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Pressure-sensitive adhesive material particularly for encasing an electronic arrangement

  • US 9,631,127 B2
  • Filed: 07/04/2013
  • Issued: 04/25/2017
  • Est. Priority Date: 08/24/2012
  • Status: Active Grant
First Claim
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1. A pressure-sensitive adhesive for encapsulating an electronic arrangement with respect to permeants, comprising to an extent of at least 70 wt. % based on the overall composition of the pressure-sensitive adhesive, a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer being between 5:

  • 95 to 55;

    45.

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