Pressure-sensitive adhesive material particularly for encasing an electronic arrangement
First Claim
1. A pressure-sensitive adhesive for encapsulating an electronic arrangement with respect to permeants, comprising to an extent of at least 70 wt. % based on the overall composition of the pressure-sensitive adhesive, a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer being between 5:
- 95 to 55;
45.
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Accused Products
Abstract
Pressure-sensitive adhesive material for encasing an electronic arrangement to prevent permeate, which material comprises at least 70 percent by weight of a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, wherein the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer is between 5:95 to 55:45.
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Citations
17 Claims
- 1. A pressure-sensitive adhesive for encapsulating an electronic arrangement with respect to permeants, comprising to an extent of at least 70 wt. % based on the overall composition of the pressure-sensitive adhesive, a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer, the mass ratio of the fluorine-containing liquid elastomer to the fluorine-containing thermoplastic elastomer being between 5:
- 14. An adhesive for encapsulating an electronic arrangement with respect to permeants, which comprises a mixture of at least one fluorine-containing thermoplastic elastomer and at least one fluorine-containing liquid elastomer and also at least one tackifier resin, the adhesive comprising this mixture to an extent of at least 70 wt. %, based on the overall composition of the adhesive.
Specification