Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same

• US 9,617,144 B2
• Filed: 05/09/2014
• Issued: 04/11/2017
• Est. Priority Date: 05/09/2014
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Tsai, Julius Ming-Lin, Cagdaser, Baris, Lim, Martin, Khenkin, Aleksey S.
• Primary Examiner(s): Kuntz, Curtis
• Assistant Examiner(s): KAUFMAN, JOSHUA A
• Application Number:
  US14/273,845
• Publication Number:
  US 20150321906A1
• Time in Patent Office: 1,068 Days
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 29/004 for microphones H04R29/007 takes precedence

Abstract

An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Claims

1. A device comprising:

a package;

a MEMS acoustic sensing element comprising a diaphragm disposed in the package;

an integrated circuit (IC) disposed in the package and comprising an IC substrate having an environmental sensing material of an environmental sensor disposed in the IC substrate, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic independent of pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor, and wherein the IC is configured to process data generated by the MEMS acoustic sensing element and the environmental sensor; and

a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the environmental sensor;

wherein,

the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC comprising the environmental sensor.

2. The device of claim 1, wherein the MEMS acoustic sensing element includes a MEMS microphone.

3. The device of claim 1, wherein the environmental sensor includes one of a humidity, gas, temperature, chemical, biological parameter, nanoparticles, spore, or pathogen sensor.

4. The device of claim 1, wherein the port includes one of a square, rectangular or circular shaped cavity.

5. The device of claim 1, wherein the environmental sensor is disposed in a manner that is aligned with the port.

6. A method for making a package comprising:

forming a package substrate;

forming a MEMS acoustic sensor element on the package substrate;

forming an application specific integrated circuit (ASIC) chip above the package substrate comprising forming an ASIC substrate having an environmental sensing material of an environmental sensor disposed in the ASIC substrate, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic independent of pressure experienced by the environmental sensor, wherein the forming the ASIC chip includes depositing a plurality of segments of the environmental sensing material interspersed between a plurality of metal electrodes in direct contact with the environmental sensing material, thereby fabricating an environmental sensor arrangement that provides a variable electrical characteristic in response to the change in the environmental characteristic, and includes configuring at least one of the plurality of metal electrodes as a heating element of the environmental sensor;

forming electrical connections between the ASIC chip and the MEMS acoustic sensor element and between the ASIC chip and the environmental sensor;

forming a cover attached to the package substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC chip comprising the environmental sensor; and

forming an opening in the package, wherein the opening is configured to receive sound waves and air flow.

7. The method of claim 6, wherein forming the package substrate includes forming a laminate substrate.

8. The method of claim 6, wherein forming the environmental sensor includes aligning the environmental sensor with the opening.

9. An integrated circuit chip comprising:

a substrate;

a port disposed in the substrate;

an environmental sensor aligned with the port;

an application specific integrated circuit (ASIC) disposed above the substrate and comprising an environmental sensing material of the environmental sensor, wherein the environmental sensor comprises the environmental sensing material in a configuration sensitive to a change in an environmental characteristic unrelated to pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor;

a MEMS acoustic sensor element disposed above the ASIC, wherein the ASIC is configured to process data generated by the MEMS acoustic sensor element and the environmental sensor; and

a cover attached to the substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC comprising the environmental sensor.

10. An integrated circuit chip comprising:

a substrate;

a port disposed in the substrate;

an application specific integrated circuit (ASIC) mechanically affixed directly to the substrate and comprising an environmental sensing material of an environmental sensor, wherein the environmental sensor comprises the environmental sensing material in a configuration insensitive to a change in pressure experienced by the environmental sensor, wherein the environmental sensor is comprised of a plurality of segments of the environmental sensing material interspersed between and in direct contact with a plurality of metal electrodes, wherein the plurality of metal electrodes are subjected to a variable electrical environment in response to the change in the environmental characteristic, and wherein at least one of the plurality of metal electrodes comprises a heating element of the environmental sensor;

a MEMS acoustic sensor element disposed above the port and mechanically affixed directly to the substrate apart from and adjacent to the ASIC; and

a cover attached to the substrate, wherein the cover defines a back cavity that encompasses the MEMS acoustic sensor element and the ASIC comprising the environmental sensor.