Method for fabricating glass substrate package
First Claim
1. A structure comprising:
- a first glass substrate having a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple conductors extending through said first glass substrate beginning at said first surface and ending at said second surface and a first metal layer under said second surface connected to one of said conductors, wherein one of said conductors comprises a cross-section surface parallel to said first surface, wherein said cross-section surface comprises a first edge, a second edge opposite to and substantially parallel with said first edge, a third edge and a fourth edge opposite to said third edge, wherein said first edge has a first length is greater than that of said third and fourth edges, wherein said second edge has a second length is greater than that of said third and fourth edges, wherein said conductors comprises a first sidewall, a second sidewall opposite to and substantially parallel with said first sidewall, a third sidewall and a fourth sidewall opposite to said third sidewall;
a first chip over said first surface and connected to said first metal layer through one of said conductors; and
a second glass substrate of a display substrate is under said first glass substrate, wherein said first metal layer is connected to an electrode of said display substrate.
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Abstract
A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.
64 Citations
20 Claims
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1. A structure comprising:
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a first glass substrate having a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple conductors extending through said first glass substrate beginning at said first surface and ending at said second surface and a first metal layer under said second surface connected to one of said conductors, wherein one of said conductors comprises a cross-section surface parallel to said first surface, wherein said cross-section surface comprises a first edge, a second edge opposite to and substantially parallel with said first edge, a third edge and a fourth edge opposite to said third edge, wherein said first edge has a first length is greater than that of said third and fourth edges, wherein said second edge has a second length is greater than that of said third and fourth edges, wherein said conductors comprises a first sidewall, a second sidewall opposite to and substantially parallel with said first sidewall, a third sidewall and a fourth sidewall opposite to said third sidewall; a first chip over said first surface and connected to said first metal layer through one of said conductors; and a second glass substrate of a display substrate is under said first glass substrate, wherein said first metal layer is connected to an electrode of said display substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification