymer matrix; and

thermally conductive particulate filler dispersed in said polymer matrix at 25-45% by volume, said particulate filler including substantially spherical alumina particles having an aspect ratio between 0.8-1.2 and a spherical particle diameter, and platelet particles having a length, a width, and a thickness and a platelet particle diameter, wherein said length and said width are each greater than said thickness, said platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said platelet particles to said spherical alumina particles being between 0.1;

1 and 0.2;

1, and a particle diameter ratio of said platelet particle diameter to said spherical particle diameter being between 1;

1 and 10;

1, said platelet consists of graphene,

wherein said thermal interface material exhibits a thermal conductivity of at least 0.5 W/m*K, and a compressive modulus of less than 5 MPa at 20°

C.

8. A thermal interface material as in claim 7 which exhibits an electromagnetic radiation absorption of at least 10 dB/in at 2.4 GHz.

9. A thermal interface material as in claim 7 wherein said platelet particles have an aspect ratio of at least 100.

10. A thermal interface material as in claim 9 wherein said length and said width of said platelet particles are about equal.

11. A thermal interface material as in claim 7 wherein said polymer matrix is a thermoplastic elastomer.

12. A thermal interface material as in claim 7 wherein said thermally conductive filler is dispersed in said polymer matrix at 35-45% by volume.

13. An electronic package, comprising:

an electronic component;

a heat dissipation member; and

the thermal interface material of claim 7 disposed between and in contact with said electronic component and said heat dissipation member.