Radio frequency identification sensor assembly

• US 9,626,612 B2
• Filed: 12/19/2012
• Issued: 04/18/2017
• Est. Priority Date: 12/21/2011
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Inventors: Forster, Ian J.
• Primary Examiner(s): Le, Thien M
• Assistant Examiner(s): Habib, Asifa
• Application Number:
  US13/719,396
• Publication Number:
  US 20130161400A1
• Time in Patent Office: 1,581 Days
• Field of Search: 235488, 34053912, 3405731, 340 1041, 4352861, 422 22, 428327, 73727
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/0717 the sensor being capable of sensing environmental conditions such as temperature history or pressure
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations

Abstract

In accordance with one embodiment, an RFID sensor assembly comprises an RFID chip, an antenna, a sensor, a substrate, and a laminated layer. The RFID chip is in electrical communication with the antenna and the sensor. The RFID chip, antenna, and sensor are secured to the substrate. The laminated layer is arranged as to create a generally airtight pouch between the substrate and the laminate layer. The laminated layer is further arranged to facilitate a post manufacturing method for exposing the contents of the pouch to the environment surrounding the RFID sensor assembly.

Claims

1. A RFID sensor assembly comprising:

a chip;

an antenna;

a sensor that includes an absorbent material that is treated with a detecting reagent;

at least one electrical lead;

a laminated layer;

a substrate;

wherein the chip is in electrical contact with the antenna and in communication with the sensor and can measure a property of a sensor material to determine properties or conditions of an environment surrounding the sensor;

wherein the chip, antenna, sensor, and at least one electrical lead is secured to the substrate;

wherein the laminated layer is arranged as to create a generally sealed pouch between the substrate and the laminated layer and the laminated layer is secured to the substrate along a seal edge; and

wherein the laminated layer is arranged to facilitate a post-manufacturing method for exposing the contents of the pouch to the environments surrounding the RFID sensor assembly; and

the RFID sensor assembly has a permeable layer above the sensor;

the sensor comprises at least one capsule associated with the sensor; and

wherein the capsules include an activating reagent.

2. The RFID sensor assembly of claim 1, wherein the laminated layer is over the substrate, chip, antenna, sensor and at least one electrical lead.

3. The RFID sensor assembly of claim 2, wherein the laminated layer includes a permeable membrane located above the sensor.

4. The RFID sensor assembly of claim 1, wherein the laminated layer is only applied to the sensor.

5. The RFID sensor assembly of claim 1, wherein the electrical property of the sensor material is selected from the group consisting of conductivity, dielectric constant, magnetic permeability or a combination of any of these properties.

6. The RFID sensor assembly of claim 1, wherein there are two electrical leads.

7. The RFID sensor assembly of claim 1, wherein the sensor is arranged to measure humidity, temperature, atmospheric pressure or any combination thereof.

8. The RFID sensor assembly of claim 1, wherein the sensor is arranged to determine the presence of a specific or general class of airborne chemicals or chemicals that directly contact the sensor.

9. The RFID sensor assembly of claim 1, wherein the sensor is arranged to determine physical changes experienced in an object due to forces.

10. The RFID sensor assembly of claim 1, wherein the sealed pouch is substantially airtight.

11. The RFID sensor assembly of claim 1, wherein the RFID sensor assembly is inactive when the pouch is intact.

12. The RFID sensor assembly of claim 11, wherein the RFID sensor assembly is active when the sensor is exposed due to a post manufacturing process.

13. The RFID sensor assembly of claim 1, wherein the sensor is activated by an activating reagent.

14. The RFID sensor assembly of claim 1, wherein the sensor is comprised of electrically activatable material.

15. A method of manufacturing an RFID sensor assembly including securing an RFID chip, antenna, sensor that comprises an absorbent material that is treated with a detecting agent, and at least one electrical lead to a substrate;

the RFID sensor assembly has a permeable layer above the sensor;

the sensor comprises at least one capsule associated with the sensor; and

wherein the capsules include an activating reagent;

Applying a laminated layer so as to secure the substrate along a seal edge such that the laminated layer includes a permeable membrane located over the sensor;

wherein the seal edge can be formed such that the seal between the laminated layer and substrate is a hermetic seal so that a pouch is formed that is substantially airtight and the sensor is in an inactive state when the laminated layer is formed over the sensor; and

wherein the laminated layer is arranged to facilitate a post-manufacturing method for exposing the contents of the pouch to the environments surrounding the RFID sensor assembly.

16. The method of manufacturing an RFID sensor assembly of claim 15, wherein the RFID chip, sensor and at least one electrical lead are secured by adhesives.

17. The method of manufacturing an RFID sensor assembly of claim 15, wherein the RFID chip, sensor and at least one electrical lead are secured by printing.

18. The method of manufacturing an RFID sensor assembly of claim 15, wherein the laminated layer is formed over the substrate, RFID chip, antenna, sensor, and at least one electrical lead.