Methods of forming a microshield on standard QFN package

• US 9,627,230 B2
• Filed: 02/28/2011
• Issued: 04/18/2017
• Est. Priority Date: 02/28/2011
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Carey, Dan, Calhoun, Brian Howard
• Primary Examiner(s): Nguyen, Donghai D
• Application Number:
  US13/036,272
• Publication Number:
  US 20120218729A1
• Time in Patent Office: 2,241 Days
• Field of Search: 29827, 29832, 29841, 29412, 257659, 257666, 257676, 438112, 438113, 438123, 438124
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.

Claims

1. A method of manufacturing an electronic package, comprising:

providing a metallic lead frame having a component area on a surface of the metallic lead frame and a metallic structure associated with the component area, wherein the metallic structure comprises a plurality of connection portions, each connection portion comprising a plurality of connection leads;

providing an electronic component on the component area;

providing an overmold within and over the metallic lead frame such that the overmold covers the component area;

forming an opening through the overmold that exposes at least a section of the metallic structure;

applying an electromagnetic shield material within the opening and over the overmold to form an electromagnetic shield over the component area such that the electromagnetic shield is coupled to at least the section of the metallic structure exposed by the opening;

coupling the metallic structure to ground with a grounding portion;

partially etching the grounding portion through a first etch; and

partially etching the metallic lead frame on a subset of the plurality of connection leads such that remaining ones of the plurality of connection leads other than the subset form grounding leads different from the grounding portion for connection to ground with a second etch.

2. The method of claim 1, further comprising:

wherein forming the opening through the overmold that exposes at least the section of the metallic structure includes exposing at least a section of the grounding portion; and

wherein applying the electromagnetic shield material within the opening and over the overmold to form the electromagnetic shield over the component area includes forming the electromagnetic shield such that the electromagnetic shield is coupled to at least the section of the grounding portion.

3. The method of claim 1, wherein:

forming the opening through the overmold that exposes at least the section of the metallic structure comprises forming the opening such that the section of the metallic structure exposed by the opening includes at least a section of the grounding portion; and

applying the electromagnetic shield material within the opening and over the overmold to form the electromagnetic shield over the component area such that the electromagnetic shield is coupled to at least the section of the metallic structure exposed by the opening includes forming the electromagnetic shield such that the electromagnetic shield is coupled to at least the section of the grounding portion exposed by the opening.

4. The method of claim 1, wherein the metallic structure includes a signal connection element for transmitting signals.

5. The method of claim 1, further comprising applying a noble metal to at least a section of the metallic lead frame.

6. The method of claim 1, wherein the metallic lead frame has a component portion that includes the component area on the surface of the metallic lead frame and the metallic structure associated with the component area extends along a periphery of the component portion.

7. The method of claim 6, wherein the metallic structure substantially surrounds the periphery of the component portion.

8. The method of claim 6, wherein providing the metallic lead frame having the component area on the surface of the metallic lead frame and the metallic structure associated with the component area comprises:

providing the metallic lead frame so as to include a first side and a second side oppositely disposed from the first side, the first side having the component area on the surface of the metallic lead frame; and

wherein the first etch comprises performing a first partial etch on the grounding portion from the second side of the metallic lead frame.

9. The method of claim 8, wherein providing the metallic lead frame having the component area on the surface of the metallic lead frame and the metallic structure associated with the component area comprises:

providing the metallic lead frame such that the metallic structure further includes a signal lead for transmitting signals; and

wherein the second etch comprises performing a second partial etch on at least a section of the signal lead from the first side of the metallic lead frame such that at least the section of the signal lead is partially etched from the first side of the metallic lead frame.

10. The method of claim 6 wherein the metallic structure substantially surrounds the periphery of the component portion and each of the plurality of connection portions is positioned between one of a plurality of grounding portions and another one of the plurality of grounding portions.

11. A method of manufacturing a plurality of electronic packages, comprising:

providing a metallic lead frame having a plurality of component portions and a plurality of metallic structures wherein each of the plurality of metallic structures extends about a periphery of one of the plurality of component portions and each of the plurality of component portions defines a component area on a surface of the metallic lead frame;

providing electronic components on component areas;

providing an overmold within the metallic lead frame and over the surface of the metallic lead frame to cover the component areas;

forming channels through the overmold about the periphery of each of the plurality of component portions, wherein the channels expose at least a section of each of the plurality of metallic structures; and

applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields wherein each electromagnetic shield is formed over the component area of one of the plurality of component portions and at least the section of each of the plurality of metallic structures is coupled to one of the electromagnetic shields.

