Red omnidirectional structural color made from metal and dielectric layers

• US 9,612,369 B2
• Filed: 08/28/2014
• Issued: 04/04/2017
• Est. Priority Date: 08/12/2007
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation), Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Banerjee, Debasish, Zhang, Minjuan, Ishii, Masahiko
• Primary Examiner(s): Kakalec, Kimberly N
• Application Number:
  US14/471,834
• Publication Number:
  US 20140368918A1
• Time in Patent Office: 950 Days
• Field of Search: 359577-590, 428620, 428621, 428622, 428623, 428641
• CPC Class Codes: C09C 1/0015 Pigments exhibiting interference colours, e.g. transparent platelets of appropriate thinness or flaky substrates, e.g. mica, bearing appropriate thin transparent coatings
• CPC Class Codes: G02B 5/0825 the reflecting layers comprising dielectric materials only
• CPC Class Codes: G02B 5/0858 the reflecting layers comprising a single metallic layer with one or more dielectric layers

Abstract

A multilayer stack displaying a red omnidirectional structural color. The multilayer stack includes a core layer, a semiconductor layer extending across the core layer, and a dielectric layer extending across the semiconductor layer. The semiconductor layer absorbs more than 70% of incident white light that has a wavelength less than 550 nanometers (nm). In addition, the dielectric layer in combination with the core layer reflects more than 70% of the incident white light with a wavelength greater than 550 nm. In combination, the core layer, semiconductor layer and dielectric layer form an omnidirectional reflector that reflects a narrow band of electromagnetic radiation with a center wavelength between 550-700 nm, has a width of less than 200 nm wide and a color shift of less than 100 nm when the reflector is viewed from angles between 0 and 45 degrees.

Claims

1. A multilayer stack displaying a red omnidirectional structural color comprising:

a core layer;

a semiconductor layer extending across said core layer, said semiconductor layer absorbing more than 70% of incident white light with wavelengths less than 550 nm; and

a dielectric layer extending across said semiconductor layer, said dielectric layer and said core layer reflecting more than 70% of said incident white light with wavelengths greater than 550 nm;

said core layer, semiconductor layer and dielectric layer forming an omnidirectional reflector, said omnidirectional reflector reflecting a single narrow band of visible electromagnetic radiation with a center wavelength between 550-700 nm, a width of less than 200 nm wide, a color shift of less than 100 nm and displaying a red omnidirectional structural color when said omnidirectional reflector is viewed from angles between 0 and 45degrees.

2. The multilayer stack of claim 1, wherein said semiconductor layer has a thickness between 5-400 nm.

3. The multilayer stack of claim 2, wherein said semiconductor layer is made from a semiconductor material selected from the group consisting of Si, amorphous Si, Ge and or other semiconductor layer that has electronic bandgap in the visible range of the electromagnetic wave combinations thereof.

4. The multilayer stack of claim 3, wherein said dielectric layer has a thickness between 0.1 QW-4.0 QW.

5. The multilayer stack of claim 4, wherein said dielectric layer is made from a dielectric material having a refractive index greater than 1.6 and selected from the group consisting of ZnS, TiO₂, Si₂N₄, HfO₂, Nb₂O₅, Ta₂O₅ and combinations thereof.

6. The multilayer stack of claim 4, wherein said dielectric layer is a colorful dielectric layer made from a colorful dielectric material selected from the group consisting of Fe₂O₃, Cu₂O and combinations thereof.

7. The multilayer stack of claim 6, further comprising a partial absorber layer extending between said semiconductor layer and said dielectric layer.

8. The multilayer stack of claim 7, wherein said partial absorber layer has a thickness between 2-30 nm.

9. The multilayer stack of claim 8, wherein said partial absorber layer is made from a partial absorber material selected from the group consisting of Cr, Cu, Au, Sn and alloys thereof.

10. The multilayer stack of claim 4, further comprising a second semiconductor layer in addition to said previous mentioned semiconductor layer, said second semiconductor layer extending across said dielectric layer and oppositely disposed said semiconductor layer about said dielectric layer;

said core layer, semiconductor layer, dielectric layer and second semiconductor layer forming said omnidirectional reflector.

11. The multilayer stack of claim 10, wherein said second semiconductor layer has a thickness between 5-400 nm.

12. The multilayer stack of claim 11, wherein said second semiconductor layer is made from a semiconductor material selected from the group consisting of Si, amorphous Si, Ge or other semiconductor layer that has electronic bandgap in the visible range of the electromagnetic wave and combinations thereof.

13. The multilayer stack of claim 10, further comprising a partial absorber layer extending between said semiconductor layer and said dielectric layer.

14. The multilayer stack of claim 13, wherein said partial absorber layer has a thickness between 2-30 nm.

15. The multilayer stack of claim 14, wherein said partial absorber layer is made from a partial absorber material selected from the group consisting of Cr, Cu, Au, Sn and alloys thereof.

16. The multilayer stack of claim 12, further comprising a second dielectric layer in addition to said previous mentioned dielectric layer, said second dielectric layer extending across said second semiconductor layer and oppositely disposed said dielectric layer about said second semiconductor layer;

said core layer, semiconductor layer, dielectric layer, second semiconductor layer and second dielectric layer forming said omnidirectional reflector.

17. The multilayer stack of claim 16, wherein said second dielectric layer has a thickness between 0.1 QW-4.0 QW.

18. The multilayer stack of claim 17, wherein said second dielectric layer is made from a dielectric material having a refractive index greater than 1.6 and selected from the group consisting of ZnS, TiO₂, Si₂N₄, HfO₂ , Nb₂O₅, Ta₂O₅ and combinations thereof.

19. The multilayer stack of claim 17, wherein said second dielectric layer is a colorful dielectric layer made from a colorful dielectric material selected from the group consisting of Fe₂O₃, Cu₂O and combinations thereof.

20. The multilayer stack of claim 16, further comprising a partial absorber layer extending between said semiconductor layer and said dielectric layer.

21. The multilayer stack of claim 20, wherein said partial absorber layer has a thickness between 2-30 nm.

22. The multilayer stack of claim 21, wherein said partial absorber layer is made from a partial absorber material selected from the group consisting of Cr, Cu, Au, Sn and alloys thereof.

23. The multilayer stack of claim 1, wherein said core layer is selected from the group consisting of a reflector core layer, an absorber/reflector layer and a dielectric layer.

24. The multilayer stack of claim 23, wherein said core layer is said reflector core layer and has a thickness between 50-200 nm.

25. The multilayer stack of claim 24, wherein said reflector core layer is made from a reflector material selected from the group consisting of Al, Ag, Pt and alloys thereof.

26. The multilayer stack of claim 23, wherein said core layer is said absorber/reflector layer and has a thickness between has a thickness between 50-200 nm.

27. The multilayer stack of claim 26, wherein said absorber/reflector core layer is made from an absorber/reflector material selected from the group consisting of Cr, Cu, Au, Sn and alloys thereof.

28. The multilayer stack of claim 23, wherein said core layer is said dielectric core layer and has a thickness between has a thickness between 50-200 nm.

29. The multilayer stack of claim 28, wherein said dielectric core layer is made from a dielectric material selected from the group consisting of glass and mica.

30. The multilayer stack of claim 28, wherein said dielectric core layer is made from a colorful dielectric material selected from the group consisting of Fe₂O₃, Cu₂O and combinations thereof.