Determining a malfunctioning device in a plasma system

• US 9,620,337 B2
• Filed: 02/19/2014
• Issued: 04/11/2017
• Est. Priority Date: 01/31/2013
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Valcore, Jr., John C., Lyndaker, Bradford J., Sato, Arthur
• Primary Examiner(s): Le, Toan
• Application Number:
  US14/184,631
• Publication Number:
  US 20140210508A1
• Time in Patent Office: 1,147 Days
• CPC Class Codes: G01R 31/40 Testing power supplies testing photovoltaic devices H02S50/10
• CPC Class Codes: H01J 37/32917 Plasma diagnostics
• CPC Class Codes: H01J 37/32926 Software, data control or modelling
• CPC Class Codes: H01J 37/3299 Feedback systems

Abstract

Systems and methods for determining a malfunctioning device in a plasma system, are described. One of the methods includes receiving an indication whether plasma is generated within a plasma chamber of the plasma system. The plasma system includes a processing portion and a power delivery portion. The method further includes determining whether the plasma system operates within constraints in response to receiving the indication that the plasma is generated, determining a value of a variable at an output of the power delivery portion when the processing portion is decoupled from the power delivery portion, and comparing the determined value with a pre-recorded value of the variable. The method includes determining whether the determined value is outside a range of the pre-recorded value and determining that the malfunctioning device within the power delivery portion upon determining that the determined value is outside the range of the pre-recorded value.

Claims

1. A system for determining a malfunctioning device, the system comprising:

one or more plasma processing tools, each plasma processing tool including one or more plasma modules for processing a work piece, each plasma processing tool including a transfer module for transferring the work piece between two of the plasma modules, each plasma module including a power delivery portion and a plasma processing portion, the plasma processing portion including a plasma chamber, the power delivery portion for generating radio frequency (RF) power to provide to the plasma processing portion to generate plasma;

a computing device coupled to the one or more plasma processing tools, the computing device including a processor, the processor for;

determining whether one of the plasma modules operates within constraints;

receiving a measured value of a variable at an output of the power delivery portion in response to determining that the plasma module lacks operation within the constraints, wherein the value is measured when the power delivery portion is decoupled from the plasma chamber of the plasma processing portion to be coupled with a known load;

comparing the measured value with a pre-recorded value of the variable to determine whether the measured value is outside a range of the pre-recorded value; and

determining that a malfunctioning device is between an input of the power delivery portion and an output of the power delivery portion in response to determining that the measured value is outside the range of the pre-recorded value.

2. The system of claim 1, wherein the processor further determines that the malfunctioning device is within the plasma processing portion in response to determining that the measured value is within the range of the pre-recorded value.

3. The system of claim 1, wherein the pre-recorded value is generated using a probe that complies with a pre-set formula, wherein the pre-recorded value is generated by propagating a value measured by the probe via a computer-generated model of the power delivery portion.

4. The system of claim 1, wherein the power delivery portion includes:

a radio frequency (RF) generator;

or

a combination of the RF generator and one or more cables, the one or more cables for coupling to the RF generator;

or

a combination of the RF generator, the one or more cables, and an impedance matching circuit, the impedance matching circuit for coupling to the one or more cables;

or

a combination of the RF generator, the one or more cables, the impedance matching circuit, and at least a portion of an RF transmission line, the RF transmission line for coupling the impedance matching circuit to the plasma chamber.

5. The system of claim 1, wherein the power delivery portion includes:

a radio frequency (RF) generator and one or more filters, the one or more filters for coupling to the plasma chamber;

or

a combination of the RF generator, the one or more filters, and one or more cables, the one or more cables for coupling to the RF generator;

or

a combination of the RF generator, the one or more filters, the one or more cables, and an impedance matching circuit, the impedance matching circuit for coupling to the one or more cables;

or

a combination of the RF generator, the one or more filters, the one or more cables, the impedance matching circuit, and at least a portion of an RF transmission line, the RF transmission line for coupling the impedance matching circuit to the plasma chamber, the one or more filters for coupling to the plasma chamber.

6. The system of claim 1, wherein the plasma processing portion includes:

a combination of the plasma chamber and at least a portion of an radio frequency (RF) transmission line, the RF transmission line coupled to the plasma chamber;

or

a combination of the plasma chamber, at least a portion of the RF transmission line, and an impedance matching circuit coupled to the RF transmission line;

or

a combination of the plasma chamber, at least a portion of the RF transmission line, the impedance matching circuit, and one or more cables, the one or more cables coupled to the impedance matching circuit.