12. The method of claim 11, wherein each of the plurality of metallic structures substantially surrounds one of the plurality of component portions.

13. The method of claim 11, wherein providing the metallic lead frame having the plurality of component portions and the plurality of metallic structures comprises:

providing the metallic lead frame so that the metallic lead frame includes a first side and a second side oppositely disposed from the first side, the first side having the component areas, each of the plurality of metallic structures having a grounding portion that is coupled to the metallic lead frame for connecting to ground; and

performing a first partial etch on the grounding portion of each of the plurality of metallic structures from the second side of the metallic lead frame such that the grounding portion of each of the plurality of metallic structures is partially etched on the second side of the metallic lead frame.

14. The method of claim 13, wherein providing the metallic lead frame having the plurality of component portions and the plurality of metallic structures further comprises:

providing the metallic lead frame such that each of the plurality of metallic structures includes a signal lead for transmitting signals; and

performing a second partial etch on at least a section of the signal lead of each of the plurality of metallic structures from the first side of the metallic lead frame such that at least the section of the signal lead of each of the plurality of metallic structures is partially etched on the first side of the metallic lead frame.

15. The method of claim 14, further comprising:

wherein forming the channels through the overmold that exposes at least the section of each of the plurality of metallic structures comprises forming the channels through the overmold from the first side of the metallic lead frame and about the periphery of each of the plurality of component portions such that at least a section of the grounding portion of each of the plurality of metallic structures is exposed by the channels from the first side of the metallic lead frame and at least the section of the signal lead of each of the plurality of metallic structures remains unexposed from the first side of the metallic lead frame; and

wherein applying the electromagnetic shield material over the overmold and in the channels to form the electromagnetic shields wherein each electromagnetic shield is formed over the component area of one of the plurality of component portions and at least the section of each of the plurality of metallic structures is coupled to one of the electromagnetic shields includes, for each of the plurality of metallic structures, coupling at least the section of the grounding portion that is exposed from the first side of the metallic lead frame by the channels to one of the electromagnetic shields, wherein at least the section of each of the plurality of metallic structures that is coupled to one of the electromagnetic shields comprises at least the section of the grounding portion exposed by the channels.

16. The method of claim 15, wherein at least the section of the signal lead of each of the plurality of metallic structures is positioned directly below the channels relative to the first side of the metallic lead frame.

17. The method of claim 15 wherein:

after applying the electromagnetic shield material over the overmold and in the channels to form the electromagnetic shields over the component areas of each of the plurality of component portions, a plurality of unsingulated electronic packages are formed on the metallic lead frame, wherein each of the plurality of unsingulated electronic packages comprises one of the plurality of component portions and one of the plurality of metallic structures,

singulating the plurality of unsingulated electronic packages to provide singulated electronic packages.

18. The method of claim 11, further comprising:

wherein providing the metallic lead frame so as to include a first side and a second side oppositely disposed from the first side, the first side having the component areas, each of the plurality of metallic structures having a first connection lead that is groundable and each of the plurality of metallic structures having a second connection lead for transmitting signals; and

performing a first partial etch on the second connection lead of each of the plurality of metallic structures from the first side of the metallic lead frame such that at least a section of the second connection lead of each of the plurality of metallic structures is partially etched on the first side of the metallic lead frame and the first connection lead is unetched by the first partial etch.

19. The method of claim 18, further comprising:

wherein forming the channels through the overmold wherein the channels expose at least the section of each of the plurality of metallic structures comprises forming the channels through the overmold from the first side of the metallic lead frame and about the periphery of each of the plurality of component portions comprises forming the channels such that, for each of the plurality of metallic structures, the channels expose at least a section of the first connection lead from the first side of the metallic lead frame and at least the section of the second connection lead that was partially etched remains unexposed from the first side of the metallic lead frame; and

wherein applying the electromagnetic shield material over the overmold and in the channels to form the electromagnetic shields wherein each electromagnetic shield is formed over the component area of one of the plurality of component portions and at least the section of each of the plurality of metallic structures is coupled to one of the electromagnetic shields includes, for each of the plurality of metallic structures, coupling the one of the electromagnetic shields to at least the section of the first connection lead that is exposed from the first side of the metallic lead frame by the channels, wherein at least the section of each of the plurality of metallic structures comprises at least the section of the first connection lead.