Encapsulation method of OLED and a structure of OLED

• US 9,614,176 B2
• Filed: 09/22/2014
• Issued: 04/04/2017
• Est. Priority Date: 09/16/2014
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Zeng, Weijing, Liu, Yawei
• Primary Examiner(s): Williams, Joseph L
• Application Number:
  US14/426,375
• Publication Number:
  US 20160254481A1
• Time in Patent Office: 925 Days
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 50/80 Constructional details
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/874 including getter material or desiccant
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10K 85/10 Organic polymers or oligomers
• CPC Class Codes: H10K 85/324 comprising aluminium, e.g. Alq3
• CPC Class Codes: H10K 85/40 Organosilicon compounds, e.g. TIPS pentacene

Abstract

The invention provides an encapsulation method of OLED and a structure of OLED, and the method comprises: step 1: providing a glass cover and an encapsulating substrate, and the glass cover comprising a display area and an edge area surrounding the display area; step 2: forming a layer of SiN_x on the edge area of the glass cover; step 3: self-arranging a layer of hydrophobic monomer on the display area surface of the glass cover; step 4: coating a circle of glue frame around the display area on the glass cover; step 5: coating desiccant on the layer of hydrophobic monomer on the display area of the glass cover; step 6: attaching the glass cover correspondingly to the substrate in vacuum environment; step 7: illuminating by UV light to cure the glue frame to achieve the glass cover encapsulating the substrate.

Claims

1. An encapsulation method for OLED, comprising following steps:

step 1;

providing a glass cover and an encapsulating substrate, and the glass cover comprising a display area and an edge area surrounding the display area;

step 2;

forming a layer of SiN_X on the edge area of the glass cover to encircle the display area;

step 3;

self-arranging a layer of hydrophobic monomer on and in contact with a surface of the display area of the glass cover, wherein the surface of the display area is a hydrophilic surface, the layer of SiN_X is configured for limiting the layer of hydrophobic monomer within the display area;

step 4;

coating a circle of UV curable glue frame around the display area of the glass cover and on the layer of SiN_X such that the layer of SiN_X is located between the UV curable glue frame and the glass cover;

step 5;

coating a liquid desiccant of non-polar on the layer of hydrophobic monomer on the display area of the glass cover whereby the liquid desiccant of non-polar being distributed evenly on the display area owing to hydrophobicity of the layer of hydrophobic monomer;

step 6;

attaching the glass cover correspondingly to the substrate;

step 7;

illuminating by UV light to cure the UV curable glue frame to achieve the glass cover encapsulating the substrate.

2. The encapsulation method for OLED according to claim 1, wherein, the substrate can be an OLED substrate;

a method of self-arranging the layer of hydrophobic monomer in the step 3 is solution immersion method or evaporation.

3. The encapsulation method for OLED according to claim 1, wherein, the layer of hydrophobic monomer in step 3 is silane-system molecular, which is n-propyltrichlorosilane, Trichlorooctadecylsilane, Trichlorodecylsilane, n-Decyltrimethoxysilane, n-Decyltriethoxysilane, or n-Decyltri(methoxyethoxy)silane.

4. The encapsulation method for OLED according to claim 1, wherein, the glue frame is coated at the edge of the glass cover in the step 4, and a space is kept from the display area;

the glue frame is UV glue.

5. The encapsulation method for OLED according to claim 1, wherein, screen printing is applied in coating a liquid desiccant of non-polar in the step 5;

the step 6 is processing in vacuum environment.

6. The encapsulation method for OLED according to claim 1, wherein, the liquid desiccant of non-polar is curable desiccant or non-curable desiccant.

7. The encapsulation method for OLED according to claim 6, wherein, the non-curable desiccant is aluminum polymer, which is [R—

O—

Al═

O]_n (n≧

1);

the curable desiccant is thermo setting liquid desiccant or UV curing liquid desiccant.

8. The encapsulation method for OLED according to claim 6, wherein, when the liquid desiccant of non-polar is curable desiccant in step 5, heating or UV light illuminating for curing is processing after coating.

9. An OLED structure, comprising a substrate, a glass cover tightly attached to the substrate, and a UV cured glue frame positioned between the substrate and the glass cover;

wherein the glass cover includes a display area and an edge area surrounding the display area, and further includes a layer of SiN_X positioned on the edge area of the glass cover to encircle the display area, a layer of hydrophobic monomer self-arranging on a surface of the display area of the glass cover, and desiccant of non-polar coated on the layer of hydrophobic monomer on the display area of the glass cover;

the layer of SiN_X is configured for limiting the layer of hydrophobic monomer within the display area, the UV cured glue frame is on the layer of SiN_X such that the layer of SiN_X is located between the UV cured glue frame and the glass cover, the desiccant of non-polar is distributed evenly on the display area due to hydrophobicity of the layer of hydrophobic monomer.

10. The encapsulation method for OLED according to claim 9, wherein, the substrate is OLED substrate;

the layer of hydrophobic monomer is silane-system molecular;

the UV cured glue frame is coated at the edge of the glass cover and a space is kept from the display area;

the desiccant of non-polar is curable desiccant or non-curable desiccant.

11. An OLED structure, comprising a substrate, a glass cover tightly attached to the substrate, and a UV cured glue frame positioned between the substrate and the glass cover;

wherein the glass cover includes a display area and an edge area surrounding the display area, and further includes a layer of SiN_X positioned on the edge area of the glass cover to encircle the display area, a layer of hydrophobic monomer self-arranging on and in contact with a surface of the display area of the glass cover, and desiccant of non-polar coated on the layer of hydrophobic monomer on the display area of the glass cover;

the layer of SiN_X is configured for limiting the layer of hydrophobic monomer within the display area, the UV cured glue frame is on the layer of SiN_X such that the layer of SiN_X is located between the UV cured glue frame and the glass cover, the desiccant of non-polar is distributed evenly on the display area due to hydrophobicity of the layer of hydrophobic monomer;

wherein, the substrate is OLED substrate;

the layer of hydrophobic monomer is silane-system molecular;

the UV cured glue frame is coated at the edge of the glass cover and a space is kept from the display area;

the desiccant of non-polar is curable desiccant or non-curable desiccant.