Light emitting package and LED bulb

• US 9,618,191 B2
• Filed: 03/07/2013
• Issued: 04/11/2017
• Est. Priority Date: 03/07/2013
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Chang, Hsiao-Chuan, Tsai, Tsung-Yueh
• Primary Examiner(s): BANNAN, JULIE A
• Application Number:
  US13/788,268
• Publication Number:
  US 20140254181A1
• Time in Patent Office: 1,496 Days
• Field of Search: 362294, 362373
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/12 characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/90 on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.

Claims

1. A structure comprising:

a first device mounting portion comprising a first surface and a second surface;

a second device mounting portion comprising a first surface and a second surface; and

a plurality of light emitting devices mounted on the first and second surfaces of the first device mounting portion, and on the first and second surfaces of the second device mounting portion, wherein the light emitting devices on the second surface of the first device mounting portion are arranged in a plurality of columns, spaced by a pitch that decreases with increasing distance from the second device mounting portion, and wherein the light emitting devices on the second surface of the second device mounting portion are arranged in a plurality of columns, spaced by a pitch that decreases with increasing distance from the first device mounting portion.

2. The structure of claim 1, wherein the first device mounting portion comprises a first metal plate, and the second device mounting portion comprises a second metal plate, and the structure further comprises:

a heat sink with an opening comprising a first groove configured to receive the first metal plate and a second groove, and a second groove configured to receive the second metal plate.

3. The structure of claim 1, wherein the first device mounting portion is a first portion of a metal plate and the second device mounting portion is a second portion of the metal plate, the metal plate including a central bending portion between the first and second portions of the metal plate, and the structure further comprises:

an extending portion of the metal plate; and

a heat sink having an opening configured to receive the extending portion of the metal plate.

24. The structure of claim 1, wherein the plurality of columns of light emitting devices mounted to the second surface of the first device mounting portion get closer together as a placement of each column gets farther from the second device mounting portion.

26. The structure of claim 1, wherein light emitting devices are light emitting chips.

27. The structure of claim 26, light emitting chips are light emitting diodes (LEDs).

28. The structure of claim 27, wherein the LEDs are connected in series.

4. A structure comprising:

a first device mounting portion comprising a first surface and a second surface;

a second device mounting portion comprising a first surface and a second surface;

a first plurality of light emitting devices mounted on the first surfaces of the first and second device mounting portions with a uniform pitch in a plurality of columns; and

a second plurality of light emitting devices mounted on the second surfaces of the first and second device mounting portions with a non-uniform pitch in a plurality of columns.

25. The structure or claim 4, wherein the plurality of columns or light emitting devices mounted to the second surface of the first device mounting portion get closer together as a placement of each column gets farther from the second device mounting portion.

29. The structure of claim 4, wherein light emitting devices are light emitting chips.

30. The structure of claim 29, light emitting chips are light emitting diodes (LEDs).

31. The structure of claim 30, wherein the LEDs are connected in series.

5. A structure comprising:

a first chip mounting portion comprising a first surface and a second surface;

a second chip mounting portion comprising a first surface and a second surface; and

a plurality of optical chips mounted on the first and second surfaces of the first chip mounting portion, and on the first and second surfaces of the second chip mounting portion, wherein the optical chips on the second surface of the first chip mounting portion are arranged in a plurality of columns, spaced by a pitch that decreases with increasing distance from the second chip mounting portion, and wherein the optical chips on the second surface of the second chip mounting portion are arranged in a plurality of columns, spaced by a pitch that decreases with increasing distance from the first chip mounting portion.

6. The structure of claim 5, wherein an inclination angle is defined between the first chip mounting portion and the second chip mounting portion.

7. The structure of claim 6, wherein the inclination angle is between 30 and 150 degrees.

8. The structure of claim 6, wherein the inclination angle is the angle between a plane defined by the second surface of the first chip mounting portion and a plane defined by the second surface of the second chip mounting portion.

9. The structure of claim 6, wherein the optical chips define a light-emitting angle, and wherein the inclination angle is between the light emitting angle of the optical chips and an angle that is supplementary to the light emitting angle of the optical chips.

10. The structure of claim 5, wherein the plurality of columns of optical chips mounted to the second surface of the first chip mounting portion get closer together as a placement of each column gets farther from the second chip mounting portion.

11. The structure of claim 5, wherein the plurality of columns of optical chips mounted to the second surface of the first chip mounting portion get closer together as a placement of each column gets farther from the second chip mounting portion.

12. The structure of claim 5, wherein the optical chips on the first surface of the first chip mounting portion and the first surface of the second chip mounting portion are spaced by a uniform pitch.

13. The structure of claim 5, wherein the first chip mounting portion is a first portion of a metal plate and the second chip mounting portion is a second portion of the metal plate, the metal plate including a central bending portion between the first and second portions of the metal plate.

14. The structure of claim 5, wherein the first chip mounting portion comprises a first metal plate, and the second chip mounting portion comprises a second metal plate.

15. The structure of claim 14, further comprising:

a heat sink with an opening comprising a first groove configured to receive the first metal plate and a second groove, and a second groove configured to receive the second metal plate.

16. The structure of claim 5, further comprising:

a plurality of leads electrically connected to the plurality of optical chips; and

a molding compound encapsulating the plurality of optical chips and a part of each of the plurality of leads.

17. The structure of claim 13, further comprising:

an extending portion of the metal plate; and

a heat sink having an opening configured to receive the extending portion of the metal plate.

32. The structure of claim 5, wherein the optical chips are connected in series.

18. A structure comprising:

a first device mounting portion comprising a first surface and a second surface;

a second device mounting portion comprising a first surface and a second surface;

a first plurality of optical chips mounted on the first surfaces of the first and second device mounting portions with a uniform pitch in a plurality of columns; and

a second plurality of optical chips mounted on the second surfaces of the first and second device mounting portions with a non-uniform pitch in a plurality of columns.

19. The structure of claim 18, wherein an inclination angle is the angle between a plane defined by the second surface of the first device mounting portion and a plane defined by the second surface of the second device mounting portion.

20. The structure of claim 18, wherein the optical chips of the first and second pluralities of optical chips have a light emitting angle;

and

wherein an inclination angle is defined between the first device mounting portion and the second device mounting portion, the inclination angle having a value between the light emitting angle of the optical chips and an angle that is supplementary to the light emitting angle of the optical chips.

21. The structure of claim 18, wherein the non-uniform pitch between the optical chips of the second plurality of optical chips decreases with increasing distance from a juncture defined between the first and second device mounting portions.

22. The structure of claim 18, wherein the first device mounting portion is a first portion of a metal plate and the second device mounting portion is a second portion of the metal plate, the metal plate including a central bending portion between the first and second portions of the metal plate.

23. The structure of claim 18, wherein the first device mounting portion comprises a first metal plate, and the second device mounting portion comprises a second metal plate.

33. The structure of claim 18, wherein the optical chips are connected in series.