MOSFET termination trench
First Claim
1. A semiconductor device comprising:
- a termination trench formed in a substrate, said termination trench comprises;
a first oxide that lines the sidewalls and bottom of said termination trench; and
a first polysilicon located between said first oxide and extending more than half the depth of said termination trench;
a core trench formed in said substrate, said core trench comprises;
a second oxide that lines the sidewalls and bottom of said core trench; and
a second polysilicon located between said second oxide, said second polysilicon is deeper than said first polysilicon;
a mesa of said substrate located between said core trench and said termination trench, a surface of said termination trench is a first surface of said mesa and a surface of said core trench is a second surface of said mesa; and
a third oxide located above said mesa and directly contacts said first oxide, said first polysilicon, and said second oxide;
said termination trench is wider than said core trench, said termination trench is deeper than said core trench, said first oxide within said termination trench is thicker than said second oxide within said core trench, and said first polysilicon is wider than said second polysilicon.
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Accused Products
Abstract
A method, in one embodiment, can include forming a core trench and a termination trench in a substrate. The termination trench is wider than the core trench. In addition, a first oxide can be deposited that fills the core trench and lines the sidewalls and bottom of the termination trench. A first polysilicon can be deposited into the termination trench. A second oxide can be deposited above the first polysilicon. A mask can be deposited above the second oxide and the termination trench. The first oxide can be removed from the core trench. A third oxide can be deposited that lines the sidewalls and bottom of the core trench. The first oxide within the termination trench is thicker than the third oxide within the core trench.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a termination trench formed in a substrate, said termination trench comprises; a first oxide that lines the sidewalls and bottom of said termination trench; and a first polysilicon located between said first oxide and extending more than half the depth of said termination trench; a core trench formed in said substrate, said core trench comprises; a second oxide that lines the sidewalls and bottom of said core trench; and a second polysilicon located between said second oxide, said second polysilicon is deeper than said first polysilicon; a mesa of said substrate located between said core trench and said termination trench, a surface of said termination trench is a first surface of said mesa and a surface of said core trench is a second surface of said mesa; and a third oxide located above said mesa and directly contacts said first oxide, said first polysilicon, and said second oxide; said termination trench is wider than said core trench, said termination trench is deeper than said core trench, said first oxide within said termination trench is thicker than said second oxide within said core trench, and said first polysilicon is wider than said second polysilicon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a termination trench formed in a substrate, said termination trench comprises; a first oxide that lines the sidewalls and bottom of said termination trench; and a first polysilicon located between said first oxide and extending more than half the depth of said termination trench; a core trench formed in said substrate, said core trench comprises; a second oxide that lines the sidewalls and bottom of said core trench; and a second polysilicon located between said second oxide, said second polysilicon is deeper than said first polysilicon; a mesa of said substrate located between said core trench and said termination trench, a surface of said termination trench is a first surface of said mesa and a surface of said core trench is a second surface of said mesa;
said mesa comprises a doped region; anda third oxide located above said mesa and directly contacts said first oxide, said first polysilicon, and said second oxide; said termination trench is wider than said core trench, said termination trench is deeper than said core trench, said first oxide within said termination trench is thicker than said second oxide within said core trench, and said first polysilicon is wider than said second polysilicon. - View Dependent Claims (11, 12, 13, 14)
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15. A semiconductor device comprising:
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a termination trench formed in a substrate, said termination trench comprises; a first oxide that lines the sidewalls and bottom of said termination trench;
said first oxide comprises a silicon dioxide; anda first polysilicon located between said first oxide and extending more than half the depth of said termination trench; a core trench formed in said substrate, said core trench comprises; a second oxide that lines the sidewalls and bottom of said core trench; and a second polysilicon located between said second oxide, said second polysilicon is deeper than said first polysilicon; a mesa of said substrate located between said core trench and said termination trench, a surface of said termination trench is a first surface of said mesa and a surface of said core trench is a second surface of said mesa; and a third oxide located above said mesa and directly contacts said first oxide, said first polysilicon, and said second oxide; said termination trench is wider than said core trench, said termination trench is deeper than said core trench, said first oxide within said termination trench is thicker than said second oxide within said core trench, and said first polysilicon is wider than said second polysilicon. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification