Electronic device and method for manufacturing the same
First Claim
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1. An electronic device comprising:
- a support member including at least a portion formed of a conductive material;
an enclosure member configured to receive the support member; and
a circuit board received in the enclosure member,wherein the enclosure member includes at least a portion formed of a conductive material,wherein the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other, andwherein the conductive material portion of the support member is connected to the circuit board to provide grounding of the circuit board.
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Accused Products
Abstract
An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
28 Citations
18 Claims
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1. An electronic device comprising:
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a support member including at least a portion formed of a conductive material; an enclosure member configured to receive the support member; and a circuit board received in the enclosure member, wherein the enclosure member includes at least a portion formed of a conductive material, wherein the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other, and wherein the conductive material portion of the support member is connected to the circuit board to provide grounding of the circuit board. - View Dependent Claims (2, 3, 4)
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5. An electronic device, comprising:
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a support member including at least a portion formed of a conductive material; and an enclosure member configured to receive the support member, wherein the enclosure member includes at least a portion formed of a conductive material, wherein the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other, and wherein the enclosure member comprises; a molding enclosure formed of a non-conductive material, wherein the molding enclosure is configured to receive the support member; and a frame enclosure formed of a conductive material, wherein the frame enclosure is configured to enclose at least a portion of an outer surface of the molding enclosure. - View Dependent Claims (6, 7, 8, 9)
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10. An electronic device, comprising:
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a support member including at least a portion formed of a conductive material; and an enclosure member configured to receive the support member, wherein the enclosure member includes at least a portion formed of a conductive material, wherein the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other, wherein the conductive material portion of the enclosure member is at least partially adjacent to the support member, wherein a portion of the support member, which is adjacent to the conductive material portion of the enclosure member, is formed of a non-conductive material, wherein the enclosure member comprises four corners, and wherein a portion of the conductive material portion of the enclosure member is adjacent to a portion of the support member in at least one of the four corners.
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11. An electronic device, comprising:
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a support member including at least a portion formed of a conductive material; and an enclosure member configured to receive the support member, wherein the enclosure member includes at least a portion formed of a conductive material, wherein the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other, wherein the enclosure member comprises; a molding enclosure coupled to face the support member; and a frame member formed of a conductive material configured to be coupled to the support member and to form a sidewall of the molding enclosure, and wherein the frame member is slidably coupled to the support member. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method for manufacturing an electronic device, the method comprising:
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manufacturing an enclosure member, wherein at least a portion of the enclosure member is formed of a conductive material; manufacturing a support member, wherein at least a portion of the support member is formed of a conductive material; receiving the support member in the enclosure member such that the conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other; and receiving a circuit board in the enclosure member, wherein the conductive material portion of the support member is connected to the circuit board to providing grounding of the circuit board.
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Specification