Method for encapsulating an electronic arrangement

• US 9,627,646 B2
• Filed: 08/28/2009
• Issued: 04/18/2017
• Est. Priority Date: 09/18/2008
• Status: Expired due to Fees

• Current Assignee: Tesa SE (Maxingvest AG)
• Original Assignee: Tesa SE (Maxingvest AG)
• Inventors: Ellinger, Jan, Krawinkel, Thorsten, Keite-Telgenbscher, Klaus, Staiger, Anja
• Primary Examiner(s): HAUTH, GALEN H
• Application Number:
  US12/549,767
• Publication Number:
  US 20100068514A1
• Time in Patent Office: 2,790 Days
• Field of Search: 2642711, 26427211, 26427217
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 153/025 modified
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: Y10T 428/2835 including moisture or waterproof component

Abstract

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Claims

1. Method for encapsulating an electronic arrangement against permeants, the method comprising:

providing a pressure-sensitive adhesive composition comprised of vinylaromatic block copolymers and at least one resin having a softening point of 100°

C. or more, wherein the pressure-sensitive adhesive composition exhibits a combination of adhesive and cohesive properties such that the pressure-sensitive adhesive composition constantly exhibits permanent tack and flexibility, wherein the block copolymers contain polymer blocks formed by vinylaromatics, wherein the block copolymers contain polymer blocks formed by polymerization of 1,3-dienes that are partially, selectively or fully hydrogenated polymer blocks, wherein the at least one resin is a hydrogenated hydrocarbon resin having a degree of hydrogenation of at least 90%, a DACP value of more than 30°

C. and a MMAP value of more than 50°

C., and further wherein the pressure-sensitive adhesive composition has a WVTR of less than 100 g/m²·

d; and

applying the pressure-sensitive adhesive composition onto and/or around regions of the electronic arrangement that are to be encapsulated.

2. Method according to claim 1, wherein the pressure-sensitive adhesive composition is provided in the form of an adhesive tape.

3. Method according to claim 1 wherein the pressure-sensitive adhesive composition is crosslinked after application on the electronic arrangement.

4. Method according to claim 1, wherein the application of the pressure-sensitive adhesive composition is effected without a subsequent thermal process step or irradiation.

5. Method of claim 1, wherein the pressure-sensitive adhesive composition contains polymer blocks formed by polymerization of butadiene and/or isoprene.

6. Method according to claim 5, wherein the block copolymers have a polyvinylaromatic fraction of 10% by weight to 35% by weight.

7. Method according to claim 5, wherein the pressure-sensitive adhesive composition has a fraction of the vinylaromatic block copolymers of at least 35% by weight, and the pressure-sensitive adhesive composition has a fraction of the vinylaromatic block copolymers of at most 80% by weight.

8. Method according to claim 1, wherein the hydrogenated hydrocarbon resin is based on hydrogenated polymers of dicyclopentadiene and has a degree of hydrogenation of at least 95%, a DACP value of more than 37°

C. and a MMAP value of more than 60°

C.

9. Method according to claim 1, wherein the at least one resin is selected from the group consisting of non-hydrogenated, partially hydrogenated or fully hydrogenated resins based on rosin and rosin derivatives, hydrogenated polymers of dicyclopentadiene, non-hydrogenated or partially, selectively or fully hydrogenated hydrocarbon resins based on C5, C5-C9 or C9 monomer streams, polyterpene resins based on α

-pinene and/or β

-pinene and/or δ

-limonene, and hydrogenated polymers of pure C8 and C9 aromatics.

10. Method according to claim 5, wherein the pressure-sensitive adhesive composition contains one or more additives selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, process stabilizers, light stabilizers, processing assistants, end block reinforcer resins and polymers.

11. Method according to claim 5, wherein the pressure-sensitive adhesive composition contains one or more nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

12. Method according to claim 11, wherein the fillers are embodied in nanoscale fashion in at least one dimension.

13. Method according to claim 11 the pressure-sensitive adhesive composition has a fraction of the fillers of at least 5% by weight and/or has a fraction of the fillers of at most 95% by weight.

14. Method according to claim 5, wherein the pressure-sensitive adhesive composition has an average transmittance of at least 75% in the wavelength range of 400 nm to 800 nm.

15. Method according to claim 5, wherein the pressure-sensitive adhesive composition is embodied in UV-blocking fashion in the wavelength range of 190 nm to 400 nm, where an average transmittance of at most 20% is designated as UV-blocking.

16. Method according to claim 5, wherein the pressure-sensitive adhesive composition, after crosslinking, has an elongation at break of at least 20%.

17. Method according to claim 5, wherein the pressure-sensitive adhesive composition has an OTR of less than 10 000 g/m²·

d·

bar.

18. Method according to claim 5, wherein the pressure-sensitive adhesive composition is embodied as a carrier-free adhesive tape.

19. Method according to claim 2, wherein the layer thickness of the pressure-sensitive adhesive composition in the adhesive tape is at least 1 μ

m—

and/or the layer thickness of the pressure-sensitive adhesive composition in the adhesive tape is at most 150 μ

m.

20. Method according to claim 1, wherein epoxidized vinylaromatic block copolymers are excluded from the vinylaromatic block copolymers of the pressure-sensitive adhesive composition.

21. Method for encapsulating an electronic arrangement against permeants, the method comprising:

providing a pressure-sensitive adhesive composition comprised of vinylaromatic block copolymers, wherein the pressure-sensitive adhesive composition contains a resin or a resin mixture, wherein the pressure-sensitive adhesive composition contains at least one resin, having a softening point of 100°

C. or more, that provides a permeation barrier against oxygen, wherein the block copolymers contain polymer blocks formed by vinylaromatics, wherein the block copolymers contain polymer blocks formed by polymerization of 1,3-dienes that are partially, selectively or fully hydrogenated polymer blocks, wherein the at least one resin is a hydrogenated hydrocarbon resin having a degree of hydrogenation of at least 90%, a DACP value of more than 30°

C. and a MMAP value of more than 50°

C., and further wherein the pressure-sensitive adhesive composition has a WVTR of less than 100 g/m²·

d; and

applying the pressure-sensitive adhesive composition onto and/or around regions of the electronic arrangement that are to be encapsulated.

22. Method for encapsulating an electronic arrangement against permeants, the method comprising:

providing a pressure-sensitive adhesive composition comprised of vinylaromatic block copolymers and at least one resin having a DACP value of more than 30°

C. and a MMAP value of more than 50°

C., wherein the pressure-sensitive adhesive composition exhibits a combination of adhesive and cohesive properties such that the pressure-sensitive adhesive composition constantly exhibits permanent tack and flexibility, wherein the block copolymers contain polymer blocks formed by vinylaromatics, wherein the block copolymers contain polymer blocks formed by polymerization of 1,3-dienes that are partially, selectively or fully hydrogenated polymer blocks, wherein the at least one resin is a hydrogenated hydrocarbon resin having a degree of hydrogenation of at least 90%, and further wherein the pressure-sensitive adhesive composition has a WVTR of less than 100 g/m²·

d; and

applying the pressure-sensitive adhesive composition onto and/or around regions of the electronic arrangement that are to be encapsulated.