Flexible press fit pins for semiconductor packages and related methods

• US 9,620,877 B2
• Filed: 05/04/2015
• Issued: 04/11/2017
• Est. Priority Date: 06/17/2014
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Yao, Yushuang, Chew, Chee Hiong, Prajuckamol, Atapol
• Primary Examiner(s): Patel, Tulsidas C
• Assistant Examiner(s): HARCUM, MARCUS E
• Application Number:
  US14/703,002
• Publication Number:
  US 20150364847A1
• Time in Patent Office: 708 Days
• Field of Search: 439700, 439824, 439751, 439943, 439 61, 439591
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H01R 12/585 Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
• CPC Class Codes: H01R 13/05 Resilient pins or blades carrying separate resilient parts H01R13/15
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending

Abstract

A pin for a semiconductor package includes an upper contact portion having a contact surface configured to mechanically and electrically couple with a pin receiver. A lower portion of the pin is configured to flex to allow an upper portion of the pin to move towards an upper contact surface of a horizontal base of the pin in response to a pressure applied along a direction collinear with a longest length of the pin towards the upper contact surface of the horizontal base when the pin is inserted into a pin receiver. Some implementations of pins include a vertical stop to stop movement of the pin when a surface of the vertical stop contacts the upper contact surface of the horizontal base. Varying implementations of pins include: two curved legs and one vertical stop; two partially curved legs and no vertical stop, and; a single leg bent into an N-shape.

Claims

1. A pin for a semiconductor package, comprising:

an upper contact portion comprising a contact surface configured to mechanically and electrically couple with a pin receiver;

a lower portion comprising a single vertical stop and at least two curved legs;

a horizontal base coupled directly to the at least two curved legs and configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface and the horizontal base extending substantially perpendicularly beyond a width of the upper contact portion, and;

a gap between a bottom contact surface of the single vertical stop and the upper contact surface of the horizontal base;

wherein the at least two curved legs are configured to flex to allow the bottom contact surface of the single vertical stop to move toward the upper contact surface of the horizontal base in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface, and;

wherein the single vertical stop is configured to stop movement of the pin when the bottom contact surface contacts the upper contact surface.

2. The pin of claim 1, wherein the single vertical stop is located between the at least two curved legs.

3. The pin of claim 1, wherein the upper contact portion comprises a deformable portion configured to deform along a direction substantially perpendicular with the longest length of the pin in response to inserting the upper contact portion into the pin receiver.

4. The pin of claim 1, wherein the pin comprises a plurality of stops extending substantially perpendicular to the longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from the pin receiver.

5. The pin of claim 1, wherein each of the at least two curved legs comprises an s-shape.

6. The pin of claim 5, wherein the s-shapes of the at least two curved legs are substantially parallel with one another.

7. The pin of claim 1, wherein the pin comprises a first gap between an upper curve of each of the at least two curved legs and the vertical stop and a second gap between a lower curve of each of the at least two curved legs and the single vertical stop, the first gap and the second gap visible when the pin is viewed from a perspective wherein one of the at least two curved legs is fully hid behind another of the at least two curved legs.

8. The pin of claim 1, wherein each of the at least two curved legs comprises a slanting portion slanting towards the single vertical stop along a direction diagonal to a plane of curvature of one of the at least two curved legs.

9. The pin of claim 1, wherein no gaps are visible between the at least two curved legs and the single vertical stop apart from the gap between the bottom contact surface of the single vertical stop and the upper contact surface of the horizontal base when the pin is viewed from a perspective fully hiding one of the at least two curved legs behind another of the at least two curved legs.

10. A pin for a semiconductor package, comprising:

an upper contact portion comprising a contact surface configured to mechanically and electrically couple with a pin receiver;

a lower portion bent into only one N-shape, wherein a first bend of the N-shape couples a first section of the N-shape into a slanted section of the N-shape and a second bend couples the slanted section of the N-shape to a second section of the N-shape substantially parallel with the first section of the N-shape;

a horizontal base coupled directly to the second section of the N-shape, the horizontal base configured to be soldered to a substrate to mechanically and electrically couple the pin to the substrate, the horizontal base having an upper contact surface and the horizontal base extending substantially perpendicularly beyond a width of the upper contact portion; and

a gap between a lower contact surface of the first bend and the upper contact surface of the horizontal base;

wherein the N-shape is configured to flex to allow the lower contact surface to move toward the upper contact surface in response to a pressure applied to the pin along a direction collinear with a longest length of the pin toward the upper contact surface, and;

wherein the N-shape is configured to stop flexing after the N-shape has bent sufficiently to allow the lower contact surface to contact the upper contact surface.

11. The pin of claim 10, wherein the first section of the N-shape is collinear with the longest length of the pin.

12. The pin of claim 10, wherein the second section of the N-shape is coupled to the horizontal base through a third bend comprising an angle between 60 and 120 degrees.

13. The pin of claim 10, wherein the upper contact portion comprises a deformable portion configured to deform along a direction perpendicular with the longest length of the pin in response to inserting the upper contact portion into the pin receiver.

14. The pin of claim 10, wherein the pin comprises a plurality of stops extending perpendicular to the longest length of the pin and configured to prevent the pin from moving relative to a casing of a semiconductor package when the pin is removed from the pin receiver.