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Media-exposed interconnects for transducers

  • US 9,616,223 B2
  • Filed: 12/30/2005
  • Issued: 04/11/2017
  • Est. Priority Date: 12/30/2005
  • Status: Active Grant
First Claim
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1. A lead for electrically communicating with an implantable medical device comprising:

  • a lead body supporting a conductor, the conductor adapted for electrical communication with the implantable medical device;

    a transducer module including a transducer supported by the lead body and including an electrically conductive interface pad coupled to the transducer, the transducer being configured to provide an electrical signal to the interface pad and wherein the interface pad is configured to exert a tensile force on the transducer;

    an exposed interconnect generally exposed to biological fluids when in an implant environment, the exposed interconnect including a first conductive layer deposited over the interface pad and being coupled to the conductor to provide a conductive interface between the transducer and the conductor, wherein the first conductive layer exerts a compressive force on the interface pad; and

    a second conductive layer coupled to the first conductive layer, wherein the second conductive layer is configured to exert a tensile force on the first conductive layer, and wherein the magnitude of the compressive force counteracts the magnitude of the tensile forces exerted by the interface pad and the second conductive layer to reduce or eliminate a net force exerted on the transducer.

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