Electroplating apparatus with improved throughput
First Claim
1. A wafer-holding jig for electroplating of a plurality of photovoltaic structures, comprising:
- a common connector electrically coupled to a cathode, wherein the common connector is a metal beam;
a wafer-holding mechanism consisting of a pair of wafer-mounting frames electrically coupled to the common connector,wherein each wafer-mounting frame comprises a plurality of openings and a plurality of spring-loaded mechanisms that hold to-be-plated photovoltaic structures in the openings,wherein each wafer-mounting frame comprises a plurality of through holes that are positioned between the openings, thereby facilitating flow of metal ions and electric field through the frame,wherein each spring-loaded mechanism comprises a back part in a fixed position, a rotatable front part, and a spring coupling the back part and the front part,wherein one end of the spring is directly attached to the wafer-mounting frame,wherein the wafer-mounting frames are arranged in such a way that a first to-be-plated photovoltaic structure mounted on a first wafer-mounting frame is positioned substantially parallel to a second to-be-plated photovoltaic structure mounted on a second wafer-mounting frame,wherein an open space exists between the first to-be-plated photovoltaic structure and the second to-be-plated photovoltaic structure to facilitate simultaneous plating of front and back surfaces of the plurality of the photovoltaic structures, andwherein a distance between the wafer-mounting frames is between 2 and 20 cm.
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Accused Products
Abstract
One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.
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Citations
15 Claims
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1. A wafer-holding jig for electroplating of a plurality of photovoltaic structures, comprising:
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a common connector electrically coupled to a cathode, wherein the common connector is a metal beam; a wafer-holding mechanism consisting of a pair of wafer-mounting frames electrically coupled to the common connector, wherein each wafer-mounting frame comprises a plurality of openings and a plurality of spring-loaded mechanisms that hold to-be-plated photovoltaic structures in the openings, wherein each wafer-mounting frame comprises a plurality of through holes that are positioned between the openings, thereby facilitating flow of metal ions and electric field through the frame, wherein each spring-loaded mechanism comprises a back part in a fixed position, a rotatable front part, and a spring coupling the back part and the front part, wherein one end of the spring is directly attached to the wafer-mounting frame, wherein the wafer-mounting frames are arranged in such a way that a first to-be-plated photovoltaic structure mounted on a first wafer-mounting frame is positioned substantially parallel to a second to-be-plated photovoltaic structure mounted on a second wafer-mounting frame, wherein an open space exists between the first to-be-plated photovoltaic structure and the second to-be-plated photovoltaic structure to facilitate simultaneous plating of front and back surfaces of the plurality of the photovoltaic structures, and wherein a distance between the wafer-mounting frames is between 2 and 20 cm. - View Dependent Claims (2, 3, 4, 5)
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6. An electroplating apparatus, comprising:
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a tank filled with an electrolyte solution; a number of anodes situated around edges of the tank; a cathode; and a plurality of wafer-holding jigs attached to the cathode, wherein a respective wafer-holding jig comprises; a common connector electrically coupled to the cathode, wherein the common connector is a metal beam; a wafer-holding mechanism consisting of a pair of wafer-mounting frames electrically coupled to the common connector, wherein each wafer-mounting frame includes a plurality of openings and a plurality of spring-loaded mechanisms that hold to-be-plated photovoltaic structures in the opening, wherein each wafer-mounting frame comprises a plurality of through holes that are positioned between the openings, thereby facilitating flow of metal ions and electric field through the frame, wherein each spring-loaded mechanism comprises a back part in a fixed position, a rotatable front part, and a spring coupling the back part and the front part, wherein one end of the spring is directly attached to the wafer-mounting frame, wherein the wafer-mounting frames are arranged in such a way that a first to-be-plated photovoltaic structure mounted on a first wafer-mounting frame is positioned substantially parallel to a second to-be-plated photovoltaic structure mounted on a second wafer-mounting frame, wherein an open space exists between the first to-be-plated photovoltaic structure and the second to-be-plated photovoltaic structure to facilitate simultaneous plating of both the front and back sides of the first and second to-be-plated photovoltaic structures, and wherein a distance between the wafer-mounting frames is between 2 and 20 cm. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification