Scalable high-bandwidth connectivity

• US 9,614,590 B2
• Filed: 05/14/2012
• Issued: 04/04/2017
• Est. Priority Date: 05/12/2011
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D., Kyles, Ian A.
• Primary Examiner(s): Patel, Nimesh G
• Application Number:
  US13/471,058
• Publication Number:
  US 20120290760A1
• Time in Patent Office: 1,786 Days
• Field of Search: 710303
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 1/525 between emitting and receiving antennas
• CPC Class Codes: H01Q 5/25 Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
• CPC Class Codes: H04B 5/26 using coils
• CPC Class Codes: H04B 5/79 for data transfer in combination with power transfer

Abstract

A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.

Claims

1. A system for communicating extremely high frequency (EHF) electromagnetic signals between a first and a second communication apparatus, the first communication apparatus comprising:

a dielectric substrate having a major surface;

a data storage unit disposed on the dielectric substrate and coupled to communicate data with one or more of a first plurality of EHF communication units disposed on the major surface of the dielectric substrate; and

a first EHF communication unit, of the first plurality of EHF communication units, the first EHF communication unit comprising;

at least one of an EHF transmitter circuit coupled to receive data from the data storage unit and generate an EHF electromagnetic signal for transmission by a first transducer mounted on the dielectric substrate, and an EHF receiver circuit coupled to receive an EHF electromagnetic signal from a second transducer mounted on the dielectric substrate and transform the received EHF electromagnetic signal into data for transmission to the data storage unit and

wherein each of the plurality of first EHF communication units are positioned on the major surface of the dielectric substrate to align with at least one of a plurality of second EHF communication units disposed on a major surface of the second communication apparatus, with the alignment forming one or more groups of EHF communication units, each group forming a communication channel when the major surface of the dielectric substrate faces the major surface of the second communication apparatus, the major surface of the dielectric substrate and the major surface of the second communication apparatus being on non-adjacent layers of a communication assembly separated by an intervening layer, the intervening layer including a window configured to allow transmission of EHF communications signal between a group of EHF communication units.

2. The system of claim 1, wherein the first communication apparatus further comprises a power storage device coupled to an inductive power receiver to store electrical power converted from inductive energy received by the inductive power receiver, and to supply the stored electrical power to the first EHF communication unit and the data storage unit.

3. The system of claim 1, wherein the first communication apparatus further comprises an additional data storage unit disposed on the dielectric substrate and coupled to communicate data with one or more of the first plurality of EHF communication units disposed on the major surface of the dielectric substrate.

4. The system of claim 3, wherein the first EHF communication unit is further coupled to receive data from the additional data storage unit and the EHF electrical signal generated by the transmitter circuit contains data from the data storage unit and the additional data storage unit.

5. The system of claim 1, wherein each of the plurality of first EHF communication units includes a transducer to transmit or receive predominantly electromagnetic radiation having a polarization characteristic, each of the plurality of first EHF communication units positioned on the major surface of the dielectric substrate such that adjacent first EHF communication units of the plurality of first EHF communication units have different respective polarization characteristics.

6. The system of claim 5, wherein each transducer included in each of the plurality of first EHF communication units has a polarization direction vector pointing from the transducer away from the respective first EHF communication unit, and wherein the plurality of first EHF communication units are positioned relative to each other on the major surface of the dielectric substrate such that no two adjacent first EHF communication units have their polarization direction vectors aligned with each other.

7. The system of claim 1, wherein the transducer included in the first EHF communication unit is a dipole antenna.

8. The system of claim 1, wherein the window is configured as a gap in the intervening layer.

9. The system of claim 1, wherein the window comprises a dielectric material.

10. A system for communicating extremely high frequency (EHF) electromagnetic signals between a first and a second electronic device, the first electronic device comprising:

a dielectric substrate having a major surface;

an electronic component disposed on the dielectric substrate and coupled to communicate data with one or more of a first plurality of extremely high frequency (EHF) communication units disposed on the major surface of the dielectric substrate; and

a first EHF communication unit, of the first plurality of EHF communication units, the first EHF communication unit comprising a transducer being mounted on the dielectric substrate and configured to perform at least one of;

convert data received from the electronic component into an EHF electromagnetic signal, and

convert a received EHF electromagnetic signal into data to send to the electronic component;

wherein each of the plural first EHF communication units are positioned on the major surface of the dielectric substrate to align with at least one of a plurality of second EHF communication units disposed on a major surface the second electronic device, with the alignment forming groups of EHF communication units, each group forming a communication channel when the major surface of the dielectric substrate faces the major surface of the second electronic device, the major surface of the dielectric substrate and the major surface of the second electronic device being on non-adjacent layers of a communication assembly separated by an intervening layer, the intervening layer including a window configured to allow transmission of EHF communications signal between a group of EHF communication units.

11. The system of claim 10, wherein first EHF communication unit is a transceiver coupled to the transducer.

12. The system of claim 10, wherein the first electronic device further comprises an additional electronic component disposed on the dielectric substrate and coupled to communicate data with one or more of the first plurality of EHF communication units disposed on the major surface of the dielectric substrate.

13. The system of claim 10, wherein each of the plurality of first EHF communication units includes a transducer to transmit or receive predominantly electromagnetic radiation having a polarization characteristic, each of the plurality of first EHF communication units positioned on the major surface of the dielectric substrate such that adjacent first EHF communication units of the plurality of first EHF communication units have different respective polarization characteristics.

14. The system of claim 13, wherein each transducer included in each of the plurality of first EHF communication units has a polarization direction vector pointing from the transducer away from the respective first EHF communication unit, and wherein the plurality of first EHF communication units are positioned relative to each other on the major surface of the dielectric substrate such that no two adjacent first EHF communication units have their polarization direction vectors aligned with each other.

15. The system of claim 10, wherein the transducer included in the first EHF communication unit is a dipole antenna.

16. The system of claim 10, wherein the window is configured as a gap in the intervening layer.

17. The system of claim 10, wherein the window comprises a dielectric material.