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Semiconductor device having a transparent window for passing radiation

  • US 9,620,656 B2
  • Filed: 03/05/2015
  • Issued: 04/11/2017
  • Est. Priority Date: 03/07/2014
  • Status: Active Grant
First Claim
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1. A packaged optical semiconductor device having a transparent window, comprising:

  • a substrate comprising a transparent cap layer directly connected to the substrate, and an opto-electric element located in a cavity formed between the substrate and the transparent cap layer;

    the cap layer being made of quartz glass, sapphire glass or silicon, and having at least one protrusion extending on top of a substantially flat upper surface, the protrusion being integrally formed with the cap layer;

    an encapsulating layer made of an opaque material applied to at least the substantially flat portion of the cap layer and to a side surface of the at least one protrusion, a top surface of the protrusion being substantially flush with an outer surface of the encapsulating layer.

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