7. The system of claim 1, wherein the plasma processing portion includes:

one or more filters, the one or more filters coupled to the plasma chamber;

or

a combination of the plasma chamber, the one or more filters, and at least a portion of an radio frequency (RF) transmission line, the RF transmission line coupled to the plasma chamber;

or

a combination of the plasma chamber, the one or more filters, at least a portion of the RF transmission line, and an impedance matching circuit coupled to the RF transmission line;

or

a combination of the plasma chamber, the one or more filters, at least a portion of the RF transmission line, the impedance matching circuit, and one or more cables, the one or more cables coupled to the impedance matching circuit.

8. A method for determining a malfunctioning device in a plasma system, comprising:

receiving an indication whether plasma is generated within a plasma chamber of the plasma system;

determining whether the plasma system operates within constraints in response to receiving the indication that the plasma is generated, wherein determining whether the plasma system operates within the constraints is performed when the plasma system includes an impedance matching circuit that is located between the plasma chamber and a radio frequency (RF) generator of the plasma system, wherein determining whether the plasma system operates within the constraints is performed when the plasma system includes an RF transmission line coupling the impedance matching circuit to the plasma chamber;

receiving a measured value of a variable measured at a node of the RF transmission line in response to determining that the plasma system lacks operation within the constraints, wherein the value of the variable is measured when the impedance matching circuit is decoupled from the plasma chamber to be coupled with a known load;

comparing the measured value with a pre-recorded value of the variable;

determining whether the measured value is outside a range of the pre-recorded value; and

determining that the malfunctioning device is between an input of the RF generator and the node in response to determining that the measured value is outside the range of the pre-recorded value,

wherein the method is executed by one or more processors.

9. The method of claim 8, further comprising:

determining that the malfunctioning device is within the plasma chamber or within a portion of the RF transmission line in response to determining that the measured value is within the range of the pre-recorded value, the portion of the RF transmission line located between the plasma chamber and the node.

10. The method of claim 8, wherein the plasma is generated during processing of a substrate.

11. The method of claim 10, wherein the substrate is implemented within an electronic item.

12. The method of claim 8, wherein the malfunctioning device includes the RF generator, the impedance matching circuit, or a portion of the RF transmission line between the impedance matching circuit and the node, or a cable coupled to the RF generator and to the impedance matching circuit.

13. The method of claim 8, wherein the indication is of sending an RF signal to the plasma chamber to generate plasma within the plasma chamber.

14. The method of claim 8, wherein the constraints include a criterion associated with the plasma chamber, a criterion associated with the RF transmission line, a criterion associated with the impedance matching circuit, a criterion associated with a cable coupling the RF generator to the impedance matching circuit, and a criterion associated with the RF generator.

15. The method of claim 8, wherein the pre-recorded value includes a value that is determined from a value measured using a National Institute of Standards and Technology (NIST) probe.

16. The method of claim 8, wherein the range extends from the pre-recorded value to an error in the pre-recorded value.

17. The method of claim 8, wherein the pre-recorded value is generated using a probe that complies with a pre-set formula, wherein the pre-recorded value is generated by propagating a value measured by the probe via a computer-generated model of the impedance matching circuit and a portion of the RF transmission line between the node and the impedance matching circuit.

18. A method for determining a malfunctioning device in a plasma system, comprising:

receiving an indication whether plasma is generated within a plasma chamber of the plasma system, the plasma system including a plasma processing portion and a power delivery portion;

determining whether the plasma system operates within constraints in response to receiving the indication that the plasma is generated;

receiving, by a processor of a host computer system, a measured value of a variable at an output of the power delivery portion when a plasma chamber of the plasma processing portion is decoupled from the power delivery portion;

comparing, by the processor, the measured value with a pre-recorded value of the variable;

determining, by the processor, whether the measured value is outside a range of the pre-recorded value, wherein the pre-recorded value is generated from a value sensed at an output of a radio frequency (RF) generator; and

determining, by the processor, that the malfunctioning device is between an input of the power delivery portion and an output of the power delivery portion in response to determining that the measured value is outside the range of the pre-recorded value.

19. The method of claim 18, further comprising:

determining that the malfunctioning device is between an input of the plasma processing portion and an output of the plasma processing portion in response to determining that the measured value is not outside the range of the pre-recorded value.

20. The method of claim 18, wherein receiving the measured value of the variable at the output of the power delivery portion is performed when the output of the power delivery portion is coupled to a known load.

21. The method of claim 18, wherein the plasma is generated during processing of a substrate.

22. The method of claim 21, wherein the substrate is implemented within an electronic item.