Method for interconnecting stacked semiconductor devices
First Claim
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1. A method for making a stacked semiconductor device comprising:
- molding rims on a first die and a second die, the rims extending laterally away from the first and second dice, each of the rims including upper and lower rim faces, and the first and second dice are between the respective upper and lower rim faces;
stacking the second die over the first die, stacking the second die over the first die includes;
engaging an upper rim face of the first die with a lower rim face of the second die, andadhering the upper rim face of the first die to the lower rim face of the second die; and
drilling one or more vias through the rims after stacking, the one or more vias extending between the first and second dice.
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Abstract
A method for making a semiconductor device includes forming rims on first and second dice. The rims extend laterally away from the first and second dice. The second die is stacked over the first die, and one or more vias are drilled through the rims after stacking. The semiconductor device includes redistribution layers extending over at least one of the respective first and second dice and the corresponding rims. The one or more vias extend through the corresponding rims, and the one or more vias are in communication with the first and second dice through the rims.
13 Citations
20 Claims
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1. A method for making a stacked semiconductor device comprising:
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molding rims on a first die and a second die, the rims extending laterally away from the first and second dice, each of the rims including upper and lower rim faces, and the first and second dice are between the respective upper and lower rim faces; stacking the second die over the first die, stacking the second die over the first die includes; engaging an upper rim face of the first die with a lower rim face of the second die, and adhering the upper rim face of the first die to the lower rim face of the second die; and drilling one or more vias through the rims after stacking, the one or more vias extending between the first and second dice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for making a stacked semiconductor device comprising:
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sorting dice into a plurality of operational dice, the plurality of operational dice tested for operability; forming at least a first reconstituted dice panel including; arranging the sorted plurality of operational dice within a panel frame, and molding a resin around the plurality of operational dice within the panel frame to form the first reconstituted dice panel, rims formed with the resin extend laterally from each of the plurality operational dice, and each of the rims includes upper and lower rim faces; repeating arranging and molding to form a second reconstituted dice panel, rims extend laterally away from each die of the plurality of operational dice of the second reconstituted dice panel; coupling the first reconstituted dice panel to the second reconstituted dice panel including engaging upper rim faces of the first reconstituted dice panel with lower rim faces of the second reconstituted dice panel; and drilling one or more vias in the coupled first and second reconstituted dice panels, the one or more vias within the rims of the plurality of operational dice and the one or more vias extend between the first and second reconstituted dice panels. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification