Compressible thermally conductive articles

• US 9,629,283 B2
• Filed: 06/05/2014
• Issued: 04/18/2017
• Est. Priority Date: 06/05/2014
• Status: Active Grant

• Current Assignee: Rogers Corporation (Rogers Communications Inc.)
• Original Assignee: Rogers Corporation (Rogers Communications Inc.)
• Inventors: Soong, Sharon, Smith, Ian
• Primary Examiner(s): Vo, Hai
• Application Number:
  US14/296,504
• Publication Number:
  US 20150359134A1
• Time in Patent Office: 1,048 Days
• CPC Class Codes: C08J 2205/05 Open cells, i.e. more than 50% of the pores are open
• CPC Class Codes: C08J 9/06 by a chemical blowing agent
• CPC Class Codes: C08J 9/12 by a physical blowing agent
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

A compressible thermally conductive sheet comprises a plurality of through holes in a foam material substantially connecting first and second heat transfer surfaces to provide thermal pathways between surfaces. The though holes are filled with a non-foam thermally conductive composition in which thermally-conductive particulate filler is dispersed in a polymeric matrix. Also disclosed is a heat management assembly comprising the compressible thermally conductive sheet.

Claims

1. A compressible thermally conductive sheet having a first and second heat transfer surface and a plurality of through holes connecting the first and second heat transfer surfaces to provide a thermal pathway there between, wherein the sheet comprises a polymeric foam pad having through holes that are filled with a non-foamed thermally conductive composition comprising thermally conductive particulate filler dispersed in a polymeric, matrix, wherein the particulate filler consists of a material selected from the group consisting of metal oxides, non-metal oxides, nitrides, carbides, borides and combinations thereof, wherein the filler has a thermal conductivity of about 0.5 W/m-K to about 1000 W/m-K;

wherein the compressible thermally conductive sheet has a thermal conductivity of at least 0.5 W/m-K;

wherein the density of the through holes is 100,000 holes per square meter to 2 million holes per square meter;

wherein the metal oxide is aluminum oxide, magnesium oxide, beryllium oxide, or combinations thereof; and

wherein the non-foamed thermally conductive composition is free from filler particles comprising metal.

2. The compressible thermally-conductive sheet of claim 1 wherein the filler has a thermal conductivity of about 25 W/m-K to about 1000 W/m-K.

3. The compressible thermally-conductive sheet of claim 1 wherein the average thickness is 0.1 to 25 mm.

4. The compressible thermally-conductive sheet of claim 1 wherein the compression set is 1 to 10%.

5. The compressible thermally-conductive sheet of claim 1 wherein the compression force deflection is 1 to 20 psi.

6. The compressible thermally-conductive sheet of claim 1 wherein the sheet is 0.1 to 25 mm thick, the compression set is 1 to 5%, and the compression force deflection is 2 to 12 psi.

7. The compressible thermally-conductive sheet of claim 1 wherein the polymeric foam pad has a density of 6 to 25 pcf.

8. The compressible thermally-conductive sheet of claim 1 wherein the cells of the polymeric foam pad have average cell diameters of about 20 to about 500 micrometer.

9. The compressible thermally-conductive sheet of claim 1 wherein the foam pad comprises at least 60 percent polyurethane optionally blended with another polymer selected from the group consisting of silicone, polyolefin, polyester, polyamide, fluorinated polymer, polyalkylene oxide, polyvinyl alcohol, ionomer, cellulose acetate, polystyrene, and combinations thereof.

10. The compressible thermally-conductive sheet of claim 1 wherein the through holes have an average diameter of 0.3 mm to 5 mm.

11. The compressible thermally-conductive sheet of claim 1 wherein the through holes are generally cylindrical in shape and substantially perpendicular to the surfaces of the first and second heat transfer surfaces.

12. The compressible thermally-conductive sheet of claim 1 wherein the density of the through holes is 250,000 holes per square meter to 1,250,000 holes per square meter and wherein the through holes have an average diameter of 0.5 mm to 2 mm.

13. The compressible thermally-conductive sheet of claim 1 wherein the non-foamed thermally conductive composition comprises a heat cured silicone composition.

14. The compressible thermally-conductive sheet of claim 13 wherein the heat cured silicone comprises a two-part liquid silicone rubber or gel.

15. The compressible thermally-conductive sheet of claim 1 wherein non-foamed thermally conductive composition is the product of a process comprising filling the through holes with a precursor composition having a viscosity of less than 100,000 cps, as measured with a Brooks meter with no. 6 spindle and 2 rpm setting.

16. The compressible thermally-conductive sheet of claim 1 wherein the non-foamed thermally conductive composition comprises about 20% to 80% by weight of thermally conductive filler.

17. The compressible thermally-conductive sheet of claim 1 wherein the particulate filler is a ceramic.

18. The compressible thermally-conductive sheet of claim 1 wherein the non-foamed thermally conductive composition comprises boron nitride particles.

19. The compressible thermally-conductive sheet of claim 1 wherein the particles have thermal conductivity of 25 to 500 W/mK.

20. A thermal management assembly comprising the thermally conductive foam material of claim 1 disposed and compressed between a first heat transfer surface and a second heat transfer surface opposing said first heat transfer surface;

wherein the thermally conductive foam material is compressed between the first and second heat transfer surfaces to provide a thermally-conductive pathway there between.

21. The assembly of claim 20 wherein one of the first or second heat transfer surfaces is located on a heat generating source.

22. The assembly of claim 20 wherein the heat-generating source is an electronic component and the other one of the first or second heat transfer surface is located on a thermal dissipation member.

23. The assembly of claim 22 wherein the thermal dissipation member is a heat sink or a circuit board.

24. A compressible thermally conductive sheet having a first and second heat transfer surface and a plurality of through holes substantially transverse to the first and second heat transfer surfaces to provide a thermal pathway there between;

wherein said sheet comprises a foam polymeric pad having through holes that are filled with a non-foamed thermally conductive composition comprising about 20% to 80% by weight of dispersed thermally-conductive particulate filler, wherein the particulate filler consists of ceramic having on average a thermal conductivity of 25 to 500 W/m-K;

wherein the particular filler is dispersed in a polymeric matrix comprising the reaction product of two silicone resins;

wherein the thermally-conductive sheet exhibits a compression set of 1 to 10% and a compression force deflection of 1 to 20 psi;

wherein the compressible thermally-conductive sheet has a thermal conductivity that is at least 0.75 W/m-K;

wherein the density of the through holes is 100,000 holes per square meter to 2 million holes per square meter; and

wherein the non-foamed thermally conductive composition is free from filler particles comprising metal.

25. A compressible thermally conductive sheet having a first and second heat transfer surface and a plurality of through holes substantially transverse to the first and second heat transfer surfaces to provide a thermal pathway there between;

wherein said sheet comprises a foam polymeric pad having through holes that are filled with a non-foamed thermally conductive composition comprising about 20% to 80 by weight of dispersed thermally-conductive particulate boron nitride filler having on average a thermal conductivity of 25 to 500 W/m-K;

wherein the particular filler is dispersed in a polymeric matrix comprising the reaction product of two silicone resins, wherein the cells of the polymeric foam pad have average cell diameters of about 20 to about 500 micrometer;

wherein the thermally-conductive sheet exhibits a compression set of 1 to 10% and a compression force deflection of 1 to 20 psi;

wherein the compressible thermally-conductive sheet has a thermal conductivity that is at least 0.75 W/m-K;

wherein the density of the through holes is 100,000 holes per square meter to 2 million holes per square meter; and

wherein the non-foamed thermally conductive composition is free from filler particles comprising metal.