Wireless communications package with integrated antennas and air cavity
First Claim
1. An antenna package, comprising:
- a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; and
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier,wherein a first portion of the antenna feed line is disposed on the first surface of the package carrier and wherein a second portion of the antenna feed line extends through the package carrier from a second surface of the package carrier to the first surface of the package carrier.
1 Assignment
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Accused Products
Abstract
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
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Citations
16 Claims
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1. An antenna package, comprising:
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a package carrier comprising an antenna ground plane and an antenna feed line; and a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid; wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; and wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier, wherein a first portion of the antenna feed line is disposed on the first surface of the package carrier and wherein a second portion of the antenna feed line extends through the package carrier from a second surface of the package carrier to the first surface of the package carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An antenna package, comprising:
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a package carrier comprising an antenna ground plane and an antenna feed line; and a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid and a metallization pattern formed on a second surface of the planar lid, opposite the first surface of the planar lid; wherein the metallization pattern on the second surface of the planar lid comprises a footprint that is similar to, and aligned with, a metallization pattern of the planar antenna element formed on the opposing first surface of the planar lid, wherein the metallization pattern on the second surface of the planar lid is configured to provide structural support to the planar lid and compensate for thermal expansion of the metallization pattern of the planar antenna element.
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12. A wireless communications package, comprising:
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an antenna package comprising; a package carrier having a first surface and a second surface, wherein the package carrier comprises an antenna ground plane and a plurality of an antenna feed lines, and an array of bonding pads formed on the second surface, wherein a first portion of each antenna feed line is disposed on the first surface of the package carrier and wherein a second portion of each antenna feed line extends through the package carrier from a second surface of the package carrier to the first surface of the package carrier; and a package cover comprising a planar lid, the planar lid comprising an array of planar antenna elements formed on a first surface of the planar lid; wherein the package cover is bonded to the first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the array of planar antenna elements on the first surface of the planar lid aligned to the antenna ground plane and to corresponding ones of the first portions of the antenna feed lines on the first surface of the package carrier; and wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the array of planar antenna elements and the first surface of the package carrier; an RFIC (radio frequency integrated circuit) chip flip-chip bonded to bonding pads on the second surface of the package carrier; and an application board bonded to bonding pads on the second surface of the package carrier. - View Dependent Claims (13, 14, 15, 16)
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Specification