Electromagnetic interference containment system

• US 9,622,394 B1
• Filed: 10/31/2014
• Issued: 04/11/2017
• Est. Priority Date: 05/30/2014
• Status: Active Grant

• Current Assignee: Emc IP Holding Company LLC (Dell Technologies Inc.)
• Original Assignee: Emc IP Holding Company LLC (Dell Technologies Inc.)
• Inventors: Willis, Clifford, Frank, Christopher, Olesiewicz, Timothy
• Primary Examiner(s): Zarroli, Michael
• Application Number:
  US14/530,631
• Time in Patent Office: 893 Days
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 5/0021 Side-by-side or stacked arrangements
• CPC Class Codes: H05K 5/0026 provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
• CPC Class Codes: H05K 7/1424 Card cages
• CPC Class Codes: H05K 7/1445 with double-sided connections
• CPC Class Codes: H05K 7/20136 Forced ventilation, e.g. by fans H05K7/202 takes precedence
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20563 within sub-racks for removing heat from electronic boards
• CPC Class Codes: H05K 9/0015 Gaskets or seals
• CPC Class Codes: H05K 9/0081 Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence

Abstract

A chassis includes a flash module comprising a cover and an integrated connector, a metal stiffener, an electromagnetic interference (EMI) gasket, and a midplane. The flash module is connected to the midplane using the integrated connector, the integrated connector extends past the cover of the flash module, and, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket, in which the metal stiffener is interposed between the EMI gasket and the midplane.

Claims

1. A chassis, comprising:

a flash module comprising a cover and an integrated connector, the flash module comprising;

a printed circuit board (PCB) disposed therein; and

a thermal interface material (TIM) disposed between a component of the PCB and a cover of the flash module;

a metal stiffener;

an electromagnetic interference (EMI) gasket; and

a midplane, wherein the flash module is connected to the midplane using the integrated connector;

wherein the integrated connector extends past the cover of the flash module;

wherein, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket and wherein the metal stiffener is interposed between the EMI gasket and the midplane.

2. The chassis of claim 1, wherein the metal stiffener comprises Aluminum.

3. The chassis of claim 1, wherein the metal stiffener comprises a plurality of holes to permit airflow through the metal stiffener.

4. The chassis of claim 1, wherein the metal stiffener provides EMI containment for at least a part of the chassis.

5. The chassis of claim 1, wherein the cover of the flash module comprises Aluminum.

6. The chassis of claim 1, wherein the cover of the flash module provides EMI shielding for the flash module.

7. The chassis of claim 1, wherein the flash module is one of a plurality of flash modules in a module bay of the chassis and wherein each of the flash modules is arranged within the module bay to permit airflow from a front portion of the chassis to the midplane.

8. The chassis of claim 7, wherein the midplane comprises at least one hole to permit airflow through the midplane from the front portion of the chassis to a rear portion of the chassis.

9. The chassis of claim 1, wherein the EMI gasket comprises a foam.

10. The chassis of claim 1, wherein the EMI gasket comprises a gel.

11. The chassis of claim 1, wherein the cover of the flash module comprises a top cover and a bottom cover, and wherein the top cover and the bottom cover act as heat sinks for the flash module and wherein the top cover and the bottom cover provide EMI shielding for the flash module.

12. The chassis of claim 1, wherein EMI containment is extended when the flash module is plugged-in to the midplane, in the form of a Faraday Cage.

13. The chassis of claim 1, wherein the flash module is a Faraday Cage.

14. The chassis of claim 1, wherein the chassis is a Faraday Cage.

15. The chassis of claim 1, wherein the integrated connector is a PCIe connector.

16. The chassis of claim 15, wherein the midplane includes at least one module connector configured to interface with the PCIe connector of the flash module.

17. The chassis of claim 1, wherein the flash module further comprises a second integrated connector.

18. The chassis of claim 17, wherein the flash module is further connected to the midplane using the second integrated connector.

19. The chassis of claim 1, wherein the cover of the flash module comprises a top cover and a bottom cover, and wherein the top cover and the bottom cover provide EMI shielding for the flash module.