OLED package method and OLED package structure

• US 9,614,177 B2
• Filed: 09/19/2014
• Issued: 04/04/2017
• Est. Priority Date: 08/29/2014
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Qian, Jiajia, Liu, Yawei, Liu, Chihche, Wu, Taipi
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US14/426,986
• Publication Number:
  US 20160248042A1
• Time in Patent Office: 928 Days
• CPC Class Codes: H10K 2102/00 Constructional details relating to the organic devices covered by this subclass
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/874 including getter material or desiccant
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition

Abstract

The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).

Claims

1. An OLED package method, comprising steps of:

step 1, providing a substrate to be packaged, and a package cover plate;

step 2, forming an inorganic protective frame in a round at the edges of the substrate, the inorganic protective frame being formed of SiNx;

step 3, manufacturing an OLED element on the substrate inside the inorganic protective frame;

step 4, pasting a solid glue film on the package cover plate;

step 5, forming an adhesive in a round on the package cover plate corresponding to a location of the inorganic protective frame;

step 6, oppositely attaching the substrate and the package cover plate, and the substrate and the package cover plate are affixed together by the solid glue film and the adhesive to accomplish the package to the substrate with the package cover plate, wherein the inorganic protective frame is in direct contact with and extends along the edges of the substrate and circumferentially encloses the OLED element and the solid glue film such that the OLED element is protected by the inorganic protective frame that comprises SiNx for preventing invasion of moisture and the solid glue film that blocks penetration of moisture therethrough.

2. The OLED package method according to claim 1, wherein the substrate is a TFT substrate, and the package cover plate is a glass plate or a metal plate, and the metal plate is formed with alloy.

3. The OLED package method according to claim 1, wherein the OLED element is manufactured by evaporation method.

4. The OLED package method according to claim 1, wherein the fourth step is:

forming a dryer in a round on the package cover plate inside a location corresponding to the location of the inorganic protective frame, and the solid glue film is attached inside the dryer.

5. The OLED package method according to claim 1, wherein an attachment procedure of the solid glue film is performed in a nitrogen ambience, and a height of the solid glue film is larger than a height of the inorganic protective frame in the first step.

6. The OLED package method according to claim 1, wherein an area of the solid glue film is equal to or larger than an area of a top surface or a bottom surface of the OLED element to be packaged for completely covering the OLED element with the solid glue film after the substrate and the package cover plate are attached.

7. The OLED package method according to claim 1, wherein the adhesive in the fifth step is DAM glue.

8. The package method of the OLED panel according to claim 4, wherein the dryer is calcium oxide.

9. An OLED package structure, comprising a substrate, and a package cover plate tight attaching with the substrate, an OLED element located between the substrate and the package cover plate, a solid glue film completely covering the OLED element, an inorganic protective frame outside the solid glue film, and an adhesive located between the inorganic protective frame and the package cover plate, wherein the inorganic protective frame is in direct contact with and extends along edges of the substrate and circumferentially encloses the OLED element and the solid glue film such that the OLED element is protected by the inorganic protective frame that comprises SiNx for preventing invasion of moisture and the solid glue film that blocks penetration of moisture therethrough.

10. The OLED package structure according to claim 9, further comprising a dryer located between inorganic protective frame and the solid glue film.

11. An OLED package structure, comprising a substrate, and a package cover plate tight attaching with the substrate, an OLED element located between the substrate and the package cover plate, a solid glue film completely covering the OLED element, an inorganic protective frame outside the solid glue film, and an adhesive located between the inorganic protective frame and the package cover plate;

wherein the OLED package structure further comprises a dryer located between inorganic protective frame and the solid glue film; and

wherein the inorganic protective frame is in direct contact with and extends along edges of the substrate and circumferentially encloses the OLED element and the solid glue film such that the OLED element is protected by the inorganic protective frame that comprises SiNx for preventing invasion of moisture and the solid glue film that blocks penetration of moisture therethrough.