Plating method and plating apparatus

• US 9,611,563 B2
• Filed: 04/12/2016
• Issued: 04/04/2017
• Est. Priority Date: 03/27/2012
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Minami, Yoshio, Fujikata, Jumpei, Kishi, Takashi
• Primary Examiner(s): West, Paul
• Assistant Examiner(s): Shabman, Mark A
• Application Number:
  US15/096,972
• Publication Number:
  US 20160222540A1
• Time in Patent Office: 357 Days
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/004 Sealing devices
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: G01M 3/20 using special tracer materials, e.g. dye, fluorescent material, radioactive material
• CPC Class Codes: G01M 3/26 by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
• CPC Class Codes: G01M 3/3263 using a differential pressure detector G01M3/3245, G01M3/3272 take precedence
• CPC Class Codes: G01M 3/3281 removably mounted in a test cell
• CPC Class Codes: G01M 3/34 by testing the possibility of maintaining the vacuum in containers, e.g. in can-testing machines

Abstract

A plating method includes holding a substrate with a substrate holder while bringing a sealing member into pressure contact with a peripheral portion of the substrate to form an enclosed internal space in the substrate holder; performing a first-stage leakage test of the substrate holder by producing a vacuum in the internal space and checking whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time; and if the substrate holder has passed the first-stage leakage test, performing a second-stage leakage test of the substrate holder by closing off the internal space after producing the vacuum therein and checking whether a change in the pressure in the internal space reaches a predetermined value within a certain period of time.

Claims

1. A method of plating a substrate while holding the substrate by a substrate holder having a first holding member and a second holding member which has an opening, said method comprising:

holding the substrate with the substrate holder by supporting one surface of the substrate with the first holding member while placing the second holding member in contact with other surface of the substrate, with the other surface of the substrate exposed through the opening of the second holding member;

sealing a gap between the first holding member and the second holding member by a first protruding portion of the second holding member while sealing a peripheral portion of the substrate by a second protruding portion of the second holding member when the substrate is held by the substrate holder, thereby forming an internal space in the substrate holder by the first holding member, the second holding member, and the substrate;

covering with a seal case the other surface of the substrate exposed through the opening;

sealing a gap between the first holding member and the seal case to form a hermetic space between the substrate holder and the seal case; and

performing a leakage test by supplying a tracer gas into the hermetic space while evacuating air from the internal space and checking whether the air evacuated from the internal space contains the tracer gas.

2. The method according to claim 1, wherein:

sealing the gap between the first holding member and the seal case is performed while sealing a gap between the second holding member and the seal case to divide the hermetic space into a substrate-side hermetic space in which the second protruding portion is located and a holder-side hermetic space in which the first protruding portion is located; and

the tracer gas is supplied into at least one of the substrate-side hermetic space and the holder-side hermetic space.

3. The method according to claim 1, wherein the leakage test is performed in a substrate loading unit for loading the substrate, to be plated, into the substrate holder.

4. An apparatus for plating a substrate, comprising:

a substrate holder including a first holding member and a second holding member which has an opening, the substrate holder being configured to hold a substrate by supporting one surface of the substrate with the first holding member while placing the second holding member in contact with other surface of the substrate, with the other surface of the substrate exposed through the opening of the second holding member, the second holding member having a first protruding portion configured to seal a gap between the first holding member and the second holding member and a second protruding portion configured to seal a peripheral portion of the substrate when the substrate is held by the substrate holder to form an internal space in the substrate holder by the first holding member, the second holding member, and the substrate, the substrate holder having an internal passage communicating with the internal space;

a suction coupling coupled to a suction line extending from a vacuum source and detachably mounted to the substrate holder so as to communicate with the internal passage;

a pressure sensor configured to check whether pressure in the internal space reaches a predetermined vacuum pressure within a certain period of time when producing a vacuum in the internal space through the suction line;

a pressure change detection section configured to detect a change in the pressure in the internal space after the vacuum is produced in the internal space and the internal space is closed off;

a seal case capable of covering the other surface of the substrate exposed through the opening of the second holding member;

a tracer gas sealing member configured to seal a gap between the first holding member and the seal case to form a hermetic space between the substrate holder and the seal case;

a tracer gas introduction device configured to introduce a tracer gas into the hermetic space; and

a tracer gas tester configured to detect whether the tracer gas is contained in a gas flowing through the suction line.

5. The apparatus according to claim 4, wherein the pressure change detection section includes:

a master container which is assured that any leakage does not occur and is coupled to the vacuum source; and

a differential pressure sensor configured to measure a differential pressure between the pressure in the master container and the pressure in the internal space.

6. The apparatus according to claim 4, further comprising:

a partition sealing member configured to seal a gap between the second holding member and the seal case to divide the hermetic space into a substrate-side hermetic space in which the second protruding portion is located and a holder-side hermetic space in which the first protruding portion is located.

7. The apparatus according to claim 6, wherein the tracer gas introduction device comprises a first tracer gas introduction device and a second tracer gas introduction device which are in fluid communication with the holder-side hermetic space and the substrate-side hermetic space, respectively, and the first tracer gas introduction device and the second tracer gas introduction device are configured to supply the tracer gas into the holder-side hermetic space and the substrate-side hermetic space independently.