Nucleation of aluminum nitride on a silicon substrate using an ammonia preflow
First Claim
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1. A method performed in sequential order comprising:
- (a) first, heating a substrate of silicon (Si) in a chamber, wherein the chamber'"'"'s temperature is above 950°
C.;
(b) second, changing the chamber'"'"'s temperature from the above 950°
C. to a second temperature and flowing hydrogen (H2) into the chamber;
(c) third, forming a layer on the substrate of Si having no nitride (N) at least by;
changing the chamber'"'"'s temperature from the second temperature to a third temperature, andflowing a first amount of ammonia (NH3) into the chamber while the hydrogen is still flowing into the chamber, wherein the first amount of ammonia is less than 0.01% by volume of the hydrogen flowing into the chamber(d) fourth, flowing trimethylaluminum (Al2(CH3)6) into the chamber while the hydrogen is still flowing into the chamber; and
(e) fifth, changing the chamber'"'"'s temperature from the third temperature to a fourth temperature and flowing a subsequent amount of ammonia into the chamber while the trimethylaluminum is still flowing into the chamber, wherein the subsequent amount of ammonia is greater than 0.002% by volume of the hydrogen flowing into the chamber,wherein the first temperature, second temperature, and third temperature are different from each other.
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Abstract
A method of making an aluminum nitride (AlN) buffer layer over a silicon wafer for a light emitting diode (LED) includes preflowing a first amount of ammonia that is sufficient to deposit nitrogen atoms on the surface of a silicon wafer without forming SiNx, before flowing trimethylaluminum and then a subsequent amount of ammonia through the chamber.
82 Citations
17 Claims
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1. A method performed in sequential order comprising:
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(a) first, heating a substrate of silicon (Si) in a chamber, wherein the chamber'"'"'s temperature is above 950°
C.;(b) second, changing the chamber'"'"'s temperature from the above 950°
C. to a second temperature and flowing hydrogen (H2) into the chamber;(c) third, forming a layer on the substrate of Si having no nitride (N) at least by; changing the chamber'"'"'s temperature from the second temperature to a third temperature, and flowing a first amount of ammonia (NH3) into the chamber while the hydrogen is still flowing into the chamber, wherein the first amount of ammonia is less than 0.01% by volume of the hydrogen flowing into the chamber (d) fourth, flowing trimethylaluminum (Al2(CH3)6) into the chamber while the hydrogen is still flowing into the chamber; and (e) fifth, changing the chamber'"'"'s temperature from the third temperature to a fourth temperature and flowing a subsequent amount of ammonia into the chamber while the trimethylaluminum is still flowing into the chamber, wherein the subsequent amount of ammonia is greater than 0.002% by volume of the hydrogen flowing into the chamber, wherein the first temperature, second temperature, and third temperature are different from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method, performed in sequential order, of manufacturing a semiconductor device, the method comprising:
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first, providing a silicon substrate in a chamber; second, cleaning a surface of the silicon substrate with a flow of hydrogen in the chamber; third, forming a layer on the substrate of Si having no nitride (N) at least by flowing a first amount of ammonia in the chamber while the hydrogen is still flowing into the chamber, wherein the first amount of ammonia forms nitrogen-silicon bonds without forming SiNx at the surface of the silicon substrate; fourth, flowing trimethylaluminum (Al2(CH3)6) in into the chamber while the hydrogen is still flowing into the chamber; and fifth, flowing a second amount of ammonia into the chamber, wherein the second amount of ammonia is greater than 0.002% by volume of the hydrogen flowing into the chamber. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